公开(公告)号：US20210376549A1

公开(公告)日：2021-12-02

申请号：US17290198

申请日：2020-02-04

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Jan Kleinert ,  Justin Redd ,  James Brookhyser

IPC: H01S3/00 ,  H01S3/23 ,  H01S3/13 ,  H01S3/067

Abstract: A system includes a multi-channel beam splitter arranged and configured to split an input optical signal into a plurality of split optical signals; a plurality of phase modulators, wherein each phase modulator of the plurality of phase modulators is operative to modify a phase of a corresponding split optical signal of the plurality of split optical signals in response to a control signal; a waveguide arranged at an optical output of the plurality of phase modulators, the waveguide configured to spatially-rearrange the split optical signals output from the plurality of phase modulators into a pattern, thereby producing an optical signal pattern; and an optical amplifier arranged at an optical output of the waveguide, wherein the optical amplifier is configured to amplify the optical signal pattern produced by the waveguide.

公开(公告)号：US20190001442A1

公开(公告)日：2019-01-03

申请号：US15750140

申请日：2016-09-08

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Mark Unrath ,  Chuan Yang ,  Jan Kleinert ,  Mark Peeples ,  Hugh Owens ,  Gwendolyn Byrne ,  Haibin Zhang ,  Justin Redd ,  Corie Neufeld ,  James D. Brookhyser ,  Yasu Osako ,  Mehmet Alpay ,  Zhibin Lin ,  Patrick Riechel ,  Tim Nuckolls ,  Hisashi Matsumoto ,  Chris Ryder

IPC: B23K26/382 ,  B23K26/082 ,  B23K26/70 ,  B23K26/0622

Abstract: Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed.