摘要:
A system-on-chip is provided which includes a data producer; a FIFO buffer which stores data transferred from the data producer at a memory area corresponding to a write pointer; a first consumer which pops data of a memory area corresponding to a first read pointer of the FIFO buffer out; and a second consumer which pops data of a memory area corresponding to a second read pointer of the FIFO buffer out. The FIFO buffer requests a pop-out operation at the second consumer according to the difference between the write pointer and the first read pointer or overwrites data provided from the data producer at a memory area corresponding to the second read pointer.
摘要:
A system-on-chip is provided which includes a data producer; a FIFO buffer which stores data transferred from the data producer at a memory area corresponding to a write pointer; a first consumer which pops data of a memory area corresponding to a first read pointer of the FIFO buffer out; and a second consumer which pops data of a memory area corresponding to a second read pointer of the FIFO buffer out. The FIFO buffer requests a pop-out operation at the second consumer according to the difference between the write pointer and the first read pointer or overwrites data provided from the data producer at a memory area corresponding to the second read pointer.
摘要:
A method of forming a semiconductor device having a contact structure includes forming an insulating layer on a semiconductor substrate, and selectively implanting impurity ions into a predetermined region of the insulating layer to generate lattice defects in the predetermined region of the insulating layer. A thermal treatment, such as quenching the insulating layer at a temperature change rate of at least −20° C./minute, is performed on the insulating layer having the lattice defects to accelerate generation of the lattice defects in the predetermined region such that a conductive region results from the generated lattice defects to provide current paths in the predetermined region.
摘要:
The inventive concepts provide a semiconductor memory device including variable resistance memory elements. The semiconductor memory device may include a first bit line disposed at a first height from a semiconductor substrate, a second bit line disposed at a second height, which is different from the first height, from the semiconductor substrate, a first variable resistance memory element connected to the first bit line, and a second variable resistance memory element connected to the second bit line. The first and second variable resistance memory elements may be disposed at substantially the same height from the semiconductor substrate.
摘要:
The inventive concepts provide a semiconductor memory device including variable resistance memory elements. The semiconductor memory device may include a first bit line disposed at a first height from a semiconductor substrate, a second bit line disposed at a second height, which is different from the first height, from the semiconductor substrate, a first variable resistance memory element connected to the first bit line, and a second variable resistance memory element connected to the second bit line. The first and second variable resistance memory elements may be disposed at substantially the same height from the semiconductor substrate.
摘要:
A method of forming a semiconductor device having a contact structure includes forming an insulating layer on a semiconductor substrate, and selectively implanting impurity ions into a predetermined region of the insulating layer to generate lattice defects in the predetermined region of the insulating layer. A thermal treatment, such as quenching the insulating layer at a temperature change rate of at least −20° C./minute, is performed on the insulating layer having the lattice defects to accelerate generation of the lattice defects in the predetermined region such that a conductive region results from the generated lattice defects to provide current paths in the predetermined region.