公开(公告)号：US12023777B2

公开(公告)日：2024-07-02

申请号：US17610573

申请日：2020-05-20

申请人： EBARA CORPORATION

发明人： Keisuke Kamiki ,  Toru Maruyama ,  Yasuyuki Motoshima

IPC分类号： B24B37/015

CPC分类号： B24B37/015

摘要： The present invention relates to a temperature regulating apparatus for regulating a temperature of a polishing surface of a polishing pad used for polishing a substrate, such as a wafer. The present invention further relates to a polishing apparatus including such a temperature regulating apparatus. The temperature regulating apparatus (5) includes: a heat exchanger (11) having a heating flow passage (61) and a cooling flow passage (62) formed therein; a holder (90) arranged over the heat exchanger (11); a coupling mechanism (80) configured to detachably fix the heat exchanger (11) to the holder (90), the coupling mechanism (80) including: a first hook (73) fixed to an upper surface of the heat exchanger (11); and a second hook (83) held by the holder (90). The second hook (83) is configured to be able to be engaged with and disengaged from the first hook (73).

公开(公告)号：US20200243364A1

公开(公告)日：2020-07-30

申请号：US16845914

申请日：2020-04-10

申请人： EBARA CORPORATION

发明人： Itsuki Kobata ,  Keita Yagi ,  Katsuhide Watanabe ,  Yoichi Shiokawa ,  Toru Maruyama ,  Nobuyuki Takahashi

IPC分类号： H01L21/677 ,  H01L21/66 ,  B24B37/04 ,  H01L21/67 ,  H01L21/3213 ,  H01L21/321 ,  H01L21/306 ,  H01L21/311 ,  H01L21/683 ,  B24B37/20 ,  H01L21/3105

摘要： An object of the present invention is to improve a substrate processing apparatus using the CARE method.The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.

公开(公告)号：US10589398B2

公开(公告)日：2020-03-17

申请号：US15883978

申请日：2018-01-30

申请人： EBARA CORPORATION

发明人： Yohei Eto ,  Toru Maruyama

IPC分类号： B24B37/015 ,  B24B55/02 ,  B24B49/14 ,  B24B57/02 ,  B24B37/10 ,  F28F3/12

摘要： A heat exchanger which can allow a surface temperature of a polishing pad to promptly reach a target temperature and can realize a uniform distribution of the surface temperature of the polishing pad is disclosed. The heat exchanger includes a pad contact surface capable of contacting the polishing pad, a heating flow passage through which a heating fluid is to flow, and a cooling flow passage through which a cooling fluid is to flow. The heating flow passage and the cooling flow passage are arranged side by side from beginnings to ends thereof, and the heating flow passage and the cooling flow passage cross each other at different levels at a peripheral portion of the pad contact surface.

公开(公告)号：US20190389030A1

公开(公告)日：2019-12-26

申请号：US16449756

申请日：2019-06-24

申请人： Ebara Corporation

发明人： Toru Maruyama ,  Yasuyuki Motoshima ,  Shuji Uozumi ,  Keisuke Kamiki ,  Misunori Komatsu

IPC分类号： B24B37/005 ,  G01M3/28

摘要： A method of checking a leakage of fluid from a fluid line includes connecting a leakage checking line to the fluid line between a supply valve and a return valve, regulating a pressure regulator disposed in the leakage checking line such that a pressure of fluid of the leakage checking line becomes the same as a pressure of fluid of the fluid line; closing the supply valve and the return valve and opening an opening/closing valve disposed in the leakage checking line; acquiring a flow rate of the fluid that flows in the leakage checking line by a flowmeter disposed in the leakage checking line; comparing the flow rate of the fluid acquired at the acquiring with a predetermined threshold; and determining that the fluid of the fluid line is leaked, when the flow rate of the fluid acquired at the acquiring is larger than the predetermined threshold.

公开(公告)号：US10195712B2

公开(公告)日：2019-02-05

申请号：US15697047

申请日：2017-09-06

申请人： EBARA CORPORATION

发明人： Toru Maruyama ,  Hisanori Matsuo ,  Yasuyuki Motoshima

IPC分类号： B24B37/015 ,  B24B49/14 ,  B24B55/02 ,  G01J5/02 ,  G01J5/00

摘要： A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

公开(公告)号：US11992915B2

公开(公告)日：2024-05-28

申请号：US17115764

申请日：2020-12-08

申请人： EBARA CORPORATION

发明人： Shuji Uozumi ,  Toru Maruyama ,  Mitsunori Komatsu

IPC分类号： B24B55/03 ,  B24B37/015 ,  B24B37/20

CPC分类号： B24B55/03 ,  B24B37/015 ,  B24B37/20

摘要： A system (5) includes a heat exchanging member (11) and a liquid supply unit (30). The liquid supply unit (30) includes a pump device (32) that adjusts the flow amount of a liquid flowing through a heating liquid supply line (HSL), a needle valve (MNV) that is attached to a cooling liquid supply line (CSL), and a control device (40) that controls operations of the pump device (32) and the needle valve (MNV).

公开(公告)号：US11919124B2

公开(公告)日：2024-03-05

申请号：US17417294

申请日：2019-12-19

申请人： EBARA CORPORATION

发明人： Toru Maruyama

IPC分类号： B24B37/015 ,  B24B37/20 ,  B24B49/14

CPC分类号： B24B37/015 ,  B24B37/20 ,  B24B49/14

摘要： The present application relates to a pad-temperature regulating apparatus for regulating a temperature of a surface of a polishing pad. The pad-temperature regulating apparatus includes a pad-contact member, a supply system for supplying a heating liquid and a cooling liquid into the pad contact member, a pad-temperature measuring device for measuring the temperature of the surface of the polishing pad, and a controller for performing a PID control of manipulated variables of a first flow control valve and a second flow control valve. The controller includes a memory in which a learned model constructed to maintain a temperature behavior curve, created based on measured values of the pad-temperature measuring device, within a predetermined allowable range, is stored; and a processing device which inputs at least one temperature behavior parameter to the learned model, and performs a calculation to output a change value of PID parameter for the PID control.

公开(公告)号：US11517940B2

公开(公告)日：2022-12-06

申请号：US16713000

申请日：2019-12-13

申请人： EBARA CORPORATION

发明人： Shuji Uozumi ,  Yasuyuki Motoshima ,  Toru Maruyama

IPC分类号： B08B1/04 ,  B08B3/04 ,  B08B1/00 ,  H01L21/67

摘要： A substrate cleaning device that facilitates control of the amount of liquid supplied to a substrate and reduces adverse influences of the liquid supplied to a bearing part on the substrate is provided. The substrate cleaning device includes: a holding part that has a bearing part configured to rotatably hold a cleaning member for cleaning a substrate; a first supply part that has at least a part provided inside the holding part and supplies a first liquid into the cleaning member through the inside of the holding part; and a second supply part that supplies a second liquid to the bearing part.

公开(公告)号：US10556314B2

公开(公告)日：2020-02-11

申请号：US15636343

申请日：2017-06-28

申请人： EBARA CORPORATION

发明人： Suguru Sakugawa ,  Toru Maruyama ,  Nobuyuki Takahashi ,  Zhongxin Wen ,  Yoichi Shiokawa ,  Keita Yagi ,  Itsuki Kobata ,  Tomohiko Takeuchi

IPC分类号： B24B37/005 ,  B24B37/10 ,  H01L21/306

摘要： According to one aspect, a substrate processing apparatus is provided. The substrate processing apparatus includes a table provided with a substrate holding surface for holding a substrate, a pad for processing the substrate held on the table, a head for holding the pad, an actuator for moving the head in a direction perpendicular to the substrate holding surface of the table, and a mechanical stopper device for stopping a movement of the head in the direction perpendicular to the substrate holding surface.

公开(公告)号：US10340159B2

公开(公告)日：2019-07-02

申请号：US14730584

申请日：2015-06-04

申请人： EBARA CORPORATION

发明人： Fujihiko Toyomasu ,  Toru Maruyama ,  Junji Kunisawa

IPC分类号： B01F15/00 ,  H01L21/67 ,  B01F3/08

摘要： A cleaning chemical supplying device, a cleaning chemical supplying method, and a cleaning unit capable of flexibly handling a change of a dilution ratio and suppression of an increase of a device size are provided. A cleaning chemical supplying device has a first in-line mixer, a second in-line mixer, a first chemical CLC box, a second chemical CLC box, and a DIWCLC box.