公开(公告)号：USH520H

公开(公告)日：1988-09-06

申请号：US805526

申请日：1985-12-06

申请人： David L. Johnson ,  Robert J. Lavigna ,  Wen Lin ,  Raymond J. Newman ,  Subramani Rajaram ,  Joseph C. Veshinfsky ,  George Williams

发明人： David L. Johnson ,  Robert J. Lavigna ,  Wen Lin ,  Raymond J. Newman ,  Subramani Rajaram ,  Joseph C. Veshinfsky ,  George Williams

IPC分类号： C30B15/10 ,  C30B35/00

CPC分类号： C30B35/002 ,  C30B15/10

摘要： A glass crucible (30) for containing a material from which a silicon crystal melt is produced, wherein the inside surface area of the crucible is increased to react with the silicon melt (31) to increase the oxygen content thereof. The inside surface area may be increased by incorporating inwardly directed silica ribs (40) or concentric, hollow silica cylinders (32) as well as forming corrugations (45) or undulations on the inside surface thereof.

公开(公告)号：US4512509A

公开(公告)日：1985-04-23

申请号：US469662

申请日：1983-02-25

申请人： Roland Ellis, Jr. ,  Brian E. Jacobs ,  Edward J. March ,  Raymond J. Newman

发明人： Roland Ellis, Jr. ,  Brian E. Jacobs ,  Edward J. March ,  Raymond J. Newman

IPC分类号： H05K3/30 ,  H05K7/04 ,  H05K13/04 ,  B23K31/02

CPC分类号： H05K13/0482 ,  H05K13/0465 ,  H05K3/303 ,  H05K7/04 ,  H05K2201/10727 ,  H05K2203/0173 ,  H05K2203/0186 ,  H05K2203/048 ,  H05K2203/168 ,  Y02P70/613

摘要： A template (148), having at least one opening (152) therein, is placed in close, spaced, relation to a PCB (30). The opening (152) is circular with a small semicircular notch (154) on the periphery thereof. A chip carrier (10) is positioned in the opening (152) with one corner (22) loosely captured in the notch (154). The PCB (30), template (148) and the loosely captured chip carriers (10) are placed in a condensation soldering facility to reflow the solder. As the solder reflows the chip carrier (10) rotates slightly about the loosely captured corner (22) to self align pads (33) on the PCB (30) to leads (16) on the chip carrier (10) as the bond is being formed.

摘要翻译： 在其中具有至少一个开口（152）的模板（148）以与PCB（30）相近的间隔的方式放置。 开口（152）在圆周上具有小的半圆形凹口（154）。 芯片载体（10）定位在开口（152）中，其中一个角部（22）松动地捕获在凹口（154）中。 将PCB（30），模板（148）和松散捕获的芯片载体（10）放置在冷凝焊接设备中以回流焊料。 当焊料回流时，芯片载体（10）围绕松散捕获的拐角（22）稍微旋转以在PCB（30）上的自对准焊盘（33）到芯片载体（10）上的引线（16），因为粘合是 形成。

公开(公告)号：US4733749A

公开(公告)日：1988-03-29

申请号：US834403

申请日：1986-02-26

申请人： Raymond J. Newman ,  David E. Carlson

发明人： Raymond J. Newman ,  David E. Carlson

IPC分类号： H04R1/22 ,  H04R1/28 ,  H04R1/30 ,  H05K5/00

CPC分类号： H04R1/227 ,  H04R1/2842 ,  H04R1/2865 ,  H04R1/2819 ,  H04R1/30

摘要： A loudspeaker system for low frequencies has a manifold chamber into which oppositely mounted and aligned woofer units radiate sound. The chamber radiates the sound perpendicularly to the woofer axes, either directly into space or into a horn. An additional back woofer may radiate directly in the perpendicular direction.

摘要翻译： 用于低频的扬声器系统具有歧管室，相对安装和对准的低音单元辐射声音。 室内的声音垂直于低音扬声器轴，直接进入太空或喇叭。 另外的后置低音扬声器可以直接沿垂直方向辐射。

公开(公告)号：US4373658A

公开(公告)日：1983-02-15

申请号：US237204

申请日：1981-02-23

申请人： Edward J. March ,  Raymond J. Newman

发明人： Edward J. March ,  Raymond J. Newman

IPC分类号： B23K1/015 ,  B23K35/38 ,  B23K3/00 ,  F27D7/02

CPC分类号： B23K35/386 ,  B23K1/015

摘要： A high pressure steam condensation soldering facility (10) is described. The facility (10) incorporates a chamber (12) having a centrally located heat processing zone (45) into which high pressure steam is injected to reflow solder on articles (43) therein. A baffle (41) having a conical top portion (51) with a plurality of apertures (52) therein permits controlled amounts of the steam to pass therethrough while redirecting a portion of the steam along the wall (16) of the chamber (12) to interpose a shield of steam between the wall and uniformly heated processing zone (45).

摘要翻译： 描述了高压蒸汽冷凝焊接设备（10）。 设备（10）包括具有中心定位的加热处理区（45）的腔室（12），高压蒸汽被注入到其中以在其中的物品（43）上回流焊料。 具有其中具有多个孔（52）的锥形顶部（51）的挡板（41）允许受控量的蒸汽通过，同时沿着腔室（12）的壁（16）重定向蒸汽的一部分， 在壁和均匀加热的处理区（45）之间插入蒸汽屏蔽。