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    Directional Extruded Bead Control
    2.
    发明申请
    Directional Extruded Bead Control 有权
    定向挤压珠控制

    公开(公告)号：US20100116199A1

    公开(公告)日：2010-05-13

    申请号：US12267069

    申请日：2008-11-07

    申请人： David K. Fork ,  Scott E. Solberg

    发明人： David K. Fork ,  Scott E. Solberg

    IPC分类号： B05C1/00

    CPC分类号： H01L21/6715 ,  B29C47/0002 ,  B29C47/0016 ,  B29C47/026 ,  B29C47/062 ,  B29C47/084 ,  B29C47/128 ,  B29L2031/06 ,  B81B2207/07 ,  B81C99/0015

    摘要： A micro-extrusion printhead assembly utilized in a micro-extrusion system to form parallel extruded lines of material on a substrate includes a material feed system for pushing/drawing materials out of extrusion nozzles defined in the printhead assembly, a Z-axis positioning mechanism, and a base. The micro-extrusion printhead includes a layered nozzle structure sandwiched between back and front plate structures. The layered nozzle structure includes stacked plates including top and bottom nozzle plates sandwiching a nozzle outlet plate. According to various embodiments, at least one of the nozzle structure materials of the printhead assembly, the output geometry of the printhead assembly, and the internal conduit geometry of the printhead assembly are modified to cause the bead traveling through the extrusion nozzle to be reliably directed (biased) toward the target substrate as it leaves the printhead nozzle orifice.

    摘要翻译： 用于微挤出系统中的微挤出打印头组件在基板上形成平行的挤出生产线材料包括用于将材料推出/拉出定出在打印头组件中的挤出喷嘴的材料进给系统，Z轴定位机构， 和一个基地。 微挤出打印头包括夹在后板结构和前板结构之间的分层喷嘴结构。 分层喷嘴结构包括堆叠板，其包括夹着喷嘴出口板的顶部和底部喷嘴板。 根据各种实施例，打印头组件的喷嘴结构材料，打印头组件的输出几何形状和打印头组件的内部导管几何形状中的至少一个被修改，以使得通过挤出喷嘴行进的珠子被可靠地定向 （偏压）朝着目标基板离开打印头喷嘴孔。

    OBLIQUE ANGLE MICROMACHINING OF FLUIDIC STRUCTURES
    5.
    发明申请
    OBLIQUE ANGLE MICROMACHINING OF FLUIDIC STRUCTURES 有权
    流体结构的偏心角度微观结构

    公开(公告)号：US20120193023A1

    公开(公告)日：2012-08-02

    申请号：US13019246

    申请日：2011-02-01

    申请人： David K. Fork ,  Scott E. Solberg

    发明人： David K. Fork ,  Scott E. Solberg

    IPC分类号： B32B38/10 ,  B29C47/12

    CPC分类号： B32B38/10 ,  B29C47/0002 ,  B29C47/0021 ,  B29C47/06 ,  B29C47/0883 ,  B29C47/128 ,  B29C47/705 ,  B29C47/707 ,  Y10T156/1082

    摘要： An extrusion device has a stack of at least two layers, the stack including an outlet, an inlet for a first material, and a feed channel for the first material arranged to fluidically connect to the inlet for the first material, the feed channel having a sloped end. A method of manufacturing an extrusion device includes forming an outlet, an inlet for a first material and a feed channel for the first material having a sloped end in a stack of layers, aligning the stack of layers to fluidically connect the feed channel for the first material with the inlet for the first material and to fluidically connect the inlet for the first material with the outlet, and bonding the layers together.

    摘要翻译： 挤出装置具有至少两层的堆叠，所述堆叠包括出口，用于第一材料的入口和用于第一材料的进料通道，其布置成流体连接到用于第一材料的入口，所述进料通道具有 倾斜的一端 制造挤出装置的方法包括形成出口，用于第一材料的入口和用于第一材料的进料通道，所述第一材料在层叠中具有倾斜的端部，使层叠体对准以流体连接用于第一材料的进料通道 材料，其具有用于第一材料的入口并且将第一材料的入口与出口流体连接，并将层粘合在一起。

    METHOD FOR FABRICATING A SEMICONDUCTOR SUBSTRATE WITH A CO-PLANAR BACKSIDE METALLIZATION STRUCTURE
    6.
    发明申请
    METHOD FOR FABRICATING A SEMICONDUCTOR SUBSTRATE WITH A CO-PLANAR BACKSIDE METALLIZATION STRUCTURE 审中-公开
    用于制备具有CO平面背面金属化结构的半导体衬底的方法

    公开(公告)号：US20120129342A1

    公开(公告)日：2012-05-24

    申请号：US13365278

    申请日：2012-02-03

    申请人： Kenta Nakayashiki ,  David K. Fork ,  Scott E. Solberg

    发明人： Kenta Nakayashiki ,  David K. Fork ,  Scott E. Solberg

    IPC分类号： H01L21/28

    CPC分类号： H01L31/022425 ,  H01L31/068 ,  H01L31/0682 ,  H01L31/18 ,  Y02E10/547

    摘要： A method for fabricating a backside metallization structure on a semiconductor substrate including moving a printhead having at least one nozzle orifice relative to the semiconductor substrate, and feeding an Al passivation layer ink and an AgAl soldering pad ink through said printhead such that both said Al passivation layer ink and said AgAl soldering pad ink are simultaneously extruded from said at least one nozzle orifice and deposited onto the semiconductor substrate.

    摘要翻译： 一种用于在半导体衬底上制造背面金属化结构的方法，包括移动具有相对于半导体衬底的至少一个喷嘴孔的打印头，以及通过所述打印头供给Al钝化层油墨和AgAl焊盘油墨，使得所述Al钝化 同时从所述至少一个喷嘴孔挤出所述AgAl焊盘油墨并将其沉积到半导体衬底上。

    Solar Cell With Structured Gridline Endpoints And Vertices
    7.
    发明申请
    Solar Cell With Structured Gridline Endpoints And Vertices 失效
    具有结构化网格线端点和顶点的太阳能电池

    公开(公告)号：US20120052191A1

    公开(公告)日：2012-03-01

    申请号：US12873473

    申请日：2010-09-01

    申请人： David K. Fork ,  Scott E. Solberg

    发明人： David K. Fork ,  Scott E. Solberg

    IPC分类号： B05D5/12 ,  B05C9/00

    CPC分类号： H01L31/022425 ,  B05C5/0212 ,  B05C5/0254 ,  B05C5/027 ,  B05C5/0291 ,  H01L31/18 ,  Y02E10/50

    摘要： A micro-extrusion printhead assembly utilized in a micro-extrusion system to form parallel extruded lines of material on a substrate includes a material feed mechanism for pushing/drawing materials out of dispensing orifices defined in the printhead assembly, a Z-axis positioning mechanism, and a base. A production method utilizes the micro-extrusion system to directly print endpoint structures at the end of each gridline, and by extruding these gridlines immediately after forming the busbars. In accordance with an embodiment of the invention, the micro-extrusion system is controlled to manipulate the printhead speed and/or gridline material extrusion pressure at the beginning, middle and end of each gridline printing process such that teardrop-shaped endpoint structures are formed at the ends of each gridline, whereby each endpoint structure has a substantially greater width than that of the main “central” gridline structure extending between the endpoint structures.

    摘要翻译： 用于微挤出系统中的微挤出打印头组件在基板上形成平行的挤出生产线材料包括用于将材料推出/拉出定出在打印头组件中的分配孔的材料进给机构，Z轴定位机构， 和一个基地。 一种生产方法利用微挤压系统在每个网格线的末端直接打印端点结构，并在形成母线之后立即挤压这些网格线。 根据本发明的实施例，控制微挤压系统以在每个网格线印刷过程的开始，中间和结束处操纵打印头速度和/或网格线材料挤出压力，使得泪珠形端点结构形成在 每个网格线的端部，由此每个端点结构具有比在端点结构之间延伸的主“中心”网格线结构的宽度大得多的宽度。

    Solar Cell With Co-Planar Backside Metallization
    8.
    发明申请
    Solar Cell With Co-Planar Backside Metallization 审中-公开
    太阳能电池与共平面背面金属化

    公开(公告)号：US20100139754A1

    公开(公告)日：2010-06-10

    申请号：US12331284

    申请日：2008-12-09

    申请人： Kenta Nakayashiki ,  David K. Fork ,  Scott E. Solberg

    发明人： Kenta Nakayashiki ,  David K. Fork ,  Scott E. Solberg

    IPC分类号： H01L31/00 ,  H01L21/00

    CPC分类号： H01L31/022425 ,  H01L31/068 ,  H01L31/0682 ,  H01L31/18 ,  Y02E10/547

    摘要： A solar cell includes two backside metallization materials that are simultaneously extrusion deposited on a semiconductor substrate such that both a back surface field (BSF) metal layer (e.g., Al) and a solder pad metal structure (e.g., AgAl) are coplanar and non-overlapping, and the two metals abut each other to form a continuous metal layer that extends over the backside surface of the substrate. In one embodiment, the solder pad metal is formed directly on the backside surface of the substrate, either by co-extruding the two materials in the form of a continuous sheet, or by depositing spaced apart structures that are then flattened to contact each other by way of an air jet device. In another embodiment, the solder pad metal is disposed over a thin layer of the BSF metal (i.e., either disposed directly on the BSF metal, or disposed on an intervening barrier layer) using a co-extrusion head.

    摘要翻译： 太阳能电池包括两个背面金属化材料，其同时挤出沉积在半导体衬底上，使得后表面场（BSF）金属层（例如，Al）和焊盘金属结构（例如，AgAl）都是共面和非平面的， 并且两个金属彼此邻接以形成在衬底的背面延伸的连续金属层。 在一个实施例中，焊盘金属直接形成在衬底的背面上，或者通过将两种材料以连续片材的形式共挤出，或者通过沉积间隔开的结构，然后被平坦化以相互接触，从而通过 喷气装置的方式。 在另一个实施例中，使用共挤出头将焊垫金属设置在BSF金属的薄层上（即，直接设置在BSF金属上，或者设置在中间阻挡层上）。

    Solar cell with structured gridline endpoints vertices
    9.
    发明授权
    Solar cell with structured gridline endpoints vertices 有权
    具有结构化网格线端点顶点的太阳能电池

    公开(公告)号：US08704086B2

    公开(公告)日：2014-04-22

    申请号：US12873709

    申请日：2010-09-01

    申请人： David K. Fork ,  Scott E. Solberg

    发明人： David K. Fork ,  Scott E. Solberg

    IPC分类号： H01L31/0224

    CPC分类号： H01L21/6715 ,  H01L31/022425 ,  Y02E10/50

    摘要： An H-pattern solar cell structure includes at least one busbar disposed in a first direction on an upper surface of a semiconductor substrate, and parallel gridlines formed on the semiconductor substrate such that each gridline extends over and contacts each busbar, wherein each gridline includes a central gridline portion and at least one endpoint structure disposed on at least one end thereof, the endpoint structure having a nominal width that is at least 1.5 times the width of the central gridline portion. The gridlines are co-extruded with a sacrificial material such that a base portion of each gridline forms a flattened structure with sacrificial material formed thereon. The endpoint structures are formed such that Each central gridline portion forms a raised vertex portion extending upward from the upper surface of each busbar.

    摘要翻译： H图案太阳能电池结构包括在半导体衬底的上表面上沿第一方向布置的至少一个母线和形成在半导体衬底上的并联栅格线，使得每个栅格线延伸并接触每个母线，其中每个栅格线包括 中央网格线部分和至少一个端点结构，其设置在其至少一个端部上，该端点结构的标称宽度为中心网格线部分的宽度的至少1.5倍。 网格线与牺牲材料共挤出，使得每个网格线的基部形成其上形成有牺牲材料的扁平结构。 端点结构形成为使得每个中心网格线部分形成从每个母线的上表面向上延伸的凸起的顶点部分。