公开(公告)号：US09524949B2

公开(公告)日：2016-12-20

申请号：US15155228

申请日：2016-05-16

Applicant: Dexerials Corporation

Inventor： Kazunori Hamazaki ,  Takashi Matsumura ,  Daisuke Sato ,  Yasuhiro Suga

IPC: H01L21/00 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L24/92 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1623 ,  H01L2224/16238 ,  H01L2224/27334 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/32012 ,  H01L2224/32225 ,  H01L2224/3224 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81444 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/364 ,  H01L2924/381 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012

Abstract: A semiconductor device includes a semiconductor chip provided with a plurality of bumps arranged in a peripheral alignment, a substrate provided with a plurality of electrodes, and an insulating resin adhesive film. The semiconductor chip is affixed to the substrate via the insulating resin adhesive film such that the electrodes are in positions corresponding to the positions of the bumps. The insulating resin adhesive film has a minimum melt viscosity of 8×103 to 1×105 Pa·s, covers 70 to 90% the area of the region enclosed with the plurality of bumps, and heat cured. The bumps and the electrodes corresponding thereto are arranged so that they are opposed to each other and establish metallic contact therebetween. A periphery of the insulating resin adhesive film is defined between the plurality of bumps and the outer edge of the semiconductor chip, exclusive.

Abstract translation: 半导体器件包括设置有周向排列的多个凸块的半导体芯片，设置有多个电极的基板和绝缘树脂粘合膜。 半导体芯片通过绝缘树脂粘合膜固定到基板上，使得电极处于与凸块的位置对应的位置。 绝缘树脂粘合膜的最小熔融粘度为8×10 3〜1×10 5 Pa·s，覆盖多个凸起所包围的区域的面积为70〜90％，并进行热固化。 凸起和对应的电极被布置成使得它们彼此相对并且在它们之间建立金属接触。 绝缘树脂粘合膜的周边被限定在多个凸块和半导体芯片的外边缘之间。