公开(公告)号：US5972736A

公开(公告)日：1999-10-26

申请号：US205424

申请日：1998-12-04

申请人： Deviprasad Malladi ,  Mario J. Lee ,  Ehsan Ettehadieh ,  Nagaraj Mitty

发明人： Deviprasad Malladi ,  Mario J. Lee ,  Ehsan Ettehadieh ,  Nagaraj Mitty

IPC分类号： H01L23/24 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/24 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181

摘要： An integrated circuit package with heat slug is disclosed. The heat slug is thermally coupled to one or more semiconductor die using a single layer of high conductivity adhesive. The assembly process of this invention includes the steps of initially attaching a temporary heat slug to the back side of a package body, to which one or more semiconductor die are attached. The semiconductor die are then electrically connected to the package body and encapsulated to maintain fixed positions within the package cavity. The temporary heat slug is then moved and a final heat slug is attached to the package body and the back side of the one or more semiconductor dies utilizing a single layer of high conductivity adhesive. The package is compact, has reduced complexity, and is inexpensive to manufacture.

摘要翻译： 公开了一种具有热塞的集成电路封装。 使用单层高导电性粘合剂将散热块热耦合到一个或多个半导体管芯。 本发明的组装方法包括以下步骤：将临时散热块附接到一个或多个半导体管芯附接到封装主体的背面。 然后将半导体管芯电连接到封装主体并封装以保持封装腔内的固定位置。 然后移动临时热块，并且使用单层高导电性粘合剂将最终的热块附着到封装主体和一个或多个半导体管芯的背面。 封装紧凑，复杂性降低，制造成本低廉。

公开(公告)号：US06683372B1

公开(公告)日：2004-01-27

申请号：US09442850

申请日：1999-11-18

申请人： Tayung Wong ,  John Carrillo ,  Jay Robinson ,  Clement Fang ,  David Jeffrey ,  Nikhil Vaidya ,  Nagaraj Mitty

发明人： Tayung Wong ,  John Carrillo ,  Jay Robinson ,  Clement Fang ,  David Jeffrey ,  Nikhil Vaidya ,  Nagaraj Mitty

IPC分类号： H01L2300

CPC分类号： G11C5/02 ,  G06F11/006 ,  G06F11/1024 ,  G11C5/04 ,  G11C8/12 ,  G11C11/40615 ,  G11C2029/4402 ,  H05K1/181

摘要： A memory expansion module with stacked memory packages. A memory module is implemented using stacked memory packages. Each of the stacked memory packages contains multiple memory chips, typically DRAMs (dynamic random access memory). The memory may be organized into multiple banks, wherein a given memory chip within a stacked memory package is part of one bank, while another memory chip in the same package is part of another bank. The memory module also includes a clock driver chip and a storage unit. The storage unit is configured to store module identification information, such as a serial number. The storage unit is also configured to store information correlating electrical contact pads on the module with individual signal pins on the stacked memory packages. This may allow an error to be quickly traced to a specific pin on a stacked memory package when an error is detected on the memory bus by an error correction subsystem.

摘要翻译： 具有堆叠内存包的内存扩展模块。 使用堆叠存储器包实现存储器模块。 每个堆叠的存储器包包含多个存储器芯片，通常是DRAM（动态随机存取存储器）。 存储器可以被组织成多个存储体，其中堆叠存储器封装内的给定存储器芯片是一个存储体的一部分，而同一封装中的另一个存储器芯片是另一个存储体的一部分。 存储器模块还包括时钟驱动器芯片和存储单元。 存储单元被配置为存储诸如序列号的模块识别信息。 存储单元还被配置为存储将模块上的电接触焊盘与堆叠的存储器封装上的各个信号引脚相关联的信息。 当误差校正子系统在存储器总线上检测到错误时，这可能允许将错误快速跟踪到堆叠存储器封装上的特定引脚。

公开(公告)号：US5793608A

公开(公告)日：1998-08-11

申请号：US661817

申请日：1996-06-11

申请人： Alan Lee Winick ,  Nagaraj Mitty ,  Gary A. Harpell

发明人： Alan Lee Winick ,  Nagaraj Mitty ,  Gary A. Harpell

IPC分类号： G06F1/20 ,  H01L23/467 ,  H05K7/20

CPC分类号： H01L23/467 ,  G06F1/20 ,  H01L2924/0002

摘要： An enclosure contains, among other components, hard drive cartridges, graphics or other option cards, power supply and a CPU and its support chips. The total power in the whole enclosure is about 325W and the CPU consumes about 30W of this total. For design purposes the components are closely positioned and hence heat dissipation is an important problem. Plural fans, as hereinafter disclosed, are used to circulate air. For the hard drive cartridges a fan snapped into a sidewall of the enclosure draws air from apertures in the bottom through the cartridge and into a plenum. For the CPU, an impingement fan discharges air directly downward on a heat sink positioned over the chip and into the plenum. Bulk flow fans discharge air from air intake vents in side walls of the enclosure as well as air discharged from the hard drive and CPU through an internal wall into a separate sub-enclosure for the power supply and thence to the exterior. Conventional fans are used but are positioned and inter-related so that the noise level is tolerable.

摘要翻译： 除了其他组件之外，机箱还包含硬盘驱动器盒，图形或其他选件卡，电源以及CPU及其支持芯片。 整个机箱的总功率约为325W，CPU总耗电量约为30W。 为了设计目的，组件是紧密定位的，因此散热是一个重要的问题。 下面公开的多个风扇用于使空气循环。 对于硬盘驱动器盒，风扇卡在外壳侧壁中的空气从底部的孔中吸入空气通过墨盒并进入增压室。 对于CPU，冲击风扇将空气直接向下放置在位于芯片上的散热片上并进入增压室。 散装流动风扇从外壳侧壁的进气通风口排出空气，以及从硬盘驱动器和CPU通过内壁排出的空气进入用于电源的外部单独的子外壳，从而进入外部。 常规的风扇被使用，但定位和相互关联，使得噪音水平是可以容忍的。