公开(公告)号：US20190001442A1

公开(公告)日：2019-01-03

申请号：US15750140

申请日：2016-09-08

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Mark Unrath ,  Chuan Yang ,  Jan Kleinert ,  Mark Peeples ,  Hugh Owens ,  Gwendolyn Byrne ,  Haibin Zhang ,  Justin Redd ,  Corie Neufeld ,  James D. Brookhyser ,  Yasu Osako ,  Mehmet Alpay ,  Zhibin Lin ,  Patrick Riechel ,  Tim Nuckolls ,  Hisashi Matsumoto ,  Chris Ryder

IPC: B23K26/382 ,  B23K26/082 ,  B23K26/70 ,  B23K26/0622

Abstract: Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed.