公开(公告)号：US20050050283A1

公开(公告)日：2005-03-03

申请号：US10651890

申请日：2003-08-29

申请人： Eddie Miller ,  David Duckman ,  Jim Butler ,  Khanh Huynh

发明人： Eddie Miller ,  David Duckman ,  Jim Butler ,  Khanh Huynh

IPC分类号： G06F20060101 ,  G06F12/00

CPC分类号： G06F9/526

摘要： A method and system for allowing flexible control of access to a shared memory by multiple requesters. In a preferred embodiment, the invention arbitrates access to flash memory on a HBA between multiple host channels and HBA microprocessors, and eliminates contention possibilities for the flash during write cycles by the allowing a grant to be locked for a period defined by the flash write protocol and timing.

摘要翻译： 一种用于允许灵活控制多个请求者对共享存储器的访问的方法和系统。 在优选实施例中，本发明仲裁在多个主机信道和HBA微处理器之间的HBA上对闪存的访问，并且通过允许将许可锁定在由闪存写协议定义的时间段内，在写周期期间消除闪存的争用可能性 和时机。

公开(公告)号：US07051145B2

公开(公告)日：2006-05-23

申请号：US10125101

申请日：2002-04-17

申请人： Jim Butler ,  Khanh Huynh

发明人： Jim Butler ,  Khanh Huynh

IPC分类号： G06F13/00 ,  G06F13/14 ,  G06F11/07

CPC分类号： G06F13/4226

摘要： Systems and techniques to track deferred data transfers on a system-interconnect bus. A deferral response initiates storage of information corresponding to the response and tracking of progress for a requested data transfer. A master device, such as a bus adapter, may include a split-transaction repository, timers, and a split-transaction monitor. The master device may include both hardware and firmware components, and may be designed to handle split responses as defined by a Peripheral Component Interconnect Extended standard.

公开(公告)号：US08534299B2

公开(公告)日：2013-09-17

申请号：US12960789

申请日：2010-12-06

申请人： Khanh Huynh

发明人： Khanh Huynh

IPC分类号： A45D29/00

CPC分类号： A45D31/00 ,  B29C33/40 ,  B29C45/2756 ,  B29K2909/08

摘要： The present invention provides a new paradigm in prefabricated gel nails (also referred to as pre processed) gel nails, that lends itself to the mass production of the nails, in shapes, colors, styles that are close to finished, and are configured to enable the nails to be securely attached to finger nail plates applying a UV cured bonding method.

摘要翻译： 本发明提供了预制凝胶钉（也称为预处理）凝胶钉的新范例，其适用于接近完成的形状，颜色，样式的大量生产指甲，并且被配置为使得 指甲牢固地附着在指甲板上，施加UV固化粘合方法。

公开(公告)号：US20050287315A1

公开(公告)日：2005-12-29

申请号：US11195181

申请日：2005-08-02

申请人： Leslie Kreilich ,  Vivian Jones ,  Khanh Huynh ,  John Staral ,  Sergey Lamansky ,  Ha Le ,  John Baetzold

发明人： Leslie Kreilich ,  Vivian Jones ,  Khanh Huynh ,  John Staral ,  Sergey Lamansky ,  Ha Le ,  John Baetzold

IPC分类号： B41M5/382 ,  B41M5/40 ,  B41M5/42

CPC分类号： B41M5/42 ,  B41M3/003 ,  B41M5/265 ,  B41M5/38214 ,  B41M5/385 ,  B41M5/392 ,  B41M5/426 ,  B41M5/44 ,  B41M5/46 ,  B41M5/465 ,  B41M7/0045 ,  B41M7/009 ,  B41M2205/02 ,  B41M2205/06 ,  G02B5/201 ,  G02F1/133516 ,  G03F3/108 ,  H01L51/0013

摘要： A thermal transfer donor element is provided which includes a support, light-to-heat conversion layer, interlayer, and thermal transfer layer. When the donor element is brought into contact with a receptor and imagewise irradiated, a portion of the transfer layer is transferred to the receptor. The relative surface texture of the layers can be at least partially controlled, prior to imaging of the donor element, for desired effects in the resulting receptor device. The construction and process of the donor element is useful in making colored images including applications such as color proofs, color filter elements, and organic light emitting displays.

摘要翻译： 提供了一种热转印供体元件，其包括载体，光热转换层，中间层和热转印层。 当供体元件与受体接触并成像照射时，转移层的一部分转移到受体。 在成像给体元件之前，可以至少部分地控制各层的相对表面纹理，以获得所得到的受体装置中的所需效果。 供体元件的结构和工艺可用于制作彩色图像，包括诸如彩色校样，滤色器元件和有机发光显示器之类的应用。

公开(公告)号：US20050116621A1

公开(公告)日：2005-06-02

申请号：US10989524

申请日：2004-11-16

申请人： Erika Bellmann ,  Vadim Savvateev ,  Martin Wolk ,  Yong Hsu ,  Fred McCormick ,  John Staral ,  Khanh Huynh

发明人： Erika Bellmann ,  Vadim Savvateev ,  Martin Wolk ,  Yong Hsu ,  Fred McCormick ,  John Staral ,  Khanh Huynh

IPC分类号： B41M5/26 ,  B41M5/34 ,  B41M5/40 ,  H01L21/00 ,  H01L27/32 ,  H01L33/00 ,  H05B33/10 ,  H05B33/14

CPC分类号： H01L27/322 ,  B41M5/265 ,  B41M5/345 ,  B41M5/38207 ,  B41M5/38214 ,  H05B33/10

摘要： An electroluminescent device, and a method of making an electroluminescent device that includes one or more color conversion elements is disclosed. In one embodiment, the method includes forming an electroluminescent element on a substrate, where the electroluminescent element is capable of emitting light in a narrow band. The method further includes selectively thermally transferring a plurality of color conversion elements to the electroluminescent element. In another embodiment, the method includes forming an electroluminescent element on a substrate, where the electroluminescent element is capable of emitting UV light. The method further includes selectively thermally transferring a plurality of color conversion elements to the electroluminescent element.

摘要翻译： 公开了电致发光器件，以及制造包括一个或多个颜色转换元件的电致发光器件的方法。 在一个实施例中，该方法包括在基板上形成电致发光元件，其中电致发光元件能够发射窄带的光。 该方法还包括选择性地将多个颜色转换元件热转印到电致发光元件。 在另一个实施方案中，该方法包括在基底上形成电致发光元件，其中电致发光元件能够发射紫外光。 该方法还包括选择性地将多个颜色转换元件热转印到电致发光元件。

公开(公告)号：US20110132386A1

公开(公告)日：2011-06-09

申请号：US12960789

申请日：2010-12-06

申请人： Khanh Huynh

发明人： Khanh Huynh

IPC分类号： A45D31/00 ,  A45D29/00

CPC分类号： A45D31/00 ,  B29C33/40 ,  B29C45/2756 ,  B29K2909/08

摘要： The present invention provides a new paradigm in prefabricated gel nails (also referred to as pre processed) gel nails, that lends itself to the mass production of the nails, in shapes, colors, styles that are close to finished, and are configured to enable the nails to be securely attached to finger nail plates applying a UV cured bonding method.

摘要翻译： 本发明提供了预制凝胶钉（也称为预处理）凝胶钉的新范例，其适用于接近完成的形状，颜色，样式的大量生产指甲，并且被配置为使得 指甲牢固地附着在指甲板上，施加UV固化粘合方法。

公开(公告)号：US20070082288A1

公开(公告)日：2007-04-12

申请号：US11246811

申请日：2005-10-07

申请人： Robin Wright ,  Khanh Huynh ,  Leslie Kreilich ,  Lan Liu ,  Rachel Swanson ,  Richard Walter ,  Martin Wolk ,  Stephen Johnson

发明人： Robin Wright ,  Khanh Huynh ,  Leslie Kreilich ,  Lan Liu ,  Rachel Swanson ,  Richard Walter ,  Martin Wolk ,  Stephen Johnson

IPC分类号： G03C8/00

CPC分类号： B41M5/46 ,  B41M5/41 ,  B41M5/465 ,  B41M2205/06 ,  B41M2205/38 ,  H01L51/0013 ,  H01L51/50 ,  Y02E10/549 ,  Y10S430/165

摘要： Radiation curable thermal transfer elements including a substrate and a light-to-heat conversion layer overlaying the substrate, and processes to make the thermal transfer elements. The light-to-heat conversion layer is derived from a radiation curable material capable of being cured by exposure to radiation at a curing wavelength and an imaging radiation absorber material not substantially increasing radiation absorbance at the curing wavelength. The radiation curable transfer elements can be used in processes for making organic microelectronic devices.

摘要翻译： 可辐射固化的热转印元件，包括基板和覆盖基板的光热转换层，以及制造热转印元件的工艺。 光热转换层源自能够通过暴露于固化波长的辐射而固化的可辐射固化材料和基本上不增加固化波长处的辐射吸光度的成像放射线吸收剂材料。 可辐射固化转印元件可用于制造有机微电子器件的工艺中。