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公开(公告)号：US20080232072A1
公开(公告)日：2008-09-25
申请号：US12131352
申请日：2008-06-02
CPC分类号： H05K7/142
摘要： A cam-action expanding standoff connector and related method are disclosed for mounting a circuit board. The standoff connector includes a body and a plurality of mounting members having interior longitudinally-extending camming portions for engagement by a cam. A cam is configured to be positioned within the mounting members in a first position in which the mounting members are not expanded against the interior of a mounting opening and in a second position in which the cam engages the camming portions to expand the plurality of mounting members against the interior of the mounting opening. Since the camming action is horizontal only (purely radial), practically no vertical forces are applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be established and maintained.
摘要翻译： 公开了一种用于安装电路板的凸轮动作扩展型支座连接器及相关方法。 支座连接器包括主体和多个安装构件，其具有用于由凸轮接合的内部纵向延伸的凸轮部分。 凸轮构造成在安装构件内定位在第一位置，在第一位置，安装构件不会抵靠安装开口的内部膨胀，并且在第二位置中凸轮接合凸轮部分以使多个安装构件 抵靠安装开口的内部。 由于凸轮作用仅仅是水平的（纯径向的），实际上没有垂直力施加到电路板上，并且可以建立和维持电路板和散热器之间的最佳配合。
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公开(公告)号：US07394666B2
公开(公告)日：2008-07-01
申请号：US10904276
申请日：2004-11-02
IPC分类号： H05K1/11
CPC分类号： H05K7/142
摘要： A cam-action expanding standoff connector and related method are disclosed for mounting a circuit board. The standoff connector includes a body and a plurality of mounting members having interior longitudinally-extending camming portions for engagement by a cam. A cam is configured to be positioned within the mounting members in a first position in which the mounting members are not expanded against the interior of a mounting opening and in a second position in which the cam engages the camming portions to expand the plurality of mounting members against the interior of the mounting opening. Since the camming action is horizontal only (purely radial), practically no vertical forces are applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be established and maintained.
摘要翻译： 公开了一种用于安装电路板的凸轮动作扩展型支座连接器及相关方法。 支座连接器包括主体和多个安装构件，其具有用于由凸轮接合的内部纵向延伸的凸轮部分。 凸轮构造成在安装构件内定位在第一位置，在第一位置，安装构件不会抵靠安装开口的内部膨胀，并且在第二位置中凸轮接合凸轮部分以使多个安装构件 抵靠安装开口的内部。 由于凸轮作用仅仅是水平的（纯径向的），实际上没有垂直力施加到电路板上，并且可以建立和维持电路板和散热器之间的最佳配合。
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公开(公告)号：US07086896B2
公开(公告)日：2006-08-08
申请号：US10904198
申请日：2004-10-28
IPC分类号： H01R13/73
CPC分类号： H05K7/142
摘要： An expanding standoff connector is disclosed including a collar having a slit through a wall of the collar, a tapered interior surface and an exterior surface configured to engage an interior of a mounting opening of the circuit board. A fastener including a threaded portion and a substantially cone shaped portion configured to mate with the tapered interior surface of the collar is placed within the collar and advanced to expand the collar to mount the circuit board. A related method for mounting a circuit board is also disclosed. Since the expansion is horizontal only (purely radial), a more uniform radial expansion from top-to-bottom of the collar is applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be maintained.
摘要翻译： 公开了一种扩展的支座连接器，其包括具有通过套环的壁的狭缝的套环，锥形内表面和被配置为接合电路板的安装开口的内部的外表面。 包括螺纹部分和构造成与套环的锥形内表面配合的基本锥形部分的紧固件被放置在套环内并且前进以扩展套环以安装电路板。 还公开了一种用于安装电路板的相关方法。 由于膨胀仅是水平的（纯径向），所以从电路板的顶部到底部的更均匀的径向膨胀被施加到电路板上，并且可以保持电路板和散热器之间的最佳匹配对准。
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4.发明授权Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip 有权用于保持冷却板/散热器和微芯片之间的接触的挠曲板公开(公告)号：US07239516B2
公开(公告)日：2007-07-03
申请号：US10939230
申请日：2004-09-10
申请人： David C. Long , Glenn G. Daves , David L. Edwards , Ronald L. Hering , Sushumna Iruvanti , Kenneth C. Marston , Jason S. Miller
发明人： David C. Long , Glenn G. Daves , David L. Edwards , Ronald L. Hering , Sushumna Iruvanti , Kenneth C. Marston , Jason S. Miller
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A flexible plate for securing a microchip surface to the surface of a cooling device. The flexible plate allows for z-directional movement between the microchip subassembly having a circuit board and a semiconductor substrate, and the cooling device. The flexible plate is a compact, single piece design that provides constraints in alignment in the x-, y-, and theta-directions, while allowing for z-direction compliance and tilt compliance. The flexible plate has tabs for mounting the microchip subassembly and tabs for mounting the cooling device. The microchip tabs are opposite one another and the cooling device mounting tabs are opposite one another. The flexible plate is a one-piece construction made from sheet metal, plastic, or metal castings. The flexible plate has a band with all the tabs mounted on the inside of the band, or one set of tabs mounted on the outside of the band.
摘要翻译： 用于将微芯片表面固定到冷却装置的表面的柔性板。 柔性板允许具有电路板的微芯片组件和半导体衬底之间的z方向运动以及冷却装置。 柔性板是一种紧凑的单件设计，可在x轴，y轴和θ轴方向上对齐，同时允许z方向顺应性和倾斜顺应性。 柔性板具有用于安装用于安装冷却装置的微芯片组件和突出部的突片。 微芯片接头彼此相对，并且冷却装置安装接头彼此相对。 柔性板是由金属板，塑料或金属铸件制成的一体式结构。 柔性板具有带子，其中所有突片安装在带的内部，或者一组安装在带的外侧上的突片。
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公开(公告)号：US07687894B2
公开(公告)日：2010-03-30
申请号：US11535740
申请日：2006-09-27
IPC分类号： H01L23/02
CPC分类号： H05K3/325 , H05K1/0271 , H05K3/0058 , H05K2201/10719 , H05K2201/2009 , H05K2203/074
摘要： An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip module by a land grid array (LGA) connector, a metal stiffener including a fluid-based pressure compensator contacting an underside of the PCB, and at least two couplers for coupling the metal stiffener to the chip module, with the PCB and the LGA connector therebetween. The fluid-based pressure compensator automatically compensates for natural and non-systematic out-of flatness tolerances of the PCB and the chip module, and non-uniform thickness of the PCB while creating a substantially uniform contact force on the LGA.
摘要翻译： 公开了一种IC芯片封装及相关方法。 IC芯片封装可以包括通过平面栅格阵列（LGA）连接器耦合到芯片模块的印刷电路板（PCB），包括接触PCB底部的基于流体的压力补偿器的金属加强件和至少两个耦合器 用于将金属加强件耦合到芯片模块，其中PCB和LGA连接器在其间。 基于流体的压力补偿器自动补偿PCB和芯片模块的自然和非系统的平坦度公差以及PCB的不均匀厚度，同时在LGA上产生基本上均匀的接触力。
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公开(公告)号：US20080073765A1
公开(公告)日：2008-03-27
申请号：US11535740
申请日：2006-09-27
IPC分类号： H01L23/02
CPC分类号： H05K3/325 , H05K1/0271 , H05K3/0058 , H05K2201/10719 , H05K2201/2009 , H05K2203/074
摘要： An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip module by a land grid array (LGA) connector, a metal stiffener including a fluid-based pressure compensator contacting an underside of the PCB, and at least two couplers for coupling the metal stiffener to the chip module, with the PCB and the LGA connector therebetween. The fluid-based pressure compensator automatically compensates for natural and non-systematic out-of flatness tolerances of the PCB and the chip module, and non-uniform thickness of the PCB while creating a substantially uniform contact force on the LGA.
摘要翻译： 公开了一种IC芯片封装及相关方法。 IC芯片封装可以包括通过平面栅格阵列（LGA）连接器耦合到芯片模块的印刷电路板（PCB），包括接触PCB底部的基于流体的压力补偿器的金属加强件和至少两个耦合器 用于将金属加强件耦合到芯片模块，其中PCB和LGA连接器在其间。 基于流体的压力补偿器自动补偿PCB和芯片模块的自然和非系统的平坦度公差以及PCB的不均匀厚度，同时在LGA上产生基本上均匀的接触力。
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7.发明授权Process and apparatus for improved module assembly using shape memory alloy springs 失效使用形状记忆合金弹簧改进模块组装的工艺和装置公开(公告)号：US06436223B1
公开(公告)日：2002-08-20
申请号：US09250312
申请日：1999-02-16
IPC分类号： B32B3100
CPC分类号： H01L21/68778 , F16F2224/0258 , H01L21/67092 , H01L21/67144 , Y10S148/908 , Y10S269/903 , Y10T29/53978
摘要： A fixture and process for assembly of semiconductor modules. Each module comprises a substrate and a cover attached to the substrate. The fixture comprises a baseplate adapted to accept the substrate and a spring-loading device containing a shape memory alloy spring engaging the cover. The shape memory alloy spring exerts a lesser force at room temperature and an elevated force at the bonding temperature of the bonding agent used to attach the cover to the substrate. The process comprises the steps of (a) loading she module into an assembly fixture and aligning a shape memory alloy spring over the module at room temperature; (b) placing the fixture and module into a heating chamber; (c) heating the fixture and module to a temperature sufficient for bonding and above the shape memory alloy spring transition temperature range so that the spring exerts an elevated force on the module; and (d) cooping the fixture and module below the transition temperature so that the spring exerts a lesser amount of force on the module, and disengaging the springs at the lower temperature.
摘要翻译： 用于组装半导体模块的夹具和工艺。 每个模块包括衬底和附接到衬底的盖。 所述固定装置包括适于接纳所述基板的基板和包含接合所述盖的形状记忆合金弹簧的弹簧加载装置。 形状记忆合金弹簧在室温下施加较小的力，并且在用于将盖附着到基底上的粘结剂的粘结温度下提高力。 该过程包括以下步骤：（a）将模块加载到组装夹具中并在室温下将形状记忆合金弹簧对准模块; （b）将灯具和模块放入加热室; （c）将夹具和模块加热到足以粘结的温度并高于形状记忆合金弹簧转变温度范围，使得弹簧在模块上施加升高的力; 和（d）将夹具和模块配合在转变温度以下，使得弹簧在模块上施加较小的力，并在较低温度下分离弹簧。
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公开(公告)号：US06444082B1
公开(公告)日：2002-09-03
申请号：US09599754
申请日：2000-06-22
IPC分类号： B32B3500
CPC分类号： H01L21/67092 , Y10T29/49822 , Y10T29/53274 , Y10T156/1184 , Y10T156/1961
摘要： An apparatus and a method for removing a bonded lid from a substrate of variable size including nesting jaws to support and secure the substrate; and gripping jaws to grip the lid; wherein, in operation, the gripping jaws pivot with respect to the nesting jaws and create a, peeling action which separates the lid from the substrate with minimum force and without damage to the substrate or attached semiconductor devices.
摘要翻译： 一种用于从包括嵌套爪的可变尺寸的基底去除粘合的盖的装置和方法，以支撑和固定基板; 和夹紧爪以夹紧盖子; 其中，在操作中，夹爪相对于嵌套爪枢转并且产生剥离动作，其以最小的力将盖与基板分开，并且不损坏基板或附接的半导体器件。
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公开(公告)号：US20080218971A1
公开(公告)日：2008-09-11
申请号：US11681994
申请日：2007-03-05
IPC分类号： H05K7/20
CPC分类号： H01L21/4871 , H01L21/50 , H01L23/3675 , H01L24/16 , H01L24/31 , H01L25/16 , H01L2224/16 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/09701 , H01L2924/10158 , H01L2924/10253 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/19105 , H01L2924/00 , H01L2224/0401
摘要： A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.
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公开(公告)号：US20080225484A1
公开(公告)日：2008-09-18
申请号：US11687037
申请日：2007-03-16
申请人： William L. Brodsky , Peter J. Brofman , James A. Busby , Bruce J. Chamberlin , Scott A. Cummings , David L. Edwards , Thomas J. Fleischman , Michael J. Griffin , Sushumna Iruvanti , David C. Long , Jennifer V. Muncy , Robin A. Susko
发明人： William L. Brodsky , Peter J. Brofman , James A. Busby , Bruce J. Chamberlin , Scott A. Cummings , David L. Edwards , Thomas J. Fleischman , Michael J. Griffin , Sushumna Iruvanti , David C. Long , Jennifer V. Muncy , Robin A. Susko
IPC分类号： H05K7/20
CPC分类号： H01L23/42 , H01L23/433 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01079 , H01L2924/16152 , H01L2924/3511 , H01L2224/0401
摘要： Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a flexible reservoir residing on opposing sides of a central portion of the pillow that has a gap. The pillow may have roughened internal surfaces to increase an internal surface area within the pillow for enhanced heat dissipation. In an electronic assembly, the central portion of the pillow resides between a heat sink and heat-generating component for the thermal coupling there-between. During thermal cycling, the flexible reservoir of the pillow expands to retain thermally conductive material extruded from the gap, and then contracts to force such extruded material back into the gap. An external pressure source may contact the pillow for further forcing the extruded thermally conductive material back into the gap.
摘要翻译： 使用柔性热枕头增强电子部件传热的方法，装置和组件。 柔性热枕头具有密封在顶部和底部导电层之间的导热材料，底层具有位于枕头的中心部分的具有间隙的相对侧上的柔性容器。 枕头可能具有粗糙的内表面以增加枕头内的内表面积，以增强散热。 在电子组件中，枕头的中心部分位于散热器和用于其之间的热耦合的发热部件之间。 在热循环期间，枕头的柔性储存器膨胀以保持从间隙挤出的导热材料，然后收缩以迫使这种挤出的材料回到间隙中。 外部压力源可以接触枕头，以进一步迫使挤出的导热材料回到间隙中。
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