公开(公告)号：US20190389030A1

公开(公告)日：2019-12-26

申请号：US16449756

申请日：2019-06-24

申请人： Ebara Corporation

发明人： Toru Maruyama ,  Yasuyuki Motoshima ,  Shuji Uozumi ,  Keisuke Kamiki ,  Misunori Komatsu

IPC分类号： B24B37/005 ,  G01M3/28

摘要： A method of checking a leakage of fluid from a fluid line includes connecting a leakage checking line to the fluid line between a supply valve and a return valve, regulating a pressure regulator disposed in the leakage checking line such that a pressure of fluid of the leakage checking line becomes the same as a pressure of fluid of the fluid line; closing the supply valve and the return valve and opening an opening/closing valve disposed in the leakage checking line; acquiring a flow rate of the fluid that flows in the leakage checking line by a flowmeter disposed in the leakage checking line; comparing the flow rate of the fluid acquired at the acquiring with a predetermined threshold; and determining that the fluid of the fluid line is leaked, when the flow rate of the fluid acquired at the acquiring is larger than the predetermined threshold.

公开(公告)号：US11826871B2

公开(公告)日：2023-11-28

申请号：US17242886

申请日：2021-04-28

申请人： EBARA CORPORATION

发明人： Shuji Uozumi ,  Toru Maruyama

IPC分类号： B24B37/015

CPC分类号： B24B37/015

摘要： A pad-temperature regulating device is disclosed, which can improve a responsiveness of a control for a surface temperature of a polishing pad and regulate the surface temperature of the polishing pad without causing defects, such as scratches, on the substrate. The pad-temperature regulating apparatus includes: a heat exchanger disposed above the polishing pad, whose temperature is maintained at a predetermined temperature; a pad-temperature measuring device configured to measure the surface temperature of the polishing pad; a distance sensor configured to measure a separation distance between the polishing pad and the heat exchanger; an elevating mechanism for moving the heat exchanger vertically with respect to the polishing pad; and a controller configured to control operation of the elevating mechanism based on measured values of the pad-temperature measuring device.

公开(公告)号：US11992915B2

公开(公告)日：2024-05-28

申请号：US17115764

申请日：2020-12-08

申请人： EBARA CORPORATION

发明人： Shuji Uozumi ,  Toru Maruyama ,  Mitsunori Komatsu

IPC分类号： B24B55/03 ,  B24B37/015 ,  B24B37/20

CPC分类号： B24B55/03 ,  B24B37/015 ,  B24B37/20

摘要： A system (5) includes a heat exchanging member (11) and a liquid supply unit (30). The liquid supply unit (30) includes a pump device (32) that adjusts the flow amount of a liquid flowing through a heating liquid supply line (HSL), a needle valve (MNV) that is attached to a cooling liquid supply line (CSL), and a control device (40) that controls operations of the pump device (32) and the needle valve (MNV).

公开(公告)号：US11517940B2

公开(公告)日：2022-12-06

申请号：US16713000

申请日：2019-12-13

申请人： EBARA CORPORATION

发明人： Shuji Uozumi ,  Yasuyuki Motoshima ,  Toru Maruyama

IPC分类号： B08B1/04 ,  B08B3/04 ,  B08B1/00 ,  H01L21/67

摘要： A substrate cleaning device that facilitates control of the amount of liquid supplied to a substrate and reduces adverse influences of the liquid supplied to a bearing part on the substrate is provided. The substrate cleaning device includes: a holding part that has a bearing part configured to rotatably hold a cleaning member for cleaning a substrate; a first supply part that has at least a part provided inside the holding part and supplies a first liquid into the cleaning member through the inside of the holding part; and a second supply part that supplies a second liquid to the bearing part.

公开(公告)号：US20220228924A1

公开(公告)日：2022-07-21

申请号：US17614210

申请日：2020-05-29

申请人： EBARA CORPORATION

发明人： Shuji Uozumi ,  Yasuyuki Motoshima

IPC分类号： G01J5/80 ,  H01L21/67 ,  G01J5/12 ,  B24B37/015

摘要： The present invention relates to a method and a system of automatically calibrating a radiation thermometer disposed in a polishing apparatus. This method includes: placing a heating device (61), to which a measurement body (68) is attached, below the radiation thermometer (48); and using a controller (40) of the polishing apparatus coupled to the heating device (61) to heat a temperature of the measurement body (68) to a plurality of target temperatures (Ta), to measure the temperatures of the measurement body (68) at each target temperature (Ta) with the radiation thermometer (48), to calculate temperature deviation amounts which are differences between each of the target temperatures (Ta) and temperature output values of the radiation thermometer (48) corresponding to each target temperature (Ta), and to calibrate the radiation thermometer (48) so that all the temperature deviation amounts are within a preset reference range.

公开(公告)号：US11383345B2

公开(公告)日：2022-07-12

申请号：US16824281

申请日：2020-03-19

申请人： EBARA CORPORATION

发明人： Yasuyuki Motoshima ,  Toru Maruyama ,  Keisuke Kamiki ,  Shuji Uozumi

IPC分类号： B24B5/00 ,  B24B37/20 ,  F28G3/02

摘要： A cleaning apparatus capable of effectively removing dirt attached to a bottom surface of a heat exchanger, is disclosed. The cleaning apparatus cleans the heat exchanger for regulating a surface temperature of a polishing pad. This cleaning apparatus includes: a moving mechanism configured to move the heat exchanger between a temperature-regulating position in which the heat exchanger can exchange heat with the polishing pad, and a retreat position in which the heat exchanger is separated from a surface of the polishing pad; and a cleaning mechanism configured to clean a bottom surface of the heat exchanger moved to the retreat position The retreat position is located on a side of the polishing pad. The cleaning mechanism includes at least one cleaning nozzle for ejecting a cleaning liquid to the bottom surface of the heat exchanger, or a cleaning tank in which the bottom surface of the heat exchanger can be immersed.

公开(公告)号：US20200306920A1

公开(公告)日：2020-10-01

申请号：US16824281

申请日：2020-03-19

申请人： EBARA CORPORATION

发明人： Yasuyuki Motoshima ,  Toru Maruyama ,  Keisuke Kamiki ,  Shuji Uozumi

IPC分类号： B24B37/20 ,  F28G3/02

摘要： A cleaning apparatus capable of effectively removing dirt attached to a bottom surface of a heat exchanger, is disclosed. The cleaning apparatus cleans the heat exchanger for regulating a surface temperature of a polishing pad. This cleaning apparatus includes: a moving mechanism configured to move the heat exchanger between a temperature-regulating position in which the heat exchanger can exchange heat with the polishing pad, and a retreat position in which the heat exchanger is separated from a surface of the polishing pad; and a cleaning mechanism configured to clean a bottom surface of the heat exchanger moved to the retreat position The retreat position is located on a side of the polishing pad. The cleaning mechanism includes at least one cleaning nozzle for ejecting a cleaning liquid to the bottom surface of the heat exchanger, or a cleaning tank in which the bottom surface of the heat exchanger can be immersed.