公开(公告)号：US20100325882A1

公开(公告)日：2010-12-30

申请号：US12827732

申请日：2010-06-30

申请人： Joseph Ted DiBene, II ,  David H. Hartke ,  Carl E. Hoge ,  Edward J. Derian

发明人： Joseph Ted DiBene, II ,  David H. Hartke ,  Carl E. Hoge ,  Edward J. Derian

IPC分类号： H05K3/00

CPC分类号： H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  G06F1/20 ,  H01L23/427 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/15312 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H05K1/0206 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K1/182 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  Y10T29/49124

摘要： A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

摘要翻译： 公开了一种电源互连系统，其包括在第一电路板到第二电路板之间传递电力和接地信号的多个z轴兼容的连接器。 互连系统通过宽范围的频率提供极低的阻抗，并允许大量的电流从静电或动态从一个衬底传递到下一个衬底。 互连系统可以靠近模具定位，或者可以根据系统要求进一步远离。 互连也可用于占用两个基板之间的机械公差，同时提供低阻抗互连。

公开(公告)号：US06847529B2

公开(公告)日：2005-01-25

申请号：US10036957

申请日：2001-12-20

申请人： Joseph Ted Dibene, II ,  David H. Hartke ,  Carl E. Hoge ,  Edward J. Derian

发明人： Joseph Ted Dibene, II ,  David H. Hartke ,  Carl E. Hoge ,  Edward J. Derian

IPC分类号： G06F1/18 ,  H01L23/427 ,  H01L23/433 ,  H01R4/64 ,  H01R12/16 ,  H05K1/02 ,  H05K1/14 ,  H05K3/30 ,  H05K3/36 ,  H05K7/10 ,  H05K7/20 ,  H05K1/11

CPC分类号： H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L23/433 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15192 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7088 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036

摘要： A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

摘要翻译： 公开了一种电源互连系统，其包括在第一电路板到第二电路板之间传递电力和接地信号的多个z轴兼容的连接器。 互连系统通过宽范围的频率提供极低的阻抗，并允许大量的电流从静电或动态从一个衬底传递到下一个衬底。 互连系统可以靠近模具定位，或者可以根据系统要求进一步远离。 互连也可用于占用两个基板之间的机械公差，同时提供低阻抗互连。

公开(公告)号：US06623279B2

公开(公告)日：2003-09-23

申请号：US10132586

申请日：2002-04-25

申请人： Edward J. Derian ,  Joseph Ted DiBene, II ,  David H. Hartke

发明人： Edward J. Derian ,  Joseph Ted DiBene, II ,  David H. Hartke

IPC分类号： H01R1200

CPC分类号： G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/7088 ,  H01R12/721 ,  H05K1/0206 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/1053 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

摘要： A connector for providing power from a first circuit board to a second circuit board. The apparatus comprises a first conductive member, including a first conductive member first end and a first conductive member second end distal from the first end; a second conductive member disposed within the first conductive member, the second conductive member including a second conductor member first end and a second conductor member second end distal from the second conductor member first end; and one or more first circuit board permanent attachment features for electrical coupling with the first circuit board and second circuit board, and one or more disconnectable conduction features for electrically coupling the connector with the second circuit board.

公开(公告)号：US06801431B2

公开(公告)日：2004-10-05

申请号：US10290722

申请日：2002-11-08

申请人： David J Hartke ,  Joseph T. Dibene, II ,  Edward J. Derian ,  James M. Broder

发明人： David J Hartke ,  Joseph T. Dibene, II ,  Edward J. Derian ,  James M. Broder

IPC分类号： H05K720

CPC分类号： G06F1/20 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  G06F1/206 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/7088 ,  H01R12/721 ,  H05K7/1092 ,  H01L2924/00

摘要： The present invention is described as an integrated electronic assembly. The electronic assembly comprises a heat dissipating device, a power conditioning circuit board, a power dissipating device mounted on a substrate, and a power interconnect assembly. The power conditioning circuit board includes a first side thermally coupled to the heat dissipating device, a power conditioning circuit for producing a conditioned power signal, and an aperture. The power dissipating device has a top surface thermally coupled to the heat dissipation device through an aperture. The substrate includes at least one power conductor disposed proximate at least one of the edges of the substrate. The power interconnection assembly, which electrically couples the conditioned power signal to the substrate and provides substantially all power to the substrate, includes an edge connector assembly removably coupled to the at least one edge of the substrate.

摘要翻译： 本发明被描述为集成电子组件。 电子组件包括散热装置，功率调节电路板，安装在基板上的功率耗散装置和电力互连组件。 功率调节电路板包括热耦合到散热装置的第一侧，用于产生经调节的电力信号的功率调节电路和孔。 功率耗散装置具有通过孔热耦合到散热装置的顶表面。 衬底包括靠近衬底的至少一个边缘布置的至少一个电源导体。 将经调节的功率信号电耦合到基板并且向基板提供基本上所有功率的功率互连组件包括可移除地耦合到基板的至少一个边缘的边缘连接器组件。

公开(公告)号：US07881072B2

公开(公告)日：2011-02-01

申请号：US11502682

申请日：2006-08-11

申请人： Joseph Ted Dibene, II ,  David H. Hartke ,  Carl E. Hoge ,  Edward J. Derian

发明人： Joseph Ted Dibene, II ,  David H. Hartke ,  Carl E. Hoge ,  Edward J. Derian

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  G06F1/20 ,  H01L23/427 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/15312 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H05K1/0206 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K1/182 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  Y10T29/49124

摘要： A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

摘要翻译： 公开了一种电源互连系统，其包括在第一电路板到第二电路板之间传递电力和接地信号的多个z轴兼容的连接器。 互连系统通过宽范围的频率提供极低的阻抗，并允许大量的电流从静电或动态从一个衬底传递到下一个衬底。 互连系统可以靠近模具定位，或者可以根据系统要求进一步远离。 互连也可用于占用两个基板之间的机械公差，同时提供低阻抗互连。

公开(公告)号：US07167379B2

公开(公告)日：2007-01-23

申请号：US10428202

申请日：2003-04-30

申请人： Joseph T. DiBene, II ,  Edward J. Derian

发明人： Joseph T. DiBene, II ,  Edward J. Derian

IPC分类号： H01R12/16

CPC分类号： H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L2924/15192 ,  H05K1/141 ,  H05K3/368 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704

摘要： An assembly includes an electronic assembly with a microprocessor coupled to a power conversion assembly via a compliant conductor assembly. The compliant conductor assembly includes a plurality of spring conductors mounted in a carrier. Selected ones of the spring conductors are electromagnetically coupled with others of the spring conductors. Additionally, each spring conductor provides multiple conductive paths.

摘要翻译： 组件包括具有微处理器的电子组件，该微处理器通过柔性导体组件耦合到功率转换组件。 柔性导体组件包括安装在载体中的多个弹簧导体。 所选择的弹簧导体与其他弹簧导体电磁耦合。 另外，每个弹簧导体提供多个导电路径。

公开(公告)号：US06618268B2

公开(公告)日：2003-09-09

申请号：US09801437

申请日：2001-03-08

申请人： Joseph T. Dibene, II ,  David H. Hartke ,  Edward J. Derian ,  Carl E. Hoge ,  James M. Broder ,  Jose B. San Andres ,  Joseph S. Riel

发明人： Joseph T. Dibene, II ,  David H. Hartke ,  Edward J. Derian ,  Carl E. Hoge ,  James M. Broder ,  Jose B. San Andres ,  Joseph S. Riel

IPC分类号： H01R1216

CPC分类号： H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

摘要： A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface. The apparatus also comprises a second conductive member, having a second conductive member first surface electrically coupleable to the first circuit board second surface and a second conductive member second surface distal from the second conductive member first surface electrically coupleable to the second circuit board second conductive surface.

摘要翻译： 一种用于从具有第一电路板第一导电表面和第一电路板第二导电表面的第一电路板向具有第二电路板第一导电表面的第二电路板提供电力的方法，装置和制品， 描述了第二导电表面。 该装置包括第一导电构件，其包括具有电耦合到第一电路板第一导电表面的第一导电构件表面的第一端和远离第一端的第二端，具有电耦合到第二电路的第一导电构件第二表面 第一表面。 该装置还包括第二导电构件，其具有电耦合到第一电路板第二表面的第二导电构件第一表面和远离第二导电构件第一表面的第二导电构件第二表面，电耦合到第二电路板第二导电表面 。

公开(公告)号：US06556455B2

公开(公告)日：2003-04-29

申请号：US10022454

申请日：2001-10-30

申请人： Joseph T. Dibene, II ,  David H. Hartke ,  Carl E. Hoge ,  Edward J. Derian

发明人： Joseph T. Dibene, II ,  David H. Hartke ,  Carl E. Hoge ,  Edward J. Derian

IPC分类号： H01R1216

CPC分类号： H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7088 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2036 ,  H01L2924/00

摘要： A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.

摘要翻译： 公开了一种电源互连系统，其包括在第一电路板到第二电路板之间传递电力和接地信号的多个z轴兼容的连接器。 互连系统通过宽范围的频率提供极低的阻抗，并且允许大量的电流从一个基板静态或动态地从一个基板传递到下一个基板。 互连系统可以靠近模具定位，或者可以根据系统要求进一步远离。 互连也可用于占用两个基板之间的机械公差，同时提供低阻抗互连。

公开(公告)号：US06352482B1

公开(公告)日：2002-03-05

申请号：US09652491

申请日：2000-08-31

申请人： Daniel R. Jacobson ,  Herbert Reyes ,  Ronald K. Hettinger ,  J. Andrew Galloway ,  Paul D. Zanolli ,  Andrew J. Goodjohn ,  Peter L. Soracco ,  Edward J. Derian

发明人： Daniel R. Jacobson ,  Herbert Reyes ,  Ronald K. Hettinger ,  J. Andrew Galloway ,  Paul D. Zanolli ,  Andrew J. Goodjohn ,  Peter L. Soracco ,  Edward J. Derian

IPC分类号： A63B5302

CPC分类号： A63B53/00 ,  A63B53/02 ,  A63B60/00

摘要： A golf club (20) with an internal hosel (38), a shaft (40) and a hosel liner (50) is disclosed herein. The hosel liner (50) reduces axial stress on the shaft (40) during impact of the golf club (20) with a golf ball. The hosel liner (50) is preferably composed of a polycarbonate material that has a flexural modulus in the range of 300,000 pounds per square inch to 1,000,000 pounds per square inch. Preferably, the golf club head (22) has a large volume, greater than 300 cubic centimeters, and weighs less than 215 grams. Preferably, the shaft (40) is composed of graphite and weighs between 40 grams to 80 grams.

摘要翻译： 本文公开了一种具有内部插鞘（38），轴（40）和插鞘衬垫（50）的高尔夫球杆（20）。 在高尔夫球杆（20）与高尔夫球碰撞期间，球杆衬套（50）减小轴（40）上的轴向应力。 插鞘衬套（50）优选由聚碳酸酯材料组成，该聚碳酸酯材料的弯曲模量在30万磅/平方英寸至1,000,000磅/平方英寸的范围内。 优选地，高尔夫球杆头（22）具有大的体积，大于300立方厘米，重量小于215克。 优选地，轴（40）由石墨组成，重量在40克到80克之间。