摘要:
A sensor system that monitors agent breakthrough through a vapor barrier and related test process. The system includes a substantially airtight test chamber for retaining the vapor barrier, which may be formed of one or more layers of one or more materials. A sensor element array placed adjacent to the barrier under test includes elements that are sensitive to one or more agents of interest and elements that are insensitive to such agents. The insensitive elements provide a baseline reference signal that is compared to the output signal of the sensitive elements. As the agent contacts the array, the electrical signal output from the sensitive elements changes in comparison to that of the reference elements. The sensor array is sensitive enough to detect low levels of the agent when the agent passes through the barrier. A control system is used to regulate and monitor environmental conditions within the chamber and to process electrical signals from the sensor array.
摘要:
Described herein is a water treatment system for simultaneously removing ammonia and nitrates from a liquid. The water treatment system comprises a floating platform, at least one columnar unit connected with the floating platform, where each columnar unit includes a bounding surface possessing multiple apertures. An air diffuser is connected with each columnar unit for supplying an air flow volume within the columnar unit.
摘要:
A filtration system for an aquarium is provided. The filtration system includes a gate chamber with a gate conduit positioned therein that transports unprocessed water from the aquarium. The gate chamber includes filtering media. The filtration system also includes a siphon chamber that is fluidly coupled to the gate chamber. There is a siphon conduit having a siphon conduit inlet at a first elevation within the siphon chamber, a siphon conduit outlet at a second elevation below the first elevation, and a crest at a third elevation above the first and second elevations. The siphon conduit empties into a catch basin, where the processed water is transported back to the aquarium.
摘要:
A multi-chamber processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. The system includes a sputtering chamber and a separate pre-clean chamber, where wafers can be transferred between the two chambers by a robotic arm without breaking a vacuum. The wafers are mounted one-by-one onto a rotating pallet in the pre-cleaning chamber and sputtering chamber. The pallet is firmly fixed to a rotatable table in the sputtering chamber. Copper tubing in the table couples RF energy to the wafers, and a liquid running through the copper tubing controls the temperature of the wafers. Multiple targets, of the same or different materials, may concurrently deposit material on the wafers as the pallet is rotating. Multiple magnets (one for each target) in the magnetron assembly in the sputtering chamber oscillate over their respective targets for uniform target erosion and uniform deposition on the wafers. An electrically insulated target backing plate between each magnet and a target has a liquid channel running through it for controlling temperature. The distance between the magnets and the targets is made very small by a thin aluminum plate fixed to the bottom segment of the target backing plate by a dip brazing process. Various shields are described to prevent cross-contamination from the targets and prevent the sputtered target material from entering gaps in the chamber and shorting out insulators.
摘要:
A multi-chamber processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. The system includes a sputtering chamber and a separate pre-clean chamber, where wafers can be transferred between the two chambers by a robotic arm without breaking a vacuum. The wafers are mounted one-by-one onto a rotating pallet in the pre-cleaning chamber and sputtering chamber. The pallet is firmly fixed to a rotatable table in the sputtering chamber. Copper tubing in the table couples RF energy to the wafers, and a liquid running through the copper tubing controls the temperature of the wafers. Multiple targets, of the same or different materials, may concurrently deposit material on the wafers as the pallet is rotating. Multiple magnets (one for each target) in the magnetron assembly in the sputtering chamber oscillate over their respective targets for uniform target erosion and uniform deposition on the wafers. An electrically insulated target backing plate between each magnet and a target has a liquid channel running through it for controlling temperature. The distance between the magnets and the targets is made very small by a thin aluminum plate fixed to the bottom segment of the target backing plate by a dip brazing process. Various shields are described to prevent cross-contamination from the targets and prevent the sputtered target material from entering gaps in the chamber and shorting out insulators.
摘要:
A multi-chamber processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. The system includes a sputtering chamber and a separate pre-clean chamber, where wafers can be transferred between the two chambers by a robotic arm without breaking a vacuum. The wafers are mounted one-by-one onto a rotating pallet in the pre-cleaning chamber and sputtering chamber. The pallet is firmly fixed to a rotatable table in the sputtering chamber. Copper tubing in the table couples RF energy to the wafers, and a liquid running through the copper tubing controls the temperature of the wafers. Multiple targets, of the same or different materials, may concurrently deposit material on the wafers as the pallet is rotating. Multiple magnets (one for each target) in the magnetron assembly in the sputtering chamber oscillate over their respective targets for uniform target erosion and uniform deposition on the wafers. An electrically insulated target backing plate between each magnet and a target has a liquid channel running through it for controlling temperature. The distance between the magnets and the targets is made very small by a thin aluminum plate fixed to the bottom segment of the target backing plate by a dip brazing process. Various shields are described to prevent cross-contamination from the targets and prevent the sputtered target material from entering gaps in the chamber and shorting out insulators.
摘要:
A microfluidic device useable for performing live cell computed tomography imaging is fabricated with a cover portion including a first wafer with at least one metal patterned thereon, a base portion including a second wafer with at least one metal patterned thereon and negative photoresist defining recesses therein, and a diffusive bonding layer including a negative photoresist arranged to join the cover portion and the base portion. A composition useful in live cell computer topography includes a long-chain polysaccharide at a concentration of from about 0.01% to about 10.0% in cell culture medium for supporting cell life while enabling cell rotation rate to be slowed to a speed commensurate with low light level imaging.
摘要:
Described herein is a water treatment system for simultaneously removing ammonia and nitrates from a liquid. The water treatment system comprises a nitrifying volume for nitrification of a liquid and a denitrifying volume for denitrification of the liquid. One of the nitrifying volume and the denitrifying volume resides substantially within the other of the nitrifying volume and the denitrifying volume, and the nitrifying volume and the denitrifying volume are in fluid communication. In one aspect, the nitrifying volume is a relatively oxygenated region and the denitrifying volume is a relatively oxygen-depleted region. In another aspect, the nitrifying volume is in communication with an oxygen-supplying source for providing oxygen to create the relatively oxygenated region.
摘要:
A multi-chamber processing system is described for depositing materials on multiple workpieces (wafers, display panels, or any other workpieces) at a time in a vacuum chamber. The system includes a sputtering chamber and a separate pre-clean chamber, where wafers can be transferred between the two chambers by a robotic arm without breaking a vacuum. The wafers are mounted one-by-one onto a rotating pallet in the pre-cleaning chamber and sputtering chamber. The pallet is firmly fixed to a rotatable table in the sputtering chamber. Copper tubing in the table couples RF energy to the wafers, and a liquid running through the copper tubing controls the temperature of the wafers. Multiple targets, of the same or different materials, may concurrently deposit material on the wafers as the pallet is rotating. Multiple magnets (one for each target) in the magnetron assembly in the sputtering chamber oscillate over their respective targets for uniform target erosion and uniform deposition on the wafers. An electrically insulated target backing plate between each magnet and a target has a liquid channel running through it for controlling temperature. The distance between the magnets and the targets is made very small by a thin aluminum plate fixed to the bottom segment of the target backing plate by a dip brazing process. Various shields are described to prevent cross-contamination from the targets and prevent the sputtered target material from entering gaps in the chamber and shorting out insulators.