公开(公告)号：US20180305563A1

公开(公告)日：2018-10-25

申请号：US15954484

申请日：2018-04-16

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Ji-Young OH ,  Rae-Man PARK ,  Kyung Hyun KIM ,  Hyun Woo DANG ,  Yong Suk YANG ,  Kyu Sung LEE

IPC: C09D5/24 ,  C09D101/02 ,  C09D129/04 ,  C09D133/02 ,  C09D127/16 ,  C09D7/61 ,  H05K1/09 ,  H05K3/12 ,  H01B1/22

CPC classification number: C09D5/24 ,  C09D7/61 ,  C09D101/02 ,  C09D127/16 ,  C09D129/04 ,  C09D133/02 ,  H01B1/22 ,  H05K1/028 ,  H05K1/095 ,  H05K3/1258 ,  H05K3/1283 ,  H05K3/38 ,  H05K2201/0129 ,  H05K2201/0221 ,  H05K2203/0522 ,  H05K2203/0545

Abstract: Provided are a liquid metal mixture, and a method of forming a conductive pattern using the same. The liquid metal mixture includes a polymer powder of about 10 to about 90 wt %, and a liquid metal included in an amount of about 10 to about 90 wt % and covering surfaces of particles of the polymer powder, wherein the polymer powder has a polar functional group. The method includes preparing a liquid metal mixture, forming a first pattern on a substrate with the liquid metal mixture, and forming a second pattern by pressing or heating the first pattern.