Semiconductor layered structure
    1.
    发明申请
    Semiconductor layered structure 审中-公开
    半导体分层结构

    公开(公告)号:US20080006829A1

    公开(公告)日:2008-01-10

    申请号:US11646319

    申请日:2006-12-28

    IPC分类号: H01L29/15 H01L31/0256

    摘要: A semiconductor structure includes: a base layer formed with an array of recesses; a first epitaxial layer stacked on the base layer and extending into the recesses in the base layer; a patterned mask layer stacked on the first epitaxial layer; and a second epitaxial layer having a first portion that corresponds to the recesses in the base layer and that extends through the mask layer to contact the first epitaxial layer, and a second portion that is stacked on the mask layer.

    摘要翻译: 半导体结构包括:形成有凹槽阵列的基底层; 第一外延层,堆叠在基底层上并延伸到基底层的凹部中; 层叠在所述第一外延层上的图案化掩模层; 以及第二外延层,其具有对应于所述基底层中的所述凹部的第一部分,并且延伸穿过所述掩模层以接触所述第一外延层,以及层叠在所述掩模层上的第二部分。

    Light emitting device
    2.
    发明申请
    Light emitting device 有权
    发光装置

    公开(公告)号:US20070206130A1

    公开(公告)日:2007-09-06

    申请号:US11488012

    申请日:2006-07-18

    IPC分类号: G02F1/1333

    CPC分类号: H01L33/10 H01L33/20

    摘要: A light emitting device includes: a light-enhancing layered structure of a hexagonal crystal system, the light-enhancing layered structure including a light-enhancing layer having a planar surface that is formed with a plurality of light-enhancing units thereon, each of the light-enhancing units extending in a normal direction relative to the planar surface, being tapered from the planar surface, and having three inclined faces that are adjoined side-by-side and that are respectively parallel to corresponding symmetrical ones of the crystal planes {11 2 k} of the hexagonal crystal system, where k=2 to 5; and a light emitting layered structure formed on the light-enhancing layered structure.

    摘要翻译: 发光器件包括:六方晶系的增光层状结构,所述光增强层状结构包括具有在其上形成有多个光增强单元的平坦表面的光增强层, 相对于平面在法线方向延伸的光增强单元从平面呈锥形,并且具有并列邻接的三个倾斜面,并且分别与晶面{11 其中 2 k},其中 k = 2至5; 以及形成在增光分层结构上的发光层状结构。

    Light emitting device
    3.
    发明授权
    Light emitting device 有权
    发光装置

    公开(公告)号:US07511307B2

    公开(公告)日:2009-03-31

    申请号:US11488012

    申请日:2006-07-18

    IPC分类号: H01L27/15 H01L33/00

    CPC分类号: H01L33/10 H01L33/20

    摘要: A light emitting device includes: a light-enhancing layered structure of a hexagonal crystal system, the light-enhancing layered structure including a light-enhancing layer having a planar surface that is formed with a plurality of light-enhancing units thereon, each of the light-enhancing units extending in a normal direction relative to the planar surface, being tapered from the planar surface, and having three inclined faces that are adjoined side-by-side and that are respectively parallel to corresponding symmetrical ones of the crystal planes {11 2 k} of the hexagonal crystal system, where k=2 to 5; and a light emitting layered structure formed on the light-enhancing layered structure.

    摘要翻译: 发光器件包括:六方晶系的增光层状结构,所述光增强层状结构包括具有在其上形成有多个光增强单元的平坦表面的光增强层, 相对于平面在法线方向延伸的光增强单元从平面呈锥形,并且具有并列邻接的三个倾斜面,并且分别与晶面{11 其中 k = 2至5;其中 k> 以及形成在增光分层结构上的发光层状结构。

    Light-emitting diode chip with high light extraction and method for manufacturing the same
    4.
    发明授权
    Light-emitting diode chip with high light extraction and method for manufacturing the same 有权
    具有高光提取的发光二极管芯片及其制造方法

    公开(公告)号:US08895332B2

    公开(公告)日:2014-11-25

    申请号:US12701336

    申请日:2010-02-05

    摘要: This invention provides a light-emitting diode chip with high light extraction, which includes a substrate, an epitaxial-layer structure for generating light by electric-optical effect, a transparent reflective layer sandwiched between the substrate and the epitaxial-layer structure, and a pair of electrodes for providing power supply to the epitaxial-layer structure. A bottom surface and top surface of the epitaxial-layer structure are roughened to have a roughness not less than 100 nm root mean square (rms). The light generated by the epitaxial-layer structure is hence effectively extracted out. A transparent reflective layer not more than 5 μm rms is formed as an interface between the substrate and the epitaxial-layer structure. The light toward the substrate is more effectively reflected upward. The light extraction and brightness are thus enhanced. Methods for manufacturing the light-emitting diode chip of the present invention are also provided.

    摘要翻译: 本发明提供一种具有高光提取的发光二极管芯片,其包括基板,通过电光效应产生光的外延层结构,夹在基板和外延层结构之间的透明反射层,以及 一对用于向外延层结构提供电源的电极。 外延层结构的底表面和顶表面被粗糙化以具有不小于100nm均方根(rms)的粗糙度。 因此外延层结构产生的光被有效地抽出。 形成不大于5μm的透明反射层作为衬底和外延层结构之间的界面。 朝向基板的光更有效地向上反射。 因此光提取和亮度增强。 还提供了用于制造本发明的发光二极管芯片的方法。

    Light emitting diode
    7.
    发明授权
    Light emitting diode 有权
    发光二极管

    公开(公告)号:US08624262B2

    公开(公告)日:2014-01-07

    申请号:US12903852

    申请日:2010-10-13

    CPC分类号: H01L33/22 H01L33/0079

    摘要: A light emitting diode includes: an electrically conductive permanent substrate having a reflective top surface; an epitaxial film disposed on the reflective top surface of the permanent substrate and having an upper surface and a roughened lower surface that is opposite to the upper surface, the roughened lower surface having a roughness with a height of not less than 300 nm and a plurality of peaks which are in ohmic contact with the reflective top surface; an optical adhesive filled in a gap between the lower surface and the reflective top surface and connecting the epitaxial film to the permanent substrate; and a top electrode disposed on the upper surface and in ohmic contact with the epitaxial film.

    摘要翻译: 发光二极管包括:具有反射顶表面的导电永久性基板; 外延膜设置在永久性基板的反射上表面上,具有与上表面相对的上表面和粗糙化的下表面,粗糙化的下表面具有不小于300nm的高度的粗糙度和多个 与反射顶表面欧姆接触的峰; 填充在下表面和反射顶表面之间的间隙中并将外延膜连接到永久基板的光学粘合剂; 以及设置在上表面上并与外延膜欧姆接触的顶电极。

    Light emitting diode
    9.
    发明授权
    Light emitting diode 有权
    发光二极管

    公开(公告)号:US08076689B2

    公开(公告)日:2011-12-13

    申请号:US12540635

    申请日:2009-08-13

    IPC分类号: H01L33/00

    CPC分类号: H01L33/22 H01L33/0079

    摘要: A light emitting diode includes an epitaxial layer, an electrode, electrically conductive members, a light incident layer, a light reflecting layer, an adhesive, and an electrically conductive permanent substrate. The epitaxial layer has first and second surfaces. The electrode is disposed on the second surface of the epitaxial layer. The electrically conductive members are formed on the first surface of the epitaxial layer and are spaced apart from each other. The light incident layer is formed on the first surface of the epitaxial layer at regions where none of the electrically conductive members are formed. The light reflecting layer is formed on the light incident layer and the electrically conductive members, and has indented parts and non-indented parts. The adhesive is disposed in the indented parts of the light reflecting layer. The permanent substrate is bonded to the light reflecting layer through the adhesive and through wafer bonding.

    摘要翻译: 发光二极管包括外延层,电极,导电构件,光入射层,光反射层,粘合剂和导电永久基板。 外延层具有第一和第二表面。 电极设置在外延层的第二表面上。 导电构件形成在外延层的第一表面上并且彼此间隔开。 在不形成导电构件的区域,在外延层的第一表面上形成光入射层。 光反射层形成在光入射层和导电构件上,并且具有凹入部分和非凹进部分。 粘合剂设置在光反射层的凹进部分中。 永久性基板通过粘合剂并通过晶片接合结合到光反射层。

    LIGHT EMITTING DIODE
    10.
    发明申请
    LIGHT EMITTING DIODE 有权
    发光二极管

    公开(公告)号:US20110024783A1

    公开(公告)日:2011-02-03

    申请号:US12903852

    申请日:2010-10-13

    IPC分类号: H01L33/60

    CPC分类号: H01L33/22 H01L33/0079

    摘要: A light emitting diode includes: an electrically conductive permanent substrate having a reflective top surface; an epitaxial film disposed on the reflective top surface of the permanent substrate and having an upper surface and a roughened lower surface that is opposite to the upper surface, the roughened lower surface having a roughness with a height of not less than 300 nm and a plurality of peaks which are in ohmic contact with the reflective top surface; an optical adhesive filled in a gap between the lower surface and the reflective top surface and connecting the epitaxial film to the permanent substrate; and a top electrode disposed on the upper surface and in ohmic contact with the epitaxial film.

    摘要翻译: 发光二极管包括:具有反射顶表面的导电永久性基板; 外延膜设置在永久性基板的反射上表面上,具有与上表面相对的上表面和粗糙化的下表面,粗糙化的下表面具有不小于300nm的高度的粗糙度和多个 与反射顶表面欧姆接触的峰; 填充在下表面和反射顶表面之间的间隙中并将外延膜连接到永久基板的光学粘合剂; 以及设置在上表面上并与外延膜欧姆接触的顶电极。