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22 条记录 (耗时 0.042 秒)

    Contact Level Mask Layouts By Introducing Anisotropic Sub-Resolution Assist Features
    6.
    发明申请
    Contact Level Mask Layouts By Introducing Anisotropic Sub-Resolution Assist Features 审中-公开
    通过引入各向异性分解辅助功能的接触层面罩布局

    公开(公告)号：US20090191468A1

    公开(公告)日：2009-07-30

    申请号：US12021527

    申请日：2008-01-29

    申请人： Michael M. Crouse ,  Derren N. Dunn ,  Henning Haffner ,  Michael E. Scaman

    发明人： Michael M. Crouse ,  Derren N. Dunn ,  Henning Haffner ,  Michael E. Scaman

    IPC分类号： G03F1/00

    CPC分类号： G03F1/36

    摘要： This disclosure includes a SRAF layout that minimizes the number of SRAFs required to reliably print contact shapes. A method is provided that reduces the number of necessary SRAF features on a mask, placing at least two elongated SRAF shapes on the mask such that the elongated SRAF shapes extend past at least one edge of a mask shape in at least one direction.

    摘要翻译： 本公开包括SRAF布局，其最小化可靠地打印接触形状所需的SRAF的数量。 提供了一种减少掩模上必要的SRAF特征的数量的方法，在掩模上放置至少两个细长的SRAF形状，使得细长SRAF形状延伸经过至少一个方向上的掩模形状的至少一个边缘。

    ITERATIVE METHOD FOR REFINING INTEGRATED CIRCUIT LAYOUT USING COMPASS OPTICAL PROXIMITY CORRECTION (OPC)
    7.
    发明申请
    ITERATIVE METHOD FOR REFINING INTEGRATED CIRCUIT LAYOUT USING COMPASS OPTICAL PROXIMITY CORRECTION (OPC) 有权
    使用对比度校正（OPC）进行整合电路布局的迭代方法

    公开(公告)号：US20080141203A1

    公开(公告)日：2008-06-12

    申请号：US12033102

    申请日：2008-02-19

    申请人： Michael E. Scaman

    发明人： Michael E. Scaman

    IPC分类号： G06F17/50

    CPC分类号： G03F1/36

    摘要： The present invention is an iterative method or procedure involving a series of optical proximity correction (OPC) process steps for refining an integrated circuit design layout on a wafer during a photolithographic process. The iterative method may be applied as a system and computer program to perform classifying and grouping edge fragments according to directional orientations, selecting an edge fragment or a combination of non-opposing edge fragments, calculating an edge placement error of the selected edge fragment and proximally shifting the edge fragment until a quality limitation is met.

    摘要翻译： 本发明是一种迭代方法或程序，涉及一系列光学邻近校正（OPC）处理步骤，用于在光刻工艺期间精炼晶片上的集成电路设计布局。 迭代方法可以应用为系统和计算机程序，以根据方向取向，选择边缘片段或非相对边缘片段的组合来分类和分组边缘片段，计算所选边缘片段的边缘放置误差和近端 移动边缘片段直到满足质量限制。

    Method and apparatus for locating power plane shorts using polarized light microscopy
    9.
    发明授权
    Method and apparatus for locating power plane shorts using polarized light microscopy 失效
    使用偏光显微镜定位电源平面短路的方法和装置

    公开(公告)号：US6141093A

    公开(公告)日：2000-10-31

    申请号：US139515

    申请日：1998-08-25

    申请人： Bernell E. Argyle ,  Arnold Halperin ,  Michael E. Scaman ,  Edward J. Yarmchuk

    发明人： Bernell E. Argyle ,  Arnold Halperin ,  Michael E. Scaman ,  Edward J. Yarmchuk

    IPC分类号： G01N21/21 ,  G01R31/311 ,  G01N21/00 ,  G01R27/14

    CPC分类号： G01N21/21 ,  G01R31/311

    摘要： An apparatus and corresponding method for detecting, locating, or defining a short in a thin-film module. The apparatus includes a mechanical fixture supporting the module. A current source provides a current pulse to the module which produces a magnetic field and heating nearby the short which turns on and off as the pulsed current in the short turns on and off. Polarized light is directed onto the module, with an intermediate element disposed between the module and the source of the polarized light. The intermediate element may be a stress birefringent coating (e.g., a polyimide insulating layer) disposed on the module and onto which the polarized light is directed. The sample is rotated 0 to 45 degrees to maximize the birefringent effect. Alternatively, the intermediate element may be a magneto-optical Faraday rotator. A microscope is used to observe the module, facilitating identification of a short by the twisting of the polarization of the light as the short expands and shrinks in response to the heating or in response to the localized magnetic field. The preferred rotator is a composite having a garnet substrate, an iron garnet film disposed on the substrate, and a thin aluminum mirror layer disposed on the iron garnet film. The apparatus and method of the present invention have several applications.

    摘要翻译： 一种用于检测，定位或限定薄膜模块中的短路的装置和相应方法。 该装置包括支撑模块的机械夹具。 电流源向模块提供电流脉冲，其产生磁场并在短路附近加热，其短路中的脉冲电流接通和断开时导通和截止。 偏振光被引导到模块上，中间元件设置在模块和偏振光源之间。 中间元件可以是设置在模块上并且偏振光被引导到其上的应力双折射涂层（例如，聚酰亚胺绝缘层）。 样品旋转0至45度以最大化双折射效应。 或者，中间元件可以是磁光法拉第旋转器。 使用显微镜来观察模块，通过随着短路的扩展和响应于加热或响应于局部磁场而收缩，通过扭转光的偏振来促进短路的识别。 优选的旋转体是具有石榴石基材，设置在基材上的铁石榴石薄膜和设置在铁石榴石薄膜上的薄铝镜面层的复合体。 本发明的装置和方法有几个应用。

    Method and apparatus for detecting shorts in a multi-layer electronic package
    10.
    发明授权
    Method and apparatus for detecting shorts in a multi-layer electronic package 失效
    用于检测多层电子封装中的短路的方法和装置

    公开(公告)号：US5821759A

    公开(公告)日：1998-10-13

    申请号：US807076

    申请日：1997-02-27

    申请人： Michael E. Scaman ,  Edward J. Yarmchuk ,  Yuet-Ying Yu

    发明人： Michael E. Scaman ,  Edward J. Yarmchuk ,  Yuet-Ying Yu

    IPC分类号： G01R1/073 ,  G01R31/02 ,  G01R31/28

    CPC分类号： G01R31/281 ,  G01R1/07314 ,  G01R31/025

    摘要： A method and apparatus for locating shorts in multi-layer electronic packages during manufacture allows repair of the shorts and improved yields of the packages. A multi-layer package is fitted in a fixture after forming a thin film layer of metalization, and test is performed to detect shorts in the package. If a short is detected, a low current, high frequency signal is injected in pins on a bottom surface of the package. An approximate two dimensional location of the short is sensed by detecting an electromagnetic force induced by a magnetic field inductively coupled to a sensor proximate to the short on a top surface of the multi-layer package. The approximate location of the short is then inspected to precisely locate the short.

    摘要翻译： 在制造期间用于定位多层电子封装中的短路的方法和装置允许修复短路并提高封装的产量。 在形成金属化薄膜层之后，在夹具中装配多层封装，并进行测试以检测封装中的短路。 如果检测到短路，则将低电流，高频信号注入到封装底表面的引脚中。 通过检测由感应耦合到靠近多层封装的顶表面上的短路的传感器的磁场感应的电磁力来感测短路的近似二维位置。 然后检查短路的大致位置以精确定位短路。