公开(公告)号：US20140003067A1

公开(公告)日：2014-01-02

申请号：US14015261

申请日：2013-08-30

Applicant: Electro Scientific Industries, Inc.

Inventor： Yasu Osako

IPC: F21V11/00

CPC classification number: F21V11/00 ,  F21S2/00 ,  H05K5/02 ,  Y10T428/24273 ,  Y10T428/24802

Abstract: A panel includes a plurality of microholes arranged in a pattern and filled with light transmissive polymeric material. The light transmissive polymeric material occludes the microholes and is set, or cured, by exposure to an energy source using at least two discrete exposure periods separated by an idle or rest period. The uniformity of the microholes is thereby improved.

Abstract translation: 面板包括以图案布置并填充有透光聚合物材料的多个微孔。 透光聚合材料封闭微孔，并且通过使用至少两个分开的空闲或休息时段的离散曝光时段，通过暴露于能量源来设置或固化。 从而提高了微孔的均匀性。

公开(公告)号：US20190001442A1

公开(公告)日：2019-01-03

申请号：US15750140

申请日：2016-09-08

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Mark Unrath ,  Chuan Yang ,  Jan Kleinert ,  Mark Peeples ,  Hugh Owens ,  Gwendolyn Byrne ,  Haibin Zhang ,  Justin Redd ,  Corie Neufeld ,  James D. Brookhyser ,  Yasu Osako ,  Mehmet Alpay ,  Zhibin Lin ,  Patrick Riechel ,  Tim Nuckolls ,  Hisashi Matsumoto ,  Chris Ryder

IPC: B23K26/382 ,  B23K26/082 ,  B23K26/70 ,  B23K26/0622

Abstract: Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed.

公开(公告)号：US20150239064A1

公开(公告)日：2015-08-27

申请号：US14707950

申请日：2015-05-08

Applicant: Electro Scientific Industries, Inc.

Inventor： Yasu Osako ,  Mark Unrath ,  Mark Kosmowski

IPC: B23K26/08 ,  B23K26/38

CPC classification number: B23K26/0846 ,  B23K26/38

Abstract: Systems and methods for laser processing continuously moving sheet material include one or more laser processing heads configured to illuminate the moving sheet material with one or more laser beams. The sheet material may include, for example, an optical film continuously moving from a first roller to a second roller during a laser process. In one embodiment, a vacuum chuck is configured to removably affix a first portion of the moving sheet material thereto. The vacuum chuck controls a velocity of the moving sheet material as the first portion is processed by the one or more laser beams. In one embodiment, a conveyor includes a plurality of vacuum chucks configured to successively affix to different portions of the sheet material during laser processing.

Abstract translation: 用于激光处理连续移动的片材的系统和方法包括一个或多个激光处理头，其被配置为用一个或多个激光束照射移动片材。 片材可以包括例如在激光处理期间从第一辊连续地移动到第二辊的光学膜。 在一个实施例中，真空卡盘构造成将可动片材的第一部分可拆卸地固定到其上。 当第一部分被一个或多个激光束处理时，真空吸盘控制移动片材的速度。 在一个实施例中，输送机包括多个真空卡盘，其构造成在激光加工期间连续地贴附到片材的不同部分。

公开(公告)号：US08679948B2

公开(公告)日：2014-03-25

申请号：US13774244

申请日：2013-02-22

Applicant: Electro Scientific, Industries, Inc.

Inventor： Yasu Osako ,  Daragh Finn

IPC: B23K26/00

CPC classification number: H01L21/78 ,  B23K26/0006 ,  B23K26/0626 ,  B23K26/38 ,  B23K26/40 ,  B23K2103/50 ,  B23K2103/56

Abstract: An improved method for singulation of electronic substrates into dice uses a laser to first form cuts in the substrate and then chamfers the edges of the cuts by altering the laser parameters. The chamfers increase die break strength by reducing the residual damage and removes debris caused by the initial laser cut without requiring additional process steps, additional equipment or consumable supplies.

Abstract translation: 用于将电子衬底分离成骰子的改进方法使用激光器首先在衬底中形成切口，然后通过改变激光器参数来倒角切口的边缘。 倒角通过减少残余损伤并消除由初始激光切割引起的碎片而增加冲模强度，而不需要额外的工艺步骤，附加设备或消耗品。

公开(公告)号：US10118252B2

公开(公告)日：2018-11-06

申请号：US14707950

申请日：2015-05-08

Applicant: Electro Scientific Industries, Inc.

Inventor： Yasu Osako ,  Mark Unrath ,  Mark Kosmowski

IPC: B23K26/08 ,  B23K26/38

Abstract: Systems and methods for laser processing continuously moving sheet material include one or more laser processing heads configured to illuminate the moving sheet material with one or more laser beams. The sheet material may include, for example, an optical film continuously moving from a first roller to a second roller during a laser process. In one embodiment, a vacuum chuck is configured to removably affix a first portion of the moving sheet material thereto. The vacuum chuck controls a velocity of the moving sheet material as the first portion is processed by the one or more laser beams. In one embodiment, a conveyor includes a plurality of vacuum chucks configured to successively affix to different portions of the sheet material during laser processing.