RESIN COMPOSITION FOR ORGANIC INSULATING LAYER, METHOD OF MANUFACTURING RESIN COMPOSITION, AND DISPLAY PANEL INCLUDING RESIN COMPOSITION
    1.
    发明申请
    RESIN COMPOSITION FOR ORGANIC INSULATING LAYER, METHOD OF MANUFACTURING RESIN COMPOSITION, AND DISPLAY PANEL INCLUDING RESIN COMPOSITION 有权
    有机绝缘层用树脂组合物,树脂组合物的制造方法以及包含树脂组合物的显示面板

    公开(公告)号:US20070184293A1

    公开(公告)日:2007-08-09

    申请号:US11670700

    申请日:2007-02-02

    IPC分类号: B32B27/30 C08F24/00 C08F36/22

    摘要: Disclosed herein is a resin composition for an organic insulating layer, a method of manufacturing the same, and a display panel including an insulating layer formed using the resin composition. The resin composition for an organic insulating layer is produced by polymerizing about 5 to about 35 wt % of an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride, or a mixture of the unsaturated carboxylic acid and the unsaturated carboxylic acid anhydride, about 5 to about 40 wt % of a styrene compound, about 5 to about 40 wt % of an epoxy compound, about 0.1 to about 10 wt % of an isobornyl compound, and about 20 to about 40 wt % of a dicyclopentadiene compound, based on the total weight of unsaturated carboxylic acid, unsaturated carboxylic acid anhydride, styrene compound, isobornyl compound, and dicyclopentadiene compound.

    摘要翻译: 本发明公开了一种有机绝缘层用树脂组合物及其制造方法以及使用该树脂组合物形成的绝缘层的显示面板。 用于有机绝缘层的树脂组合物通过将约5至约35重量%的不饱和羧酸,不饱和羧酸酐或不饱和羧酸和不饱和羧酸酐的混合物聚合为约5至约 40重量%的苯乙烯化合物,约5至约40重量%的环氧化合物,约0.1至约10重量%的异冰片基化合物和约20至约40重量%的二环戊二烯化合物,基于总重量 的不饱和羧酸,不饱和羧酸酐,苯乙烯化合物,异冰片基化合物和二环戊二烯化合物。