公开(公告)号：US4628411A

公开(公告)日：1986-12-09

申请号：US729831

申请日：1985-05-02

申请人： Demetrios Balderes ,  Andrew J. Frankovsky ,  Robert A. Jarvela

发明人： Demetrios Balderes ,  Andrew J. Frankovsky ,  Robert A. Jarvela

IPC分类号： G06F1/18 ,  H05K1/02 ,  H05K3/46 ,  H05K5/00

CPC分类号： G06F1/189 ,  H05K1/0263 ,  H05K2201/0919 ,  H05K2201/10272 ,  H05K3/4641

摘要： A direct module powering scheme is disclosed. A plurality of integrated circuit chips are mounted on a module. The module is mounted on a printed circuit board. A plurality of metallization layers are distributed in parallel fashion within the module. A voltage tab is mounted on the edge of the module substrate and in contact with the edge of the metallization layers. The voltage tab may be attached to a source of power for providing the necessary voltage and current to the module needed to power the chips mounted on the module. The metallization layers comprise voltage distribution layers and voltage reference (ground) layers. The voltage tab is connected to the edge of the voltage distribution layer. A plurality of plated vias are disposed through the module in contact with one or more of the metallization layers. A plurality of voltage distribution stripes are disposed on the bottom of the module substrate and in contact with the plated vias for providing the necessary voltage and current to remotely-located chips, relative to the voltage tab, needed to power the chips. The energizing current from the power source energizes the chips mounted on the module by way of the voltage tab, the voltage distribution layer, and a plated via. Alternatively, the energizing current from the power source energizes a remotely-located chip mounted on the module by way of the voltage tab, the voltage distribution layer, a plated via, a voltage distribution stripe, and another plated via connected to the remotely-located chip. As a result, the module is connected directly to the power source, rather than being connected to the power source by way of a plurality of power distribution planes disposed within the printed circuit board.

摘要翻译： 公开了一种直接模块供电方案。 多个集成电路芯片安装在模块上。 该模块安装在印刷电路板上。 多个金属化层在模块内以并行方式分布。 电压接头安装在模块基板的边缘上并与金属化层的边缘接触。 电压接头可以附接到电源上，以向安装在模块上的芯片供电所需的模块提供必要的电压和电流。 金属化层包括电压分布层和电压参考（接地）层。 电压接头连接到电压分布层的边缘。 多个电镀通孔通过模块设置成与一个或多个金属化层接触。 多个电压分布条被布置在模块基板的底部并与电镀通孔接触，以便为相对于电压片提供必要的电压和电流至相对于电压片供电所需的芯片。 来自电源的激励电流通过电压接头，电压分布层和电镀通孔激励安装在模块上的芯片。 或者，来自电源的激励电流通过电压接头，电压分配层，电镀通孔，电压分配条和连接到远程位置的另一个电镀通孔来激励安装在模块上的远程定位的芯片 芯片。 结果，模块直接连接到电源，而不是通过布置在印刷电路板内的多个配电平面连接到电源。

公开(公告)号：US4233645A

公开(公告)日：1980-11-11

申请号：US947788

申请日：1978-10-02

申请人： Demetrios Balderes ,  John R. Lynch ,  Robert A. Yacavonis

发明人： Demetrios Balderes ,  John R. Lynch ,  Robert A. Yacavonis

IPC分类号： H05K7/20 ,  H01L23/04 ,  H01L23/373 ,  H01L23/42 ,  H01L23/433 ,  H01L23/473

CPC分类号： H01L23/3733 ,  H01L23/42 ,  H01L23/4338 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/3011

摘要： A semiconductor device package having a substrate, one or more semiconductor devices mounted on the top surface of the substrate, a heat sink having a surface in opposed spaced parallel relation to the top surface of the substrate, and at least one deformable heat transfer member positioned between a device mounted on the top surface of the substrate, and the surface of the heat sink. The heat transfer member is comprised of a porous block of material, and a heat conductive non-volatile liquid retained within the block of material by a surface tension. The heat transfer member being operative to transfer heat from the device to the heat sink.

摘要翻译： 一种半导体器件封装，其具有衬底，一个或多个半导体器件安装在衬底的顶表面上，散热器具有与衬底的顶表面相对隔开的表面的表面，以及至少一个可变形的传热构件， 在安装在基板的顶表面上的装置与散热片的表面之间。 传热构件由多孔材料块组成，并且由表面张力保持在材料块内的导热非挥发性液体。 传热构件可操作以将热量从装置传递到散热器。

公开(公告)号：US07152473B1

公开(公告)日：2006-12-26

申请号：US09936634

申请日：2000-03-17

申请人： Larry Rushefsky ,  Axel Sigmar ,  Howard D. Goldberg ,  W. Marc Stalnaker ,  Ray Rinne ,  Demetrios Balderes ,  Guido Lemke ,  Matthew Ip ,  Lawrence P. Behn ,  Klaus Domagalski ,  Lianzhong Yu ,  Arjun Selvakumar ,  Duli Yu ,  James L. Marsh ,  Peter Maxwell ,  David Morgan ,  Thomas Buie ,  Kees Faber ,  Sjoerd Altman ,  Richard Laroo

发明人： Larry Rushefsky ,  Axel Sigmar ,  Howard D. Goldberg ,  W. Marc Stalnaker ,  Ray Rinne ,  Demetrios Balderes ,  Guido Lemke ,  Matthew Ip ,  Lawrence P. Behn ,  Klaus Domagalski ,  Lianzhong Yu ,  Arjun Selvakumar ,  Duli Yu ,  James L. Marsh ,  Peter Maxwell ,  David Morgan ,  Thomas Buie ,  Kees Faber ,  Sjoerd Altman ,  Richard Laroo

IPC分类号： G01D11/10 ,  G01P15/00

CPC分类号： B81B7/0074 ,  B81B2201/0242 ,  G01D11/245 ,  G01P1/023 ,  G01P15/18 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00014

摘要： A sensor apparatus (104) includes a plural different spatial direction axis of sensitivity positioned sensor package containing sensor module (305) supported by a planar surface (345) within a cavity (340) of a housing (205) coupled to a first end cap (210) by a PC-board connection (355). Housing (205) is further coupled to first end cap (210) by a first coupling member (315) and a second coupling member (320) and is also coupled to an opposite second end cap (215) by a third coupling member (320) and a fourth coupling member (325). Interface sealing members (330a, 330b, 330c, 330d) seal between housing (205) and first end cap (210). Interface sealing members (335a, 335b, 335c, 335d) seal between housing (205) and second end cap (215).

摘要翻译： 传感器装置（104）包括灵敏度定位的传感器组件的多个不同的空间方向轴，所述传感器组件包含传感器模块（305），所述传感器组件由平面（345）支撑在壳体（205）的空腔（340）内，所述壳体耦合到第一端盖 （210）通过PC板连接（355）。 壳体（205）还通过第一联接构件（315）和第二联接构件（320）进一步联接到第一端盖（210），并且还通过第三联接构件（320）联接到相对的第二端盖（215） ）和第四联接构件（325）。 接口密封构件（330a，330b，330c，330d）在壳体（205）和第一端盖（210）之间密封。 接口密封构件（335a，335b，335c，335d）在壳体（205）和第二端盖（215）之间密封。

公开(公告)号：US4483389A

公开(公告)日：1984-11-20

申请号：US356677

申请日：1982-03-10

申请人： Demetrios Balderes ,  Joseph L. Horvath ,  Lewis D. Lipschutz

发明人： Demetrios Balderes ,  Joseph L. Horvath ,  Lewis D. Lipschutz

IPC分类号： H01L23/44 ,  F28F3/02 ,  H01L23/36 ,  H01L23/433 ,  H01L23/40

CPC分类号： H01L23/4338 ,  H01L2224/16

摘要： A telescoping heat exchange element for conducting heat in a semiconductor package from a device to a spaced heat sink having a first cup-shaped member, a second cup-shaped member positioned in telescoping slidable relation with the first member, and a means to provide a firm sliding contact between the first and second members.

摘要翻译： 一种用于将半导体封装中的热量从器件传导到具有第一杯状构件的间隔开的散热器的伸缩式热交换元件，与第一构件可伸缩地关系地定位的第二杯形构件，以及提供 第一和第二构件之间的牢固的滑动接触。

公开(公告)号：US3983402A

公开(公告)日：1976-09-28

申请号：US643221

申请日：1975-12-22

申请人： Herbert Lorenz Arndt, Jr. ,  Demetrios Balderes ,  John Robert Kranik ,  Charles John Lucas

发明人： Herbert Lorenz Arndt, Jr. ,  Demetrios Balderes ,  John Robert Kranik ,  Charles John Lucas

IPC分类号： H01J37/18 ,  H01J37/317 ,  H01L21/265

CPC分类号： H01J37/3171 ,  H01J37/18

摘要： Disclosed is ion implantation apparatus in which an ion source is coupled to a semiconductor or workpiece holder which is mounted for rotation and reciprocation in a first chamber in the path of the ion beam. A second chamber is releasably coupled to the first chamber with means connected to the second chamber in such a manner as to enable displacement between the first and second chamber, the chambers being in fluid communication with one another when the apparatus is in operation. Vacuum drawing means are provided to effect a vacuum in both the first and second chamber when the apparatus is in operation, and when it is desired to withdraw the holder from the apparatus by disconnecting the second chamber from the first chamber, venting the first chamber automatically actuates a check valve which seals the second chamber permitting the retention of a vacuum in the second chamber while allowing the first chamber to be exposed to atmospheric pressure.

摘要翻译： 公开了一种离子注入装置，其中离子源耦合到半导体或工件保持器，其被安装用于在离子束的路径中的第一室中旋转和往复运动。 第二室可释放地联接到第一室，其具有连接到第二室的装置，以使得能够在第一和第二室之间移动，这些室在装置运行时彼此流体连通。 提供真空拉伸装置以在装置运行时在第一和第二腔室中实现真空，并且当需要通过将第二腔室与第一腔室断开而将装置从装置中取出时，自动排出第一腔室 启动止回阀，该止回阀密封第二室，允许在第二室中保持真空，同时允许第一室暴露于大气压力。