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公开(公告)号：US10249750B2
公开(公告)日：2019-04-02
申请号：US15966879
申请日：2018-04-30
Inventor： Sung-Bum Bae , Sung Bock Kim
IPC: H01L29/06 , H01L29/778 , H01L29/20 , H01L29/66 , H01L21/762
Abstract: A semiconductor device includes a first semiconductor layer. A second semiconductor layer is disposed on the first semiconductor layer. A structure layer is disposed on the second semiconductor layer. A metal film covers a side surface of the first semiconductor layer, a side surface of the second semiconductor layer, and an upper surface of the structure layer. A flexible substrate covers the metal film.
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Patent Agency Ranking
公开(公告)号：US10852617B2
公开(公告)日：2020-12-01
申请号：US16295786
申请日：2019-03-07
Inventor： Oh Kee Kwon , Kisoo Kim , Sung Bock Kim , Young Ahn Leem
Abstract: A light comb generating device according to a disclosed embodiment includes a light source for generating light in a reference wavelength band and outputting the generated light, and an optical comb generator for generating a light comb having a reference comb interval from the output light, wherein the light source changes a wavelength of the output light as much as a reference frequency interval for every reference time interval, the light comb is generated within a wavelength range of the reference frequency interval, and the reference wavelength band may be at least about 3 μm and no greater than about 30 μm.
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公开(公告)号：US09991374B2
公开(公告)日：2018-06-05
申请号：US15591643
申请日：2017-05-10
Inventor： Sung-Bum Bae , Sung Bock Kim
IPC: H01L21/48 , H01L29/778 , H01L29/20 , H01L29/66
CPC classification number: H01L29/7787 , H01L21/762 , H01L29/0657 , H01L29/2003 , H01L29/66462 , H01L29/7786
Abstract: A method for manufacturing a semiconductor device includes sequentially stacking a first epitaxial layer, a sacrificial layer, a second epitaxial layer, and a third epitaxial layer on a first substrate, forming a trench which penetrates the third epitaxial layer, the second epitaxial layer, and the sacrificial layer, forming a structure layer on an upper surface of the third epitaxial layer, forming a metal film which covers an inner surface of the trench and the structure layer, forming a second substrate which fills the trench and covers the metal film, and separating the second epitaxial layer, the third epitaxial layer, and the structure layer from the first epitaxial layer.
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公开(公告)号：US08937002B2
公开(公告)日：2015-01-20
申请号：US14230031
申请日：2014-03-31
Inventor： Sung Bum Bae , Eun Soo Nam , Jae Kyoung Mun , Sung Bock Kim , Hae Cheon Kim , Chull Won Ju , Sang Choon Ko , Jong-Won Lim , Ho Kyun Ahn , Woo Jin Chang , Young Rak Park
IPC: H01L21/20 , H01L29/66 , H01L21/8252 , H01L27/06 , H01L27/088 , H01L21/02
CPC classification number: H01L29/66446 , H01L21/0242 , H01L21/02458 , H01L21/0254 , H01L21/02647 , H01L21/8252 , H01L27/0605 , H01L27/0883
Abstract: The present disclosure relates to a nitride electronic device and a method for manufacturing the same, and particularly, to a nitride electronic device and a method for manufacturing the same that can implement various types of nitride integrated structures on the same substrate through a regrowth technology (epitaxially lateral over-growth: ELOG) of a semi-insulating gallium nitride (GaN) layer used in a III-nitride semiconductor electronic device including Group III elements such as gallium (Ga), aluminum (Al) and indium (In) and nitrogen.
Abstract translation: 本发明涉及一种氮化物电子器件及其制造方法，特别涉及一种氮化物电子器件及其制造方法，该氮化物电子器件及其制造方法可通过再生技术在同一衬底上实现各种氮化物一体化结构（ 用于包括III族元素如镓（Ga），铝（Al）和铟（In））和氮（III）的III族氮化物半导体电子器件中的半绝缘氮化镓（GaN）层的外延横向过度生长：ELOG） 。
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公开(公告)号：US20140179088A1
公开(公告)日：2014-06-26
申请号：US13897706
申请日：2013-05-20
Inventor： Sung-Bum BAE , Sung Bock Kim , Jae Kyoung Mun , Eun Soo Nam
IPC: H01L21/02
CPC classification number: H01L21/0254 , H01L21/02458 , H01L21/02496 , H01L21/0262 , H01L21/02664 , H01L21/32
Abstract: The inventive concept provides methods for manufacturing a semiconductor substrate. The method may include forming a stop pattern surrounding an edge of a substrate, forming a transition layer an entire top surface of the substrate except the stop pattern, and forming an epitaxial semiconductor layer on the transition layer and the stop pattern. The epitaxial semiconductor layer may not be grown from the stop pattern. That is, the epitaxial semiconductor layer may be isotropically grown from a top surface and a sidewall of the transition layer by a selective isotropic growth method, so that the epitaxial semiconductor layer may gradually cover the stop pattern.
Abstract translation: 本发明构思提供了制造半导体衬底的方法。 该方法可以包括形成围绕衬底的边缘的停止图案，在除了停止图案之外的基板的整个顶表面上形成过渡层，以及在过渡层和停止图案上形成外延半导体层。 外延半导体层可能不会从停止图案生长。 也就是说，外延半导体层可以通过选择性各向同性生长方法从过渡层的顶表面和侧壁各向同性地生长，使得外延半导体层可以逐渐覆盖停止图案。
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公开(公告)号：US08759204B1
公开(公告)日：2014-06-24
申请号：US13897706
申请日：2013-05-20
Inventor： Sung-Bum Bae , Sung Bock Kim , Jae Kyoung Mun , Eun Soo Nam
IPC: H01L21/20
CPC classification number: H01L21/0254 , H01L21/02458 , H01L21/02496 , H01L21/0262 , H01L21/02664 , H01L21/32
Abstract: The inventive concept provides methods for manufacturing a semiconductor substrate. The method may include forming a stop pattern surrounding an edge of a substrate, forming a transition layer an entire top surface of the substrate except the stop pattern, and forming an epitaxial semiconductor layer on the transition layer and the stop pattern. The epitaxial semiconductor layer may not be grown from the stop pattern. That is, the epitaxial semiconductor layer may be isotropically grown from a top surface and a sidewall of the transition layer by a selective isotropic growth method, so that the epitaxial semiconductor layer may gradually cover the stop pattern.
Abstract translation: 本发明构思提供了制造半导体衬底的方法。 该方法可以包括形成围绕衬底的边缘的停止图案，在除了停止图案之外的基板的整个顶表面上形成过渡层，以及在过渡层和停止图案上形成外延半导体层。 外延半导体层可能不会从停止图案生长。 也就是说，外延半导体层可以通过选择性各向同性生长方法从过渡层的顶表面和侧壁各向同性地生长，使得外延半导体层可以逐渐覆盖停止图案。
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