公开(公告)号：US08754512B1

公开(公告)日：2014-06-17

申请号：US13705269

申请日：2012-12-05

申请人： Delphi Technologies, Inc.

发明人： Ralph S. Taylor ,  Steven E. Staller

IPC分类号： H01L23/495

CPC分类号： H01L23/49568 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/49531 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49844 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/80 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/08225 ,  H01L2224/80012 ,  H01L2224/80203 ,  H01L2224/80424 ,  H01L2224/80444 ,  H01L2224/80447 ,  H01L2224/80805 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/12036 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/3511 ,  H01L2924/00

摘要： An electronic device assembly that includes a die and a substrate, and optionally a lead frame and a heat spreader. The die is characterized as an electronic device in die form, and has a polished die region. The substrate has a polished substrate region in direct contact with the polished die region. The polished die region and the polished substrate region have surface finishes effective to attach the die to the substrate by way of an atomic bond. The lead-frame has a polished lead-frame region, and the heat spreader has a polished heat spreader region. These polished regions may also be attached to the polished die region or the polished substrate region by way of an atomic bond.

摘要翻译： 一种包括管芯和衬底以及可选地引线框架和散热器的电子器件组件。 模具的特征在于以模具形式的电子设备，并且具有抛光的模具区域。 衬底具有与抛光的裸片区域直接接触的抛光衬底区域。 抛光的裸片区域和抛光的衬底区域具有有效的通过原子键将裸片附接到衬底的表面光洁度。 引线框架具有抛光的引线框架区域，散热器具有抛光的散热器区域。 这些抛光区域也可以通过原子键连接到抛光的裸片区域或抛光的衬底区域。