公开(公告)号：US20110186991A1

公开(公告)日：2011-08-04

申请号：US12926314

申请日：2010-11-09

申请人： Dong Gyu Lee ,  Dae Young Lee ,  Tae Joon Chung ,  Seon Jae Mun ,  Jin Won Choi

发明人： Dong Gyu Lee ,  Dae Young Lee ,  Tae Joon Chung ,  Seon Jae Mun ,  Jin Won Choi

IPC分类号： H01L23/485 ,  H01L21/441

CPC分类号： H01L21/4853 ,  H01L21/441 ,  H01L23/485 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13082

摘要： There is provided a package substrate capable of controlling the degree of warpage thereof by improving the composition and formation of a post terminal and a method of fabricating the same. The package substrate includes a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a separation barrier layer provided on the conductive pad inside the opening and formed to be higher than the upper surface of the insulating layer along the side walls thereof; a post terminal provided on the separation barrier layer; and a solder bump provided on the post terminal.

摘要翻译： 提供一种能够通过改善后端子的组成和形成来控制其翘曲程度的封装基板及其制造方法。 封装衬底包括具有至少一个导电焊盘的衬底; 绝缘层，设置在所述基板上并具有用于暴露所述导电焊盘的开口; 隔离层，设置在所述开口内的所述导电垫上，并形成为比所述绝缘层的所述侧壁的上表面高; 设置在分离阻挡层上的柱状端子; 以及设置在柱端子上的焊料凸块。

公开(公告)号：US20090025581A1

公开(公告)日：2009-01-29

申请号：US12003491

申请日：2007-12-26

申请人： Soon Jin Cho ,  Seon Jae Mun ,  Jin Won Choi

发明人： Soon Jin Cho ,  Seon Jae Mun ,  Jin Won Choi

IPC分类号： B05C17/06 ,  B41M1/12

CPC分类号： H05K3/1225 ,  B41P2215/12

摘要： This invention relates to a mask for screen printing, which includes a mask body composed of a plurality of pattern areas having holes for screen printing and a peripheral area surrounding the outside of the pattern areas; and a protrusion portion formed in the peripheral area of a back surface of the mask body, and to a screen printing method using the same.

摘要翻译： 本发明涉及一种丝网印刷用掩模，其包括由具有丝网印刷用孔的多个图案区域和围绕图案区域外部的周边区域构成的掩模体; 以及形成在面罩主体的后表面的周边区域中的突出部分，以及使用该突起部分的丝网印刷方法。

公开(公告)号：US08671564B2

公开(公告)日：2014-03-18

申请号：US12554762

申请日：2009-09-04

申请人： Hueng Jae Oh ,  Tae Joon Chung ,  Dong Gyu Lee ,  Seon Jae Mun ,  Jin Won Choi

发明人： Hueng Jae Oh ,  Tae Joon Chung ,  Dong Gyu Lee ,  Seon Jae Mun ,  Jin Won Choi

IPC分类号： H01K3/10

CPC分类号： H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/12042 ,  H05K3/243 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/1025 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

摘要： Disclosed is a substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.

摘要翻译： 公开了一种用于倒装芯片接合的基板，其中在焊盘和金属柱之间形成基底焊料层，从而提高耐冲击性和安装可靠性。 还提供了一种制造用于倒装芯片接合的基板的方法。

公开(公告)号：US08486760B2

公开(公告)日：2013-07-16

申请号：US12923621

申请日：2010-09-29

申请人： Tae Joon Chung ,  Jin Won Choi ,  Dong Gyu Lee ,  Hueng Jae Oh ,  Seon Jae Mun

发明人： Tae Joon Chung ,  Jin Won Choi ,  Dong Gyu Lee ,  Hueng Jae Oh ,  Seon Jae Mun

IPC分类号： H01L23/522

CPC分类号： H05K3/4007 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2203/043 ,  H05K2203/054 ,  H01L2924/00014 ,  H01L2224/13099

摘要： There is provided a method of manufacturing a substrate for flip chip, and a substrate for flip chip manufactured using the same. The method includes providing a base substrate including at least one conductive pad, forming a solder resist layer on the base substrate, the solder resist layer including a first opening exposing the conductive pad, forming a dry film on the solder resist layer, the dry film including a second opening connected with the first opening, forming a metal post in the first opening and a part of the second opening, filling the second opening above the metal post with solder paste, forming a solder cap by performing a reflow process on the filled solder paste, planarizing a surface of the solder cap, and removing the dry film. Accordingly, fine pitches and improve reliability can be achieved.

摘要翻译： 提供了制造用于倒装芯片的基板的方法和使用其制造的用于倒装芯片的基板。 该方法包括提供包括至少一个导电焊盘的基底衬底，在基底衬底上形成阻焊层，阻焊层包括暴露导电焊盘的第一开口，在阻焊层上形成干膜，干膜 包括与所述第一开口连接的第二开口，在所述第一开口中形成金属柱和所述第二开口的一部分，用焊膏填充所述金属柱上方的所述第二开口，通过对填充的所述第二开口进行回流处理来形成焊料盖 焊膏，使焊盘的表面平坦化，并除去干膜。 因此，可以实现精细的间距和提高可靠性。

公开(公告)号：US08456003B2

公开(公告)日：2013-06-04

申请号：US12926314

申请日：2010-11-09

申请人： Dong Gyu Lee ,  Dae Young Lee ,  Tae Joon Chung ,  Seon Jae Mun ,  Jin Won Choi

发明人： Dong Gyu Lee ,  Dae Young Lee ,  Tae Joon Chung ,  Seon Jae Mun ,  Jin Won Choi

IPC分类号： H01L2225/06513 ,  H01L2224/9201 ,  H01L2225/06517

CPC分类号： H01L21/4853 ,  H01L21/441 ,  H01L23/485 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13082

摘要： There is provided a package substrate capable of controlling the degree of warpage thereof by improving the composition and formation of a post terminal and a method of fabricating the same. The package substrate includes a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a separation barrier layer provided on the conductive pad inside the opening and formed to be higher than the upper surface of the insulating layer along the side walls thereof; a post terminal provided on the separation barrier layer; and a solder bump provided on the post terminal.

摘要翻译： 提供一种能够通过改善后端子的组成和形成来控制其翘曲程度的封装基板及其制造方法。 封装衬底包括具有至少一个导电焊盘的衬底; 绝缘层，设置在所述基板上并具有用于暴露所述导电焊盘的开口; 隔离层，设置在所述开口内的所述导电垫上，并形成为比所述绝缘层的所述侧壁的上表面高; 设置在分离阻挡层上的柱状端子; 以及设置在柱端子上的焊料凸块。

公开(公告)号：US20100314161A1

公开(公告)日：2010-12-16

申请号：US12554762

申请日：2009-09-04

申请人： Hueng Jae OH ,  Tae Joon Chung ,  Dong Gyu Lee ,  Seon Jae Mun ,  Jin Won Choi

发明人： Hueng Jae OH ,  Tae Joon Chung ,  Dong Gyu Lee ,  Seon Jae Mun ,  Jin Won Choi

IPC分类号： H05K1/09 ,  B05D5/12

CPC分类号： H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/12042 ,  H05K3/243 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/1025 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

摘要： Disclosed is a substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.

摘要翻译： 公开了一种用于倒装芯片接合的基板，其中在焊盘和金属柱之间形成基底焊料层，从而提高耐冲击性和安装可靠性。 还提供了一种制造用于倒装芯片接合的基板的方法。

公开(公告)号：US20100271792A1

公开(公告)日：2010-10-28

申请号：US12612158

申请日：2009-11-04

申请人： Jin-Won Choi ,  Soon-Jin Cho ,  Hueng-Jae Oh ,  Seung-Wan Kim ,  Seon-Jae Mun

发明人： Jin-Won Choi ,  Soon-Jin Cho ,  Hueng-Jae Oh ,  Seung-Wan Kim ,  Seon-Jae Mun

IPC分类号： H05K7/02 ,  B23K31/02

CPC分类号： B23K1/0016 ,  B23K2101/42 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H05K3/243 ,  H05K3/3452 ,  H05K2201/0367 ,  H05K2201/0989 ,  H05K2203/054 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An electronic component package and a method of manufacturing the same are disclosed. The method can include: providing a board, on which a multiple number of pads are formed; forming a solder resist layer, in which an opening superimposing over all of the pads is formed, on the board; forming metal posts over the pads, respectively; mounting an electronic component on the board by bonding the electrodes to the metal posts; and forming an underfill resin layer in the opening such that the underfill resin layer is interposed between the electronic component and the board. The solder resist layer may function as a dam that prevents the underfill resin layer from leaking in lateral directions during the subsequent underfill process so that the additional processes, such as dispensing, etc., that were required for forming a separate dam can be omitted, and the process time and costs can be reduced.

摘要翻译： 公开了一种电子部件封装及其制造方法。 该方法可以包括：提供一个板，其上形成多个焊盘; 形成阻焊层，其中在所述板上形成叠加在所有焊盘上的开口; 分别在焊盘上形成金属柱; 通过将电极粘合到金属柱上来将电子部件安装在电路板上; 并且在开口中形成底部填充树脂层，使得底部填充树脂层插入在电子部件和板之间。 阻焊层可以用作防止底部填充树脂层在随后的底部填充过程中在侧向泄漏的坝，从而可以省略形成单独的坝所需的附加过程，例如分配等， 并且可以减少处理时间和成本。

公开(公告)号：US20100044084A1

公开(公告)日：2010-02-25

申请号：US12289273

申请日：2008-10-23

申请人： Dong Gyu LEE ,  Seon Jae MUN ,  Jin Won CHOI ,  Tae Joon CHUNG

发明人： Dong Gyu LEE ,  Seon Jae MUN ,  Jin Won CHOI ,  Tae Joon CHUNG

IPC分类号： H05K1/11 ,  H05K1/09 ,  H05K3/00

CPC分类号： H05K3/3473 ,  H01L21/4853 ,  H01L23/49816 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/05111 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/16 ,  H05K3/243 ,  H05K3/244 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/025 ,  H05K2203/043 ,  H05K2203/054 ,  Y10T29/49149 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/013 ,  H01L2924/01028

摘要： Provided is a printed circuit board (PCB) including a substrate that has a pad formed thereon; solder resist that is disposed on the substrate so as to expose the pad; a post that is disposed on the post; a surface-treatment layer that is disposed on the post; and a bump that is disposed on the surface-treatment layer.

摘要翻译： 提供了一种印刷电路板（PCB），其包括其上形成有焊盘的基板; 阻焊剂，其设置在基板上以露出焊盘; 邮寄处置的职位; 设置在所述柱上的表面处理层; 以及设置在表面处理层上的凸块。

公开(公告)号：US20100132998A1

公开(公告)日：2010-06-03

申请号：US12379760

申请日：2009-02-27

申请人： Dong Gyu Lee ,  Jin Won Choi ,  Young Gwan Ko ,  Seon Jae Mun ,  Tae Joon Chung

发明人： Dong Gyu Lee ,  Jin Won Choi ,  Young Gwan Ko ,  Seon Jae Mun ,  Tae Joon Chung

IPC分类号： H05K1/11 ,  B05D5/12

CPC分类号： H05K3/3484 ,  H01L23/49816 ,  H01L23/49894 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/13022 ,  H01L2224/16 ,  H01L2924/0002 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H05K3/243 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/043 ,  H05K2203/054 ,  H05K2203/0568 ,  H05K2203/0571 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2224/05552

摘要： The invention relates to a substrate having a metal post and a method of manufacturing the same, in which a round solder bump part formed on a metal post melts and flows down along a lateral surface of the metal post by being subjected twice to a reflow process, thus forming a solder bump film for preventing oxidation and corrosion of the metal post.

摘要翻译： 本发明涉及一种具有金属柱的基板及其制造方法，其中形成在金属柱上的圆形焊料凸块部件通过经受两次回流工艺而沿着金属柱的侧表面熔化并向下流动 ，从而形成用于防止金属柱的氧化和腐蚀的焊料凸块膜。

公开(公告)号：US20120047671A1

公开(公告)日：2012-03-01

申请号：US12987900

申请日：2011-01-10

申请人： Yeo Il Park ,  Seon Jae Mun ,  Jun Hyeong Park ,  Seung Wan Kim ,  Sun Moon Kim ,  Dong Sun Kim ,  Seung Ho Beak ,  Chang Hee Lee

发明人： Yeo Il Park ,  Seon Jae Mun ,  Jun Hyeong Park ,  Seung Wan Kim ,  Sun Moon Kim ,  Dong Sun Kim ,  Seung Ho Beak ,  Chang Hee Lee

IPC分类号： A47L1/06

CPC分类号： H01L24/742 ,  B23K1/0016 ,  B23K3/0607 ,  B23K3/08 ,  B23K2101/42 ,  H01L24/11 ,  H01L2224/1132 ,  H01L2224/131 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00

摘要： A squeegee module. The squeegee module of the present invention includes a rotary unit rotated in opposite directions, support rods mounted to the rotary unit on opposite sides of the center of the rotary unit, a squeegee holder connected to ends of the support rods, and a squeegee blade mounted to the squeegee holder, wherein the squeegee holder moves upwards and downwards in cooperation with rotation of the rotary unit, thus controlling the inclination angle of the squeegee blade.

摘要翻译： 刮板模块。 本发明的刮板组件包括沿相反方向旋转的旋转单元，在旋转单元的中心的相对侧上安装到旋转单元的支撑杆，连接到支撑杆的端部的刮板保持器，以及安装 与刮刀保持器相关联，其中，刮板保持件与旋转单元的旋转协同地上下移动，从而控制刮板的倾斜角度。