-
公开(公告)号：US07394666B2
公开(公告)日：2008-07-01
申请号：US10904276
申请日：2004-11-02
IPC分类号： H05K1/11
CPC分类号： H05K7/142
摘要： A cam-action expanding standoff connector and related method are disclosed for mounting a circuit board. The standoff connector includes a body and a plurality of mounting members having interior longitudinally-extending camming portions for engagement by a cam. A cam is configured to be positioned within the mounting members in a first position in which the mounting members are not expanded against the interior of a mounting opening and in a second position in which the cam engages the camming portions to expand the plurality of mounting members against the interior of the mounting opening. Since the camming action is horizontal only (purely radial), practically no vertical forces are applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be established and maintained.
摘要翻译： 公开了一种用于安装电路板的凸轮动作扩展型支座连接器及相关方法。 支座连接器包括主体和多个安装构件，其具有用于由凸轮接合的内部纵向延伸的凸轮部分。 凸轮构造成在安装构件内定位在第一位置，在第一位置，安装构件不会抵靠安装开口的内部膨胀，并且在第二位置中凸轮接合凸轮部分以使多个安装构件 抵靠安装开口的内部。 由于凸轮作用仅仅是水平的（纯径向的），实际上没有垂直力施加到电路板上，并且可以建立和维持电路板和散热器之间的最佳配合。
-
2.发明授权Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip 有权用于保持冷却板/散热器和微芯片之间的接触的挠曲板公开(公告)号：US07239516B2
公开(公告)日：2007-07-03
申请号：US10939230
申请日：2004-09-10
申请人： David C. Long , Glenn G. Daves , David L. Edwards , Ronald L. Hering , Sushumna Iruvanti , Kenneth C. Marston , Jason S. Miller
发明人： David C. Long , Glenn G. Daves , David L. Edwards , Ronald L. Hering , Sushumna Iruvanti , Kenneth C. Marston , Jason S. Miller
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A flexible plate for securing a microchip surface to the surface of a cooling device. The flexible plate allows for z-directional movement between the microchip subassembly having a circuit board and a semiconductor substrate, and the cooling device. The flexible plate is a compact, single piece design that provides constraints in alignment in the x-, y-, and theta-directions, while allowing for z-direction compliance and tilt compliance. The flexible plate has tabs for mounting the microchip subassembly and tabs for mounting the cooling device. The microchip tabs are opposite one another and the cooling device mounting tabs are opposite one another. The flexible plate is a one-piece construction made from sheet metal, plastic, or metal castings. The flexible plate has a band with all the tabs mounted on the inside of the band, or one set of tabs mounted on the outside of the band.
摘要翻译： 用于将微芯片表面固定到冷却装置的表面的柔性板。 柔性板允许具有电路板的微芯片组件和半导体衬底之间的z方向运动以及冷却装置。 柔性板是一种紧凑的单件设计，可在x轴，y轴和θ轴方向上对齐，同时允许z方向顺应性和倾斜顺应性。 柔性板具有用于安装用于安装冷却装置的微芯片组件和突出部的突片。 微芯片接头彼此相对，并且冷却装置安装接头彼此相对。 柔性板是由金属板，塑料或金属铸件制成的一体式结构。 柔性板具有带子，其中所有突片安装在带的内部，或者一组安装在带的外侧上的突片。
-
公开(公告)号：US07086896B2
公开(公告)日：2006-08-08
申请号：US10904198
申请日：2004-10-28
IPC分类号： H01R13/73
CPC分类号： H05K7/142
摘要： An expanding standoff connector is disclosed including a collar having a slit through a wall of the collar, a tapered interior surface and an exterior surface configured to engage an interior of a mounting opening of the circuit board. A fastener including a threaded portion and a substantially cone shaped portion configured to mate with the tapered interior surface of the collar is placed within the collar and advanced to expand the collar to mount the circuit board. A related method for mounting a circuit board is also disclosed. Since the expansion is horizontal only (purely radial), a more uniform radial expansion from top-to-bottom of the collar is applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be maintained.
摘要翻译： 公开了一种扩展的支座连接器，其包括具有通过套环的壁的狭缝的套环，锥形内表面和被配置为接合电路板的安装开口的内部的外表面。 包括螺纹部分和构造成与套环的锥形内表面配合的基本锥形部分的紧固件被放置在套环内并且前进以扩展套环以安装电路板。 还公开了一种用于安装电路板的相关方法。 由于膨胀仅是水平的（纯径向），所以从电路板的顶部到底部的更均匀的径向膨胀被施加到电路板上，并且可以保持电路板和散热器之间的最佳匹配对准。
-
公开(公告)号：US20080232072A1
公开(公告)日：2008-09-25
申请号：US12131352
申请日：2008-06-02
CPC分类号： H05K7/142
摘要： A cam-action expanding standoff connector and related method are disclosed for mounting a circuit board. The standoff connector includes a body and a plurality of mounting members having interior longitudinally-extending camming portions for engagement by a cam. A cam is configured to be positioned within the mounting members in a first position in which the mounting members are not expanded against the interior of a mounting opening and in a second position in which the cam engages the camming portions to expand the plurality of mounting members against the interior of the mounting opening. Since the camming action is horizontal only (purely radial), practically no vertical forces are applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be established and maintained.
摘要翻译： 公开了一种用于安装电路板的凸轮动作扩展型支座连接器及相关方法。 支座连接器包括主体和多个安装构件，其具有用于由凸轮接合的内部纵向延伸的凸轮部分。 凸轮构造成在安装构件内定位在第一位置，在第一位置，安装构件不会抵靠安装开口的内部膨胀，并且在第二位置中凸轮接合凸轮部分以使多个安装构件 抵靠安装开口的内部。 由于凸轮作用仅仅是水平的（纯径向的），实际上没有垂直力施加到电路板上，并且可以建立和维持电路板和散热器之间的最佳配合。
-
公开(公告)号：US20080073765A1
公开(公告)日：2008-03-27
申请号：US11535740
申请日：2006-09-27
IPC分类号： H01L23/02
CPC分类号： H05K3/325 , H05K1/0271 , H05K3/0058 , H05K2201/10719 , H05K2201/2009 , H05K2203/074
摘要： An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip module by a land grid array (LGA) connector, a metal stiffener including a fluid-based pressure compensator contacting an underside of the PCB, and at least two couplers for coupling the metal stiffener to the chip module, with the PCB and the LGA connector therebetween. The fluid-based pressure compensator automatically compensates for natural and non-systematic out-of flatness tolerances of the PCB and the chip module, and non-uniform thickness of the PCB while creating a substantially uniform contact force on the LGA.
摘要翻译： 公开了一种IC芯片封装及相关方法。 IC芯片封装可以包括通过平面栅格阵列（LGA）连接器耦合到芯片模块的印刷电路板（PCB），包括接触PCB底部的基于流体的压力补偿器的金属加强件和至少两个耦合器 用于将金属加强件耦合到芯片模块，其中PCB和LGA连接器在其间。 基于流体的压力补偿器自动补偿PCB和芯片模块的自然和非系统的平坦度公差以及PCB的不均匀厚度，同时在LGA上产生基本上均匀的接触力。
-
公开(公告)号：US07687894B2
公开(公告)日：2010-03-30
申请号：US11535740
申请日：2006-09-27
IPC分类号： H01L23/02
CPC分类号： H05K3/325 , H05K1/0271 , H05K3/0058 , H05K2201/10719 , H05K2201/2009 , H05K2203/074
摘要： An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip module by a land grid array (LGA) connector, a metal stiffener including a fluid-based pressure compensator contacting an underside of the PCB, and at least two couplers for coupling the metal stiffener to the chip module, with the PCB and the LGA connector therebetween. The fluid-based pressure compensator automatically compensates for natural and non-systematic out-of flatness tolerances of the PCB and the chip module, and non-uniform thickness of the PCB while creating a substantially uniform contact force on the LGA.
摘要翻译： 公开了一种IC芯片封装及相关方法。 IC芯片封装可以包括通过平面栅格阵列（LGA）连接器耦合到芯片模块的印刷电路板（PCB），包括接触PCB底部的基于流体的压力补偿器的金属加强件和至少两个耦合器 用于将金属加强件耦合到芯片模块，其中PCB和LGA连接器在其间。 基于流体的压力补偿器自动补偿PCB和芯片模块的自然和非系统的平坦度公差以及PCB的不均匀厚度，同时在LGA上产生基本上均匀的接触力。
-
公开(公告)号：US07118385B1
公开(公告)日：2006-10-10
申请号：US11162779
申请日：2005-09-22
IPC分类号： H01R12/00
CPC分类号： H05K7/1061
摘要： A self-aligning socket for an integrated circuit package includes an outer frame and an array of contacts configured for alignment with corresponding conductive pads on the bottom of the integrated circuit package. The outer frame further includes a first plurality of alignment ball bearings configured thereon, the ball bearings mounted on cantilevered spring rods.
摘要翻译： 用于集成电路封装的自对准插座包括外框架和触头阵列，其被配置为与集成电路封装的底部上的对应导电焊盘对准。 外框架还包括构造在其上的第一多个对准球轴承，球轴承安装在悬臂弹簧杆上。
-
公开(公告)号：US07045011B2
公开(公告)日：2006-05-16
申请号：US10604257
申请日：2003-07-07
IPC分类号： B05B15/04
CPC分类号： H05K3/1233 , H05K2203/0126
摘要： An integrated circuit screen printing nozzle that has a nozzle body, a first inner layer on the nozzle body, a second outer layer on the first layer, and an opening through the nozzle body, the first layer, and the second layer. The first and second layers can be an insert held within the body. The opening allows paste material to flow through the screen printing nozzle to the stencil mask. Also, the second outer layer includes a contact surface adapted to contact the stencil mask. One feature of the invention is that the first layer is softer (has a lower durometer) than the second layer. This allows the second layer to be more durable than the first layer and for the first layer to provide additional flexibility to the second layer. Therefore, the invention provides a nozzle that has the high durability characteristics of a hard outer surface with the compliance of a soft nozzle.
摘要翻译： 一种集成电路丝网印刷喷嘴，其具有喷嘴体，所述喷嘴体上的第一内层，所述第一层上的第二外层，以及通过所述喷嘴体，所述第一层和所述第二层的开口。 第一和第二层可以是保持在体内的插入物。 该开口允许糊料材料通过丝网印刷喷嘴流到模板掩模。 此外，第二外层包括适于接触模板掩模的接触表面。 本发明的一个特征是第一层比第二层更软（具有较低的硬度）。 这允许第二层比第一层更耐用，并且第一层为第二层提供额外的灵活性。 因此，本发明提供了一种具有柔软喷嘴的柔软性的硬外表面的高耐久性特性的喷嘴。
-
公开(公告)号：US07350423B2
公开(公告)日：2008-04-01
申请号：US10707812
申请日：2004-01-14
申请人： David C. Long , Jason S. Miller
发明人： David C. Long , Jason S. Miller
IPC分类号： G01F1/38
CPC分类号： G05D7/0676
摘要： A dispensing system for feeding paste through a screen onto a workpiece monitors the position of a piston applying pressure to the paste with a linear variable differential transformer and sets limits on the slope of the piston displacement is a measure of the feed rate and the “spring back” of the piston when pressure is released, as a measure of trapped air in the system.
摘要翻译： 用于通过筛网将浆料输送到工件上的分配系统利用线性可变差动变压器监测活塞向浆料施加压力的位置，并且将活塞位移的斜率限制为进给速率的量度，而“弹簧 压力释放时活塞的“返回”作为系统中被捕获的空气的量度。
-
公开(公告)号：US07436057B2
公开(公告)日：2008-10-14
申请号：US11162389
申请日：2005-09-08
CPC分类号： H01L23/4093 , H01L23/16 , H01L2224/16 , H01L2224/32014 , H01L2224/73253 , H01L2924/01005 , H01L2924/01033 , H01L2924/14 , H01L2924/15787 , H01L2924/16152 , H01L2924/00
摘要： An electronic module and a method of assembling the electronic module. A circuit board is connected to a chip substrate by an array of connectors, and a base member is on the side of the circuit board away from the chip substrate and connector array. An elastomeric structure is placed between the circuit board and the base member. The elastomeric structure has voids between a first defining plane adjacent the circuit board and a second defining plane adjacent the base member, with the voids adapted to permit local deformation of elastomeric material in the structure. The method includes applying a compressive force between the circuit board and base member to at least partially compressing the elastomeric structure to improve load equalization on the circuit board.
摘要翻译： 电子模块和组装电子模块的方法。 电路板通过连接器阵列连接到芯片基板，并且基座部件位于电路板的远离芯片基板和连接器阵列的一侧。 弹性体结构被放置在电路板和基底构件之间。 弹性体结构在邻近电路板的第一限定平面和邻近基底构件的第二限定平面之间具有空隙，空隙适于允许弹性材料在结构中的局部变形。 该方法包括在电路板和基底构件之间施加压缩力以至少部分地压缩弹性体结构以改善电路板上的负载均衡。
-
-
-
-
-
-
-
-
-
搜索结果
107 条记录 (耗时 0.027 秒)
