公开(公告)号：US20140120725A1

公开(公告)日：2014-05-01

申请号：US14061673

申请日：2013-10-23

Applicant: EBARA CORPORATION

Inventor： Mitsuru MIYAZAKI ,  Kenichi KOBAYASHI ,  Teruaki HOMBO ,  Akira IMAMURA ,  Boyu DONG ,  Hiroyuki SHINOZAKI

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/306

CPC classification number: H01L21/30625 ,  B24B37/30 ,  B24B37/34 ,  B24B37/345 ,  H01L21/67051 ,  H01L21/67219

Abstract: A polishing apparatus is used for polishing a surface of a substrate such as a semiconductor wafer to planarize the surface of the substrate. The polishing apparatus includes a polishing table having a polishing surface, and a top ring configured to hold a substrate with an outer circumferential edge of the substrate surrounded by a retainer ring and to press the substrate against the polishing surface. The top ring is movable between a polishing position above the polishing table, a position laterally of the polishing table, and a cleaning position. The polishing apparatus includes a cleaning unit disposed in the cleaning position and configured to eject a cleaning liquid toward the lower surface of the top ring, which is being rotated, thereby cleaning the substrate held by the top ring together with the lower surface of the top ring.

Abstract translation: 抛光装置用于抛光诸如半导体晶片的基板的表面以平坦化基板的表面。 抛光装置包括具有抛光表面的抛光台，以及顶环，其构造成保持基板的外周边缘由保持环包围并将基板压靠在抛光表面上。 顶环可在抛光台上方的抛光位置，抛光台侧面的位置和清洁位置之间移动。 抛光装置包括清洁单元，该清洁单元设置在清洁位置并且被配置为朝着正在旋转的顶环的下表面喷射清洁液体，由此清洁由顶环保持的基板与顶部的下表面 环。

公开(公告)号：US20140083468A1

公开(公告)日：2014-03-27

申请号：US14038603

申请日：2013-09-26

Applicant: EBARA CORPORATION

Inventor： Mitsuru MIYAZAKI ,  Kenichi KOBAYASHI ,  Teruaki HOMBO ,  Akira IMAMURA ,  Boyu DONG ,  Hiroyuki SHINOZAKI

IPC: H01L21/67

CPC classification number: H01L21/6719 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67178 ,  H01L21/67207 ,  H01L21/67745 ,  H01L21/68728

Abstract: A substrate processing apparatus has a cleaning section for cleaning a substrate such as a semiconductor wafer and can be used as a polishing apparatus. The substrate processing apparatus includes a first cleaning chamber which houses at least one first cleaning module and two second cleaning modules arranged in a vertical array, a second cleaning chamber which houses two third cleaning modules arranged in a vertical array, and a first transport robot housed in a first transport chamber disposed between the first cleaning chamber and the second cleaning chamber. The first transport robot is configured to transfer substrates between the first cleaning module, the second cleaning modules, and the third cleaning modules.

Abstract translation: 基板处理装置具有用于清洁诸如半导体晶片的基板的清洁部，并且可以用作抛光装置。 基板处理装置包括容纳至少一个第一清洁模块和布置成垂直阵列的两个第二清洁模块的第一清洁室，容纳以垂直阵列布置的两个第三清洁模块的第二清洁室，以及容纳 在设置在第一清洁室和第二清洁室之间的第一输送室中。 第一传送机器人被配置为在第一清洁模块，第二清洁模块和第三清洁模块之间传送基板。