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公开(公告)号：US07193168B1
公开(公告)日：2007-03-20
申请号：US11272582
申请日：2005-11-10
IPC分类号： H01H35/24
摘要： A pneumatic switch includes a housing which presents external contacts spaced apart to engage a component site on a device such as a circuit board. A pair of components are supported on the switch housing. A flexure mounted armature or vane is biased in one direction to electrically connect one of the pair of mounted components serially between the housing external contacts, while an air flow to the switch displaces the vane to electrically connect the other of the pair of components in series between the external contacts. The electrical leads between each of the pair of components and the external contacts are of equal length. The switch external contacts may also engage the terminals of a component at a circuit site to insert the mounted components alternatively in parallel with the existing component.
摘要翻译： 气动开关包括外壳，外壳间隔开以接合诸如电路板的装置上的部件位置。 开关外壳上支持一对部件。 弯曲安装的电枢或叶片在一个方向上被偏压以将这对安装的组件中的一个顺序地电连接在壳体外部触头之间，而到开关的空气流动使叶片电连接以串联的一对部件中的另一个 在外部触点之间。 一对部件和外部触点中的每一个之间的电引线具有相等的长度。 开关外部触点还可以与电路部件处的部件的端子接合，以将已安装部件与现有部件交替地插入。
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2.发明授权Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module 失效模块化散热器去耦电容阵列形成散热鳍片和功率分配插件模块公开(公告)号：US07235875B2
公开(公告)日：2007-06-26
申请号：US11008798
申请日：2004-12-09
申请人： Roger Allen Booth, Jr. , Matthew Stephen Doyle , Don Alan Gilliland , Brian Edward Gregg , Lynn Robert Landin , Thomas W. Liang , Ankur Kanu Patel , Dennis James Wurth
发明人： Roger Allen Booth, Jr. , Matthew Stephen Doyle , Don Alan Gilliland , Brian Edward Gregg , Lynn Robert Landin , Thomas W. Liang , Ankur Kanu Patel , Dennis James Wurth
CPC分类号： H05K1/0231 , H01L23/3672 , H01L23/50 , H01L2924/0002 , H05K1/0203 , H05K3/301 , H05K2201/10454 , H05K2201/2018 , H01L2924/00
摘要： A modular heat sink decoupling capacitor array includes a plurality of modules, each defining parallel distributed decoupling plates, and each module forming a heat sink fi. Each module includes multiple spaced apart contacts for providing low inductance connections with an associated device. A power distribution interposer module is attached to a heat sink surface of the modular decoupling capacitor. The interposer module is used for implementing power delivery without using valuable ball grid array (BGA) connections and printed circuit board (PCB) layers.
摘要翻译： 模块化散热器去耦电容器阵列包括多个模块，每个模块限定平行分布式去耦板，并且每个模块形成散热片fi。 每个模块包括多个间隔开的触点，用于与相关联的装置提供低电感连接。 功率分配插入器模块连接到模块化去耦电容器的散热器表面。 内插器模块用于实现功率输送，而不使用有价值的球栅阵列（BGA）连接和印刷电路板（PCB）层。
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公开(公告)号：US07310243B2
公开(公告)日：2007-12-18
申请号：US10865251
申请日：2004-06-10
IPC分类号： H05K9/00
CPC分类号： H05K1/023 , H05K1/0231 , H05K2201/09809 , H05K2201/10022 , H05K2201/1053
摘要： A method and components are provided for implementing EMC shielded resonance damping of a printed circuit board. The EMC shielded resonance damping component includes a capacitor and resistor formed in series combination and contained within a shielded enclosure. A pair of coaxial pads is provided for connection to the printed circuit board. The series combination of the capacitor and resistor is connected between a first pad of a pair of coaxial pads and an interior wall of the shielded enclosure. The shielded enclosure provides a return current path to a second pad of the pair of coaxial pads through the series components.
摘要翻译： 提供了一种用于实现印刷电路板的EMC屏蔽共振阻尼的方法和组件。 EMC屏蔽共振阻尼元件包括串联组合的电容器和电阻器，并且包含在屏蔽外壳内。 提供一对同轴焊盘用于连接到印刷电路板。 电容器和电阻器的串联组合连接在一对同轴衬垫的第一衬垫和屏蔽外壳的内壁之间。 屏蔽的外壳提供通过串联元件的一对同轴焊盘的第二焊盘的返回电流路径。
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4.发明授权Structures for implementing integrated conductor and capacitor in SMD packaging 失效在SMD封装中实现集成导体和电容器的结构公开(公告)号：US06906910B1
公开(公告)日：2005-06-14
申请号：US10760448
申请日：2004-01-20
CPC分类号： H01G2/065 , H01G4/385 , H01G4/40 , H05K1/0231 , H05K3/222 , H05K2201/10636 , Y02P70/611
摘要： Structures are provided for implementing an integrated conductor and capacitor in a surface mounted device (SMD) package. A first pair and a second pair of contacts contained within the SMD package respectively are provided in mating engagement with a first pair and a second pair of corresponding SMD package contacts. A conductor extends between the first pair of contacts, contained within the SMD package. A capacitor is defined between the second pair of contacts, contained within the SMD package. An additional one or pair of integral capacitors optionally is provided for providing additional capacitance to ground to decouple common mode noise from the power planes.
摘要翻译： 提供了用于在表面安装器件（SMD）封装中实现集成导体和电容器的结构。 分别包含在SMD封装内的第一对和第二对触点与第一对和第二对相应的SMD封装触点配合配合。 导体延伸在第一对触点之间，包含在SMD封装内。 在包装在SMD封装内的第二对触点之间限定电容器。 可选地提供另外的一对或一对整体电容器，用于向地面提供额外的电容以将共模噪声与电源平面分离。
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公开(公告)号：US20100061424A1
公开(公告)日：2010-03-11
申请号：US12206983
申请日：2008-09-09
申请人： Philip Raymond Germann , Mark James Jeanson , Jordan Ross Keuseman , Dennis James Wurth , George Russell Zettles, IV
发明人： Philip Raymond Germann , Mark James Jeanson , Jordan Ross Keuseman , Dennis James Wurth , George Russell Zettles, IV
IPC分类号： H04B1/69
CPC分类号： H04B1/69
摘要： A spread spectrum controller that adjusts frequency range subject to a bit error rate (BER). Measuring the bit error rate (BER) at different clock frequency ranges and comparing the BER to a BER threshold. Narrowing or widening the clock frequency range based on whether the BER is above or below the BER threshold to optimize a system for both performance and compliance.
摘要翻译： 扩频控制器，可以根据误码率（BER）调整频率范围。 测量不同时钟频率范围的误码率（BER），并将BER与BER阈值进行比较。 基于BER是否高于或低于BER阈值来缩小或扩大时钟频率范围，以优化系统的性能和兼容性。
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