公开(公告)号：US12213280B2

公开(公告)日：2025-01-28

申请号：US17973032

申请日：2022-10-25

Applicant: Dell Products, LP

Inventor： Travis C. North ,  Qinghong He ,  Enoch Chen

IPC: H05K7/20

Abstract: An information handling system comprising a hardware processor, a display device, and a memory device that includes a stacked ion emitter/collector blower cooling system with a first ion emitter/collector blower having a first ion emitter and a first ion collector and a second ion emitter/collector blower with a second ion emitter and a second ion collector, where the second ion emitter/collector blower is placed at a location within the chassis of the information handling system vertically higher than the first ion emitter/collector blower. The first ion emitter/collector blower and second ion emitter/collector blower include an ionic driving circuit operatively coupled to the first ion emitter and the second ion emitter via a high voltage to ionize gases within the first ion emitter/collector blower and second ion emitter/collector blower to create charged ions that generate a stacked emitter airflow to cool the chassis of the information handling system.

公开(公告)号：US20240237272A9

公开(公告)日：2024-07-11

申请号：US17973032

申请日：2022-10-25

Applicant: Dell Products, LP

Inventor： Travis C. North ,  Qinghong He ,  Enoch Chen

IPC: H05K7/20

CPC classification number: H05K7/20172 ,  H05K7/20145 ,  H05K7/20409

Abstract: An information handling system comprising a hardware processor, a display device, and a memory device that includes a stacked ion emitter/collector blower cooling system with a first ion emitter/collector blower having a first ion emitter and a first ion collector and a second ion emitter/collector blower with a second ion emitter and a second ion collector, where the second ion emitter/collector blower is placed at a location within the chassis of the information handling system vertically higher than the first ion emitter/collector blower. The first ion emitter/collector blower and second ion emitter/collector blower include an ionic driving circuit operatively coupled to the first ion emitter and the second ion emitter via a high voltage to ionize gases within the first ion emitter/collector blower and second ion emitter/collector blower to create charged ions that generate a stacked emitter airflow to cool the chassis of the information handling system.

公开(公告)号：US20240147657A1

公开(公告)日：2024-05-02

申请号：US17974036

申请日：2022-10-26

Applicant: Dell Products, LP

Inventor： Travis C. North ,  Qinghong He ,  Mitchell Anthony Markow

IPC: H05K7/20

CPC classification number: H05K7/20172 ,  H05K7/20145 ,  H05K7/20409

Abstract: An information handling system includes a powered hardware processor and a memory device. The information handling system includes an ion emitter/collector blower cooling system including an ion emitter/collector blower having an ion emitter and an ion collector, the ion emitter/collector blower being operatively coupled to a fan and located between the fan and an exhaust vent formed in a top edge of the chassis of the information handling system. An ionic driving circuit is operatively coupled to the ion emitter via a high voltage to ionize gases at the ion emitter/collector blower to create charged ions that generate an airflow to and through the ion collector. The information handling system also includes an air intake vent located at the fan in the chassis so that the airflow is brought into the chassis via the fan, through the fan and ion emitter/collector blower, and out of the air exhaust vent.

公开(公告)号：US20240134427A1

公开(公告)日：2024-04-25

申请号：US17972193

申请日：2022-10-23

Applicant: Dell Products, LP

Inventor： Qinghong He ,  Travis C. North

IPC: G06F1/20 ,  H01T23/00 ,  H05K7/20

CPC classification number: G06F1/203 ,  H01T23/00 ,  H05K7/20172 ,  H05K7/20409

Abstract: An information handling system includes a processor, a memory device, and a PMU to provide power to the processor and memory device. The information handling system further includes an ion emitter/collector blower cooling system including an ion emitter including an inner ring of vertically arranged ion emitter blades and an ion collector including an outer ring of vertically arranged ion collector blades. The cooling system includes an ionic driving circuit operatively coupled to the ion emitter to couple a first voltage to the ion collector blades to ionize gases at the ion emitter to create charged ions and the ionic driving circuit operatively coupled to the ion collector to apply a second voltage to attract the charged ions from the ion emitter to create an airflow, the airflow passing through the outer ring and out of an external opening of an ion emitter/collector housing of the ion emitter/collector blower cooling system.

公开(公告)号：US11930622B2

公开(公告)日：2024-03-12

申请号：US17571064

申请日：2022-01-07

Applicant: Dell Products, LP

Inventor： Qinghong He ,  Travis C. North

IPC: H05K7/20 ,  H05K9/00

CPC classification number: H05K7/20336 ,  H05K7/20136 ,  H05K7/20409 ,  H05K9/0024

Abstract: An information handling system with a cooling system may include a processor; a memory; a power management unit (PMU); a cooling system including: a fan; and a cooling system heat pipe; a detachable thermal module including: a first heat conductive element to be operatively coupled to a heat producing components such as a processor, a radio module, or other component; a second heat conductive element to be operatively coupled to the cooling system heat pipe of the cooling system; and a detachable thermal module heat pipe formed between the first heat conductive element and the second heat conductive element.

公开(公告)号：US20230225083A1

公开(公告)日：2023-07-13

申请号：US17571064

申请日：2022-01-07

Applicant: Dell Products, LP

Inventor： Qinghong He ,  Travis C. North

IPC: H05K7/20 ,  H05K9/00

CPC classification number: H05K7/20336 ,  H05K7/20409 ,  H05K7/20136 ,  H05K9/0024

Abstract: An information handling system with a cooling system may include a processor; a memory; a power management unit (PMU); a cooling system including: a fan; and a cooling system heat pipe; a detachable thermal module including: a first heat conductive element to be operatively coupled to a heat producing components such as a processor, a radio module, or other component; a second heat conductive element to be operatively coupled to the cooling system heat pipe of the cooling system; and a detachable thermal module heat pipe formed between the first heat conductive element and the second heat conductive element.

公开(公告)号：US20230198576A1

公开(公告)日：2023-06-22

申请号：US17553330

申请日：2021-12-16

Applicant: Dell Products, LP

Inventor： Travis C. North ,  Qinghong He

IPC: H04B7/005 ,  H01Q1/02 ,  H02J7/00 ,  H01M10/42 ,  H01M10/613 ,  H01M10/44 ,  H01M10/6556 ,  H01M10/653 ,  H01M10/658 ,  H01M10/6561

CPC classification number: H04B7/005 ,  H01M10/425 ,  H01M10/443 ,  H01M10/613 ,  H01M10/653 ,  H01M10/658 ,  H01M10/6556 ,  H01M10/6561 ,  H01Q1/02 ,  H02J7/0013 ,  H02J7/0042 ,  H01M2010/4271

Abstract: An information handling system may include a processor; a memory; a PMU; an antenna controller to receive data descriptive of the operating parameters of an antenna module housed within a battery housing of a battery operatively coupled to the PMU; a controller to receive power data descriptive of a charging and discharging of the battery; the battery housing including: the battery-integrated antenna module coupled to the housing of the battery and coupled to the antenna controller; one or more power cells; a thermal mitigation structure placed in the battery housing to sink heat generated by battery-integrated antenna module and the one or more power cells; and a cable array operatively coupling the antenna module to the controller; the controller executing code instructions of a battery-integrated antenna management system to receive temperature data of the battery and the antenna module and throttles the charge/discharge rate of the battery or throttles the transmission (TX)/reception (RX) at the antenna module based on the detected temperature data, operating parameters, and the power data.

公开(公告)号：US10548248B2

公开(公告)日：2020-01-28

申请号：US15040446

申请日：2016-02-10

Applicant: Dell Products, LP

Inventor： Christopher M. Helberg ,  Travis C. North ,  Tifenn M. Boisard ,  Deeder M. Aurongzeb

IPC: H05K9/00

Abstract: A cooling assembly for an IOT wireless gateway device that includes a motherboard structure operatively coupled to one side of a first motherboard component, which is operatively coupled on the other side to one side of a first gap pad for conducting heat, an EMI shield operatively coupled to the other side of the first gap pad and surrounding the sides of the first motherboard component, the EMI shield also operatively coupled to the motherboard structure, the outside of the EMI shield operatively coupled to one side of a second gap pad for conducting heat, and a first heat sink operatively coupled to the other side of the second gap pad for conducting heat.

公开(公告)号：US20190139533A1

公开(公告)日：2019-05-09

申请号：US15808323

申请日：2017-11-09

Applicant: DELL PRODUCTS, LP

Inventor： Ray V. Kacelenga ,  Merle J. Wood, III ,  Travis C. North

IPC: G10K11/178 ,  G06F1/32

Abstract: An information handling system includes a processor configured to operate in one of a plurality of power states. An audio circuit measures an ambient audio environment within the information handling system, classifies the measured ambient audio into one of a plurality of categories, and implements a power management policy for the processor in response to the measured ambient audio being classified into the one of the categories.

公开(公告)号：US20170231110A1

公开(公告)日：2017-08-10

申请号：US15040446

申请日：2016-02-10

Applicant: Dell Products, LP

Inventor： Christopher M. Helberg ,  Travis C. North ,  Tifenn M. Boisard ,  Deeder M. Aurongzeb

IPC: H05K7/20 ,  H05K9/00

CPC classification number: H05K9/0022 ,  G06F1/20 ,  H01L23/36

Abstract: A cooling assembly for an IOT wireless gateway device that includes a motherboard structure operatively coupled to one side of a first motherboard component, which is operatively coupled on the other side to one side of a first gap pad for conducting heat, an EMI shield operatively coupled to the other side of the first gap pad and surrounding the sides of the first motherboard component, the EMI shield also operatively coupled to the motherboard structure, the outside of the EMI shield operatively coupled to one side of a second gap pad for conducting heat, and a first heat sink operatively coupled to the other side of the second gap pad for conducting heat.