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公开(公告)号:US20100044084A1
公开(公告)日:2010-02-25
申请号:US12289273
申请日:2008-10-23
申请人: Dong Gyu LEE , Seon Jae MUN , Jin Won CHOI , Tae Joon CHUNG
发明人: Dong Gyu LEE , Seon Jae MUN , Jin Won CHOI , Tae Joon CHUNG
CPC分类号: H05K3/3473 , H01L21/4853 , H01L23/49816 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05027 , H01L2224/05111 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05568 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/16 , H05K3/243 , H05K3/244 , H05K3/4007 , H05K2201/0367 , H05K2203/025 , H05K2203/043 , H05K2203/054 , Y10T29/49149 , H01L2924/00014 , H01L2924/01079 , H01L2924/013 , H01L2924/01028
摘要: Provided is a printed circuit board (PCB) including a substrate that has a pad formed thereon; solder resist that is disposed on the substrate so as to expose the pad; a post that is disposed on the post; a surface-treatment layer that is disposed on the post; and a bump that is disposed on the surface-treatment layer.
摘要翻译: 提供了一种印刷电路板(PCB),其包括其上形成有焊盘的基板; 阻焊剂,其设置在基板上以露出焊盘; 邮寄处置的职位; 设置在所述柱上的表面处理层; 以及设置在表面处理层上的凸块。