公开(公告)号：US06801431B2

公开(公告)日：2004-10-05

申请号：US10290722

申请日：2002-11-08

申请人： David J Hartke ,  Joseph T. Dibene, II ,  Edward J. Derian ,  James M. Broder

发明人： David J Hartke ,  Joseph T. Dibene, II ,  Edward J. Derian ,  James M. Broder

IPC分类号： H05K720

CPC分类号： G06F1/20 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  G06F1/206 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/7088 ,  H01R12/721 ,  H05K7/1092 ,  H01L2924/00

摘要： The present invention is described as an integrated electronic assembly. The electronic assembly comprises a heat dissipating device, a power conditioning circuit board, a power dissipating device mounted on a substrate, and a power interconnect assembly. The power conditioning circuit board includes a first side thermally coupled to the heat dissipating device, a power conditioning circuit for producing a conditioned power signal, and an aperture. The power dissipating device has a top surface thermally coupled to the heat dissipation device through an aperture. The substrate includes at least one power conductor disposed proximate at least one of the edges of the substrate. The power interconnection assembly, which electrically couples the conditioned power signal to the substrate and provides substantially all power to the substrate, includes an edge connector assembly removably coupled to the at least one edge of the substrate.

摘要翻译： 本发明被描述为集成电子组件。 电子组件包括散热装置，功率调节电路板，安装在基板上的功率耗散装置和电力互连组件。 功率调节电路板包括热耦合到散热装置的第一侧，用于产生经调节的电力信号的功率调节电路和孔。 功率耗散装置具有通过孔热耦合到散热装置的顶表面。 衬底包括靠近衬底的至少一个边缘布置的至少一个电源导体。 将经调节的功率信号电耦合到基板并且向基板提供基本上所有功率的功率互连组件包括可移除地耦合到基板的至少一个边缘的边缘连接器组件。

公开(公告)号：US06618268B2

公开(公告)日：2003-09-09

申请号：US09801437

申请日：2001-03-08

申请人： Joseph T. Dibene, II ,  David H. Hartke ,  Edward J. Derian ,  Carl E. Hoge ,  James M. Broder ,  Jose B. San Andres ,  Joseph S. Riel

发明人： Joseph T. Dibene, II ,  David H. Hartke ,  Edward J. Derian ,  Carl E. Hoge ,  James M. Broder ,  Jose B. San Andres ,  Joseph S. Riel

IPC分类号： H01R1216

CPC分类号： H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

摘要： A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface. The apparatus also comprises a second conductive member, having a second conductive member first surface electrically coupleable to the first circuit board second surface and a second conductive member second surface distal from the second conductive member first surface electrically coupleable to the second circuit board second conductive surface.

摘要翻译： 一种用于从具有第一电路板第一导电表面和第一电路板第二导电表面的第一电路板向具有第二电路板第一导电表面的第二电路板提供电力的方法，装置和制品， 描述了第二导电表面。 该装置包括第一导电构件，其包括具有电耦合到第一电路板第一导电表面的第一导电构件表面的第一端和远离第一端的第二端，具有电耦合到第二电路的第一导电构件第二表面 第一表面。 该装置还包括第二导电构件，其具有电耦合到第一电路板第二表面的第二导电构件第一表面和远离第二导电构件第一表面的第二导电构件第二表面，电耦合到第二电路板第二导电表面 。