-
公开(公告)号：US07193168B1
公开(公告)日：2007-03-20
申请号：US11272582
申请日：2005-11-10
IPC分类号： H01H35/24
摘要： A pneumatic switch includes a housing which presents external contacts spaced apart to engage a component site on a device such as a circuit board. A pair of components are supported on the switch housing. A flexure mounted armature or vane is biased in one direction to electrically connect one of the pair of mounted components serially between the housing external contacts, while an air flow to the switch displaces the vane to electrically connect the other of the pair of components in series between the external contacts. The electrical leads between each of the pair of components and the external contacts are of equal length. The switch external contacts may also engage the terminals of a component at a circuit site to insert the mounted components alternatively in parallel with the existing component.
摘要翻译： 气动开关包括外壳，外壳间隔开以接合诸如电路板的装置上的部件位置。 开关外壳上支持一对部件。 弯曲安装的电枢或叶片在一个方向上被偏压以将这对安装的组件中的一个顺序地电连接在壳体外部触头之间，而到开关的空气流动使叶片电连接以串联的一对部件中的另一个 在外部触点之间。 一对部件和外部触点中的每一个之间的电引线具有相等的长度。 开关外部触点还可以与电路部件处的部件的端子接合，以将已安装部件与现有部件交替地插入。
-
2.发明授权Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module 失效模块化散热器去耦电容阵列形成散热鳍片和功率分配插件模块公开(公告)号：US07235875B2
公开(公告)日：2007-06-26
申请号：US11008798
申请日：2004-12-09
申请人： Roger Allen Booth, Jr. , Matthew Stephen Doyle , Don Alan Gilliland , Brian Edward Gregg , Lynn Robert Landin , Thomas W. Liang , Ankur Kanu Patel , Dennis James Wurth
发明人： Roger Allen Booth, Jr. , Matthew Stephen Doyle , Don Alan Gilliland , Brian Edward Gregg , Lynn Robert Landin , Thomas W. Liang , Ankur Kanu Patel , Dennis James Wurth
CPC分类号： H05K1/0231 , H01L23/3672 , H01L23/50 , H01L2924/0002 , H05K1/0203 , H05K3/301 , H05K2201/10454 , H05K2201/2018 , H01L2924/00
摘要： A modular heat sink decoupling capacitor array includes a plurality of modules, each defining parallel distributed decoupling plates, and each module forming a heat sink fi. Each module includes multiple spaced apart contacts for providing low inductance connections with an associated device. A power distribution interposer module is attached to a heat sink surface of the modular decoupling capacitor. The interposer module is used for implementing power delivery without using valuable ball grid array (BGA) connections and printed circuit board (PCB) layers.
摘要翻译： 模块化散热器去耦电容器阵列包括多个模块，每个模块限定平行分布式去耦板，并且每个模块形成散热片fi。 每个模块包括多个间隔开的触点，用于与相关联的装置提供低电感连接。 功率分配插入器模块连接到模块化去耦电容器的散热器表面。 内插器模块用于实现功率输送，而不使用有价值的球栅阵列（BGA）连接和印刷电路板（PCB）层。
-
3.发明授权Structures for implementing integrated conductor and capacitor in SMD packaging 失效在SMD封装中实现集成导体和电容器的结构公开(公告)号：US06906910B1
公开(公告)日：2005-06-14
申请号：US10760448
申请日：2004-01-20
CPC分类号： H01G2/065 , H01G4/385 , H01G4/40 , H05K1/0231 , H05K3/222 , H05K2201/10636 , Y02P70/611
摘要： Structures are provided for implementing an integrated conductor and capacitor in a surface mounted device (SMD) package. A first pair and a second pair of contacts contained within the SMD package respectively are provided in mating engagement with a first pair and a second pair of corresponding SMD package contacts. A conductor extends between the first pair of contacts, contained within the SMD package. A capacitor is defined between the second pair of contacts, contained within the SMD package. An additional one or pair of integral capacitors optionally is provided for providing additional capacitance to ground to decouple common mode noise from the power planes.
摘要翻译： 提供了用于在表面安装器件（SMD）封装中实现集成导体和电容器的结构。 分别包含在SMD封装内的第一对和第二对触点与第一对和第二对相应的SMD封装触点配合配合。 导体延伸在第一对触点之间，包含在SMD封装内。 在包装在SMD封装内的第二对触点之间限定电容器。 可选地提供另外的一对或一对整体电容器，用于向地面提供额外的电容以将共模噪声与电源平面分离。
-
公开(公告)号：US07310243B2
公开(公告)日：2007-12-18
申请号：US10865251
申请日：2004-06-10
IPC分类号： H05K9/00
CPC分类号： H05K1/023 , H05K1/0231 , H05K2201/09809 , H05K2201/10022 , H05K2201/1053
摘要： A method and components are provided for implementing EMC shielded resonance damping of a printed circuit board. The EMC shielded resonance damping component includes a capacitor and resistor formed in series combination and contained within a shielded enclosure. A pair of coaxial pads is provided for connection to the printed circuit board. The series combination of the capacitor and resistor is connected between a first pad of a pair of coaxial pads and an interior wall of the shielded enclosure. The shielded enclosure provides a return current path to a second pad of the pair of coaxial pads through the series components.
摘要翻译： 提供了一种用于实现印刷电路板的EMC屏蔽共振阻尼的方法和组件。 EMC屏蔽共振阻尼元件包括串联组合的电容器和电阻器，并且包含在屏蔽外壳内。 提供一对同轴焊盘用于连接到印刷电路板。 电容器和电阻器的串联组合连接在一对同轴衬垫的第一衬垫和屏蔽外壳的内壁之间。 屏蔽的外壳提供通过串联元件的一对同轴焊盘的第二焊盘的返回电流路径。
-
5.发明申请Cylindrical Impedance Matching Connector Standoff with Optional Common Mode Ferrite 失效圆柱形阻抗匹配连接器支架与可选共模铁氧体公开(公告)号：US20080032522A1
公开(公告)日：2008-02-07
申请号：US11460345
申请日：2006-07-27
申请人： Don Alan Gilliland
发明人： Don Alan Gilliland
IPC分类号： H01R12/00
CPC分类号： H01R12/7082 , G01R31/2812 , H01R12/714 , H01R13/658 , H05K1/144 , H05K2201/042 , H05K2201/2036 , Y10S439/912
摘要： The present invention generally relates to providing a controlled impedance connection between two PCBs. A connector may connect a first PCB to a second PCB. The connector may comprise of a body made from a dielectric material and a plurality of conductive lines defined in the dielectric material. One or more of the conductive lines may transfer one or more signals between the PCBs. A return path may be provided for each signal line. Furthermore, the width, length, and the proximity of a signal line and its associated return line may be selected to match the impedance of the connector to the impedance of the PCB. The connector may also contain one or more ferrite layers to suppress electromagnetic radiation caused by common mode currents.
摘要翻译： 本发明一般涉及在两个PCB之间提供受控阻抗连接。 连接器可以将第一PCB连接到第二PCB。 连接器可以包括由介电材料制成的主体和限定在电介质材料中的多个导电线。 一个或多个导线可以在PCB之间传送一个或多个信号。 可以为每个信号线提供返回路径。 此外，可以选择信号线及其相关联的返回线的宽度，长度和接近度以将连接器的阻抗与PCB的阻抗相匹配。 连接器还可以包含一个或多个铁氧体层，以抑制由共模电流引起的电磁辐射。
-
公开(公告)号：US07221235B2
公开(公告)日：2007-05-22
申请号：US11106005
申请日：2005-04-14
申请人： Don Alan Gilliland
发明人： Don Alan Gilliland
CPC分类号： H04B3/28 , H01F21/06 , H01F21/10 , H01F2017/065
摘要： A device, system, and method for suppressing electromagnetic interference (EMI). In one embodiment, an EMI suppression device includes a compound ferrite core having an inner ferrite core and an outer ferrite core. The inner core includes a through hole in which a conductor may be mounted, and the outer core includes a hole in which said inner core is mounted in a concentrically offset manner. The outer core is rotatably adjustable with respect to the inner core in a manner such that the ferrite circuit cross-section area may be varied. The magnetic reluctance of the compound core is controlled in accordance with EMI suppression requirements by adjusting the circuit cross-section area.
摘要翻译： 用于抑制电磁干扰（EMI）的装置，系统和方法。 在一个实施例中，EMI抑制装置包括具有内部铁氧体磁芯和外部铁氧体磁心的复合铁氧体磁芯。 内芯包括可以安装导体的通孔，并且外芯包括以同心偏心的方式安装所述内芯的孔。 外芯可以相对于内芯可旋转地调节，使得铁氧体电路的横截面积可以变化。 根据EMI抑制要求，通过调整电路横截面积来控制复合磁芯的磁阻。
-
公开(公告)号：US07011503B2
公开(公告)日：2006-03-14
申请号：US10845500
申请日：2004-05-13
IPC分类号： F04D29/38
CPC分类号： F04D29/382 , F04D27/008
摘要： A fan and a fan blade are provided for allowing airflow through the fan blade in a fan failure condition. The fan blade includes a peripheral member defining an opening. A flexible cover member is attached to the peripheral member for covering the fan blade opening during normal operation of the fan. The flexible cover member is hingeably attached to the peripheral member for movement away from the peripheral member enabling airflow through the fan blade opening in a fan failure condition.
摘要翻译： 提供风扇和风扇叶片，用于在风扇故障状态下允许气流通过风扇叶片。 风扇叶片包括限定开口的周边构件。 柔性盖构件附接到周边构件，用于在风扇的正常操作期间覆盖风扇叶片开口。 柔性盖构件可铰接地附接到周边构件，用于远离周边构件移动，使得能够在风扇故障状态下气流通过风扇叶片开口。
-
公开(公告)号：US06818822B1
公开(公告)日：2004-11-16
申请号：US10821145
申请日：2004-04-08
IPC分类号： H05K900
CPC分类号： H05K9/0015 , Y10S277/92
摘要： A novel conductive gasket including an internal contact-enhancing strip provides improved contact performance in electromagnetic interference prevention and other applications. A metal mesh or conductive plastic covers a substantially rigid internal strip that includes protrusions that either bend or penetrate the gasket cover in order to enhance contact with another conductive surface. The cover may include holes aligned with the protrusions so that the protrusions pass through the holes when the gasket is compressed, or the protrusions may penetrate a mesh or plastic cover. An internal foam piece may be provided behind the internal strip to restore the shape of the when compressive force is removed and a second internal foam piece may be provided between the strip and the cover for maintaining the shape of the gasket. The protrusions on the internal strip may range from needle-shaped protrusions for puncturing a coating to relatively smooth bumps for bending the surface of the cover when the gasket is compressed.
摘要翻译： 包括内部接触增强带的新型导电垫片在防止电磁干扰和其它应用中提供了改进的接触性能。 金属网或导电塑料覆盖基本上刚性的内部条，其包括弯曲或穿透垫圈盖的凸起，以便增强与另一导电表面的接触。 盖可以包括与突起对准的孔，使得当垫圈被压缩时突起穿过孔，或者突起可以穿透网状物或塑料盖。 内部泡沫件可以设置在内部条带的后面，以恢复当压缩力被去除时的形状，并且可以在带和盖之间设置第二内部泡沫件，以保持垫圈的形状。 内部条带上的突出部分可以是用于刺穿涂层的针状突起，当垫片被压缩时用于弯曲盖表面的相对平滑的凸块。
-
公开(公告)号：US06767157B2
公开(公告)日：2004-07-27
申请号：US10255520
申请日：2002-09-26
IPC分类号： A60R9048
CPC分类号： F16B2/185 , F16B21/09 , H05K7/142 , Y10T403/59 , Y10T403/68 , Y10T403/7064
摘要： Methods and apparatus disclosed for providing a fastener that can hold suitably flat planar objects. No tools are required to actuate the fastener. The fastener holds the object with a predetermined range of force, determined by a built-in spring when actuated. The fastener is particularly suited for fastening Printed Wiring Boards (PWBs) in an electronics enclosure, and holds the PWBs in position, as well as providing electrical coupling of a voltage supply used on the PWB to the electronic enclosure.
摘要翻译： 公开的用于提供可容纳适当平坦平面物体的紧固件的方法和装置。 不需要工具来致动紧固件。 紧固件以预定的力范围保持物体，由致动的内置弹簧确定。 紧固件特别适用于将印刷电路板（PWB）紧固在电子外壳中，并将PWB保持在适当位置，以及将PWB上使用的电压电源与电子外壳的电气耦合。
-
10.发明授权公开(公告)号：US07573709B2
公开(公告)日：2009-08-11
申请号：US12183249
申请日：2008-07-31
CPC分类号： H01L23/552 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes thermal contact with an electronic module mounted on the PCB. The base makes electrical contact with a peripheral surface of the heat sink, and multiple-jointed spring fingers extend from the base to make electrical contact with conductive pads on the PCB. During compression, the movement of each spring finger's tip is substantially limited to the z-axis. Accordingly, the final installed location of the tip can be precisely controlled even when the grounding spring must accommodate a wide variety of installed heights of the heat sink relative to the PCB. Preferably, the spring fingers terminate with a concave tip that is less susceptible to sliding off the conductive pads.
摘要翻译： 用于电磁干扰（EMI）抑制的接地弹簧介于散热器和印刷电路板（PCB）之间。 接地弹簧包括导电材料，其具有形成在其底部的开口，散热器通过该开口与安装在PCB上的电子模块进行热接触。 基座与散热器的外周表面电接触，多接头弹簧指从基座延伸以与PCB上的导电焊盘电接触。 在压缩期间，每个弹簧手指的尖端的运动基本上限于z轴。 因此，即使当接地弹簧必须适应相对于PCB的散热器的各种各样的安装高度时，尖端的最终安装位置也可被精确地控制。 优选地，弹簧指终止于不太易于从导电垫滑下的凹形尖端。
-
-
-
-
-
-
-
-
-
搜索结果
43 条记录 (耗时 0.03 秒)