公开(公告)号：US20070042639A1

公开(公告)日：2007-02-22

申请号：US11476758

申请日：2006-06-29

申请人： David Manter ,  Thomas Cohen

发明人： David Manter ,  Thomas Cohen

IPC分类号： H01R13/73

CPC分类号： H01R13/518 ,  H01R12/52 ,  H01R13/514 ,  H01R13/6587 ,  Y10T29/4922

摘要： An electrical connector system includes a daughter card connector formed of a plurality of wafers. Each wafer is formed with cavities between the contacts of the signal conductors. The cavities are shaped to receive lossy inserts whereby crosstalk is reduced. The connector system may also or alternatively include a front housing formed with shield plates also to aid in reducing cross-talk. The front housing is adapted to mate between the wafers of the daughter card connector and a backplane connector of the electrical connector system. In an alternative embodiment, the front housing portion may include lossy conductive portions for cross-talk reduction.

摘要翻译： 电连接器系统包括由多个晶片形成的子卡连接器。 每个晶片在信号导体的触点之间形成有空腔。 空腔被成形为接收有损耗的插入物，从而降低串扰。 连接器系统还可以或可选地包括形成有屏蔽板的前壳体，以帮助减少串扰。 前壳体适于在子卡连接器的晶片与电连接器系统的背板连接器之间配合。 在替代实施例中，前壳体部分可以包括用于串扰减少的有损导电部分。

公开(公告)号：US09225085B2

公开(公告)日：2015-12-29

申请号：US13930351

申请日：2013-06-28

申请人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R13/648 ,  H01R12/70 ,  H01R12/71 ,  H01R43/20 ,  H01R13/6587 ,  H05K1/02

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

公开(公告)号：US20110230095A1

公开(公告)日：2011-09-22

申请号：US13029052

申请日：2011-02-16

申请人： Prescott B. Atkinson ,  Brian Kirk ,  Mark W. Gailus ,  David Manter ,  Thomas S. Cohen

发明人： Prescott B. Atkinson ,  Brian Kirk ,  Mark W. Gailus ,  David Manter ,  Thomas S. Cohen

IPC分类号： H01R13/648

CPC分类号： H01R13/6461 ,  H01R12/585 ,  H01R12/724 ,  H01R12/735 ,  H01R13/504 ,  H01R13/514 ,  H01R13/6471 ,  H01R13/6477 ,  H01R13/658 ,  H01R13/6585 ,  H01R13/6587 ,  H01R13/6598 ,  H01R24/62 ,  H01R24/68

摘要： An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair. By using material of relatively low loss, loss when the conductive members are used to carry signals is relatively low, but an appreciable attenuation of resonances is provided on pairs connected to ground. As a result, an overall improvement of signal to noise ratio is achieved.

摘要翻译： 一个改进的宽边耦合，开放引脚现场连接器。 当连接器安装到印刷电路板上时，连接器包含有损耗材料以选择性地抑制连接到地面的成对的导电构件内的谐振。 该材料还可以减少串扰和模式转换。 选择性地定位有损耗材料以基本上抑制可能连接到地面的成对的谐振，而不会有不可接受地衰减由其他对承载的信号。 有损材料可以选择性地定位在导电构件的匹配接触部分附近。 描述了用于选择性地定位有损材料的多种技术，包括模制，将有损构件插入到连接器壳体的壳体或涂层表面中。 有损耗材料可替代地位于一对导电构件的宽侧之间。 通过使用相对较低损耗的材料，当导电构件用于承载信号时的损耗相对较低，但是在连接到地面的对上提供明显的谐振衰减。 结果，实现了信噪比的全面提高。

公开(公告)号：US07494383B2

公开(公告)日：2009-02-24

申请号：US11880679

申请日：2007-07-23

申请人： Thomas S. Cohen ,  David Manter

发明人： Thomas S. Cohen ,  David Manter

IPC分类号： H01R9/09

CPC分类号： H01R12/725 ,  H01R12/7029 ,  H01R12/7041 ,  H01R13/6658 ,  H01R31/06

摘要： An electrical connector suitable for use in an adapter. The connector includes conductive elements that can be routed in three dimensions to facilitate interconnections between connectors used to form an adapter. Simplified construction is achieved through use of connector wafers, each of which route signals in a plane such that when the wafers are organized side-by-side in a connector, signals may be routed through multiple parallel planes. Some of the wafers may include holes through which conductive elements from other wafers may pass, to that signal may be routed in a third dimension, perpendicular to the parallel planes. The adapter may be mounted on a printed circuit board or other substrate with active components. Signals may pass through the adapter in one of the parallel planes or may be routed for conditioning in the active components.

摘要翻译： 适用于适配器的电连接器。 连接器包括导电元件，其可以三维布线以便于用于形成适配器的连接器之间的互连。 通过使用连接器晶片来实现简化的结构，每个连接器晶片在平面中路由信号，使得当晶片被并排组装在连接器中时，信号可以通过多个平行平面布线。 一些晶片可以包括来自其它晶片的导电元件穿过的孔，该信号可以在垂直于平行平面的第三维度中布线。 适配器可以安装在具有有源部件的印刷电路板或其它基板上。 信号可以通过其中一个平行平面中的适配器，或者可以在有源部件中进行路由以进行调理。

公开(公告)号：US20090029602A1

公开(公告)日：2009-01-29

申请号：US11880679

申请日：2007-07-23

申请人： Thomas S. Cohen ,  David Manter

发明人： Thomas S. Cohen ,  David Manter

IPC分类号： H01R9/22

CPC分类号： H01R12/725 ,  H01R12/7029 ,  H01R12/7041 ,  H01R13/6658 ,  H01R31/06

摘要： An electrical connector suitable for use in an adapter. The connector includes conductive elements that can be routed in three dimensions to facilitate interconnections between connectors used to form an adapter. Simplified construction is achieved through use of connector wafers, each of which route signals in a plane such that when the wafers are organized side-by-side in a connector, signals may be routed through multiple parallel planes. Some of the wafers may include holes through which conductive elements from other wafers may pass, to that signal may be routed in a third dimension, perpendicular to the parallel planes. The adapter may be mounted on a printed circuit board or other substrate with active components. Signals may pass through the adapter in one of the parallel planes or may be routed for conditioning in the active components.

摘要翻译： 适用于适配器的电连接器。 连接器包括导电元件，其可以三维布线以便于用于形成适配器的连接器之间的互连。 通过使用连接器晶片来实现简化的结构，每个连接器晶片在平面中路由信号，使得当晶片被并排组装在连接器中时，信号可以通过多个平行平面布线。 一些晶片可以包括来自其它晶片的导电元件穿过的孔，该信号可以在垂直于平行平面的第三维度中布线。 适配器可以安装在具有有源部件的印刷电路板或其它基板上。 信号可以通过其中一个平行平面中的适配器，或者可以在有源部件中进行路由以进行调理。

公开(公告)号：US08864521B2

公开(公告)日：2014-10-21

申请号：US13029052

申请日：2011-02-16

申请人： Prescott B. Atkinson ,  Brian Kirk ,  Mark W. Gailus ,  David Manter ,  Thomas S. Cohen

发明人： Prescott B. Atkinson ,  Brian Kirk ,  Mark W. Gailus ,  David Manter ,  Thomas S. Cohen

IPC分类号： H01R13/648 ,  H01R12/73 ,  H01R13/6585 ,  H01R13/6477 ,  H01R13/514 ,  H01R13/504 ,  H01R12/72 ,  H01R13/6587

CPC分类号： H01R13/6461 ,  H01R12/585 ,  H01R12/724 ,  H01R12/735 ,  H01R13/504 ,  H01R13/514 ,  H01R13/6471 ,  H01R13/6477 ,  H01R13/658 ,  H01R13/6585 ,  H01R13/6587 ,  H01R13/6598 ,  H01R24/62 ,  H01R24/68

摘要： An improved broadside coupled, open pin field connector. The connector incorporates lossy material to selectively dampen resonance within pairs of conductive members connected to ground when the connector is mounted to a printed circuit board. The material may also decrease crosstalk and mode conversion. The lossy material is selectively positioned to substantially dampen resonances along pairs that may be connected to ground without unacceptably attenuating signals carried by other pairs. The lossy material may be selectively positioned near mating contact portions of the conductive members. Multiple techniques are described for selectively positioning the lossy material, including molding, inserting lossy members into a housing or coating surfaces of the connector housing. The lossy material alternatively may be positioned between broad sides of conductive members of a pair.

摘要翻译： 一个改进的宽边耦合，开放引脚现场连接器。 当连接器安装到印刷电路板上时，连接器包含有损耗材料以选择性地抑制连接到地面的成对的导电构件内的谐振。 该材料还可以减少串扰和模式转换。 选择性地定位有损耗材料以基本上抑制可能连接到地面的成对的谐振，而不会有不可接受地衰减由其他对承载的信号。 有损材料可以选择性地定位在导电构件的匹配接触部分附近。 描述了用于选择性地定位有损材料的多种技术，包括模制，将有损构件插入到连接器壳体的壳体或涂层表面中。 有损耗材料可替代地位于一对导电构件的宽侧之间。

公开(公告)号：US20140004724A1

公开(公告)日：2014-01-02

申请号：US13930531

申请日：2013-06-28

申请人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R12/70

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌件成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

公开(公告)号：US09583853B2

公开(公告)日：2017-02-28

申请号：US13930447

申请日：2013-06-28

申请人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R12/70 ,  H01R13/648 ,  H01R12/71 ,  H01R43/20 ,  H01R13/6587 ,  H05K1/02

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

公开(公告)号：US09022806B2

公开(公告)日：2015-05-05

申请号：US13930531

申请日：2013-06-28

申请人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, Jr. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R13/648 ,  H01R12/70 ,  H01R12/71 ,  H01R43/20 ,  H01R13/6587 ,  H05K1/02

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌件成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。

公开(公告)号：US20140004746A1

公开(公告)日：2014-01-02

申请号：US13930351

申请日：2013-06-28

申请人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

发明人： Marc B. Cartier, JR. ,  David Manter ,  Prescott B. Atkinson ,  Philip T. Stokoe ,  Thomas S. Cohen ,  Mark W. Gailus

IPC分类号： H01R12/71

CPC分类号： H01R12/7082 ,  H01R12/712 ,  H01R13/6587 ,  H01R43/20 ,  H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K2201/09063 ,  Y10T29/49121

摘要： An RF connector module and associated printed circuit board providing high isolation and controlled impedance at RF frequencies. The connector module may be manufactured using conventional manufacturing techniques, such as stamping, insert molding, multi-shot molding and interference fit between components, to provide low cost. A connector module constructed with these techniques may implement a co-planar waveguide structure, with conductive shields for isolation and lossy material to enforce co-planar propagation modes. The printed circuit board may similarly be manufactured using conventional manufacturing techniques, including drilling to form vias. As a result, an interconnection system may be manufactured with low cost. These techniques may be applied to provide performance, including in the form of isolation between RF signals, comparable to that provided by more expensive components.

摘要翻译： RF连接器模块和相关的印刷电路板，在RF频率下提供高隔离和受控阻抗。 连接器模块可以使用常规的制造技术制造，例如冲压，嵌入成型，多次成型和部件之间的过盈配合，以提供低成本。 用这些技术构成的连接器模块可以实现共面波导结构，其具有用于隔离的导电屏蔽和有损材料以实现共面传播模式。 印刷电路板可类似地使用常规制造技术制造，包括钻孔以形成通孔。 结果，可以以低成本制造互连系统。 可以应用这些技术来提供性能，包括在RF信号之间的隔离的形式，与由更昂贵的组件提供的RF信号相当。