公开(公告)号：US06724724B1

公开(公告)日：2004-04-20

申请号：US09234928

申请日：1999-01-21

申请人： Edward Swenson ,  Ravinder Amanaganti ,  Dhaval N. Shah

发明人： Edward Swenson ,  Ravinder Amanaganti ,  Dhaval N. Shah

IPC分类号： G01R3108

CPC分类号： H04L45/04

摘要： A system and method according to an embodiment of the present invention for translating an electronic address is presented. The system and method comprises sending a first protocol specific address from a first device. A second protocol address is received by the first device, wherein the second protocol address has been determined to be associated with the first protocol specific address. Another system and method for translating an electronic address is also presented. The system and method comprises providing a first protocol specific address from a first device; determining a second protocol specific address associated with the first protocol specific address; and sending the second protocol address to the first device.

摘要翻译： 介绍了一种根据本发明实施例的用于翻译电子地址的系统和方法。 该系统和方法包括从第一设备发送第一协议专用地址。 第二协议地址由第一设备接收，其中第二协议地址已被确定为与第一协议特定地址相关联。 还介绍了用于翻译电子地址的另一种系统和方法。 该系统和方法包括从第一设备提供第一协议特定地址; 确定与所述第一协议特定地址相关联的第二协议特定地址; 以及将所述第二协议地址发送到所述第一设备。

公开(公告)号：US20060216955A1

公开(公告)日：2006-09-28

申请号：US11437117

申请日：2006-05-18

申请人： Edward Swenson ,  Douglas Garcia ,  Bruce Goldwater

发明人： Edward Swenson ,  Douglas Garcia ,  Bruce Goldwater

IPC分类号： H01L21/00

CPC分类号： H01C17/006 ,  H01C17/281 ,  H01G13/00

摘要： Terminating the ends of passive electronic components entails applying a laser-removable coating to one or both of the opposed major surfaces of a substrate. A UV laser beam having a spot size and an energy distribution sufficient to remove the laser-removable coating from multiple selected regions of at least one of the major surfaces to which the laser-removable coating was applied is directed for incidence on the substrate. Relative motion between the UV laser beam and substrate effects removal of sufficient amounts of laser-removable coating to expose the multiple selected regions. The substrate is then broken into multiple rowbars or individual components, each of which includes side margins. An electrically conductive material is applied to the side margins to form electrically conductive interconnects between portions of the side margins spatially aligned with the multiple selected regions.

摘要翻译： 终止无源电子部件的端部需要将激光可移除涂层施加到基板的相对的主表面中的一个或两个。 具有足够的光斑尺寸和能量分布的UV激光束被引导到基底上以入射到激光可去除的涂层的至少一个主表面的多个选定区域中。 UV激光束和衬底之间的相对运动可以消除足够数量的激光可去除涂层以暴露多个选定区域。 然后将基板分解成多个行条或单个部件，每个部件包括侧边。 将导电材料施加到侧边缘以在与多个选定区域空间对准的侧边缘的部分之间形成导电互连。

公开(公告)号：US20060131286A1

公开(公告)日：2006-06-22

申请号：US11291529

申请日：2005-11-30

申请人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

发明人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC分类号： B23K26/16 ,  B23K26/00 ,  B23K26/18 ,  B23K26/14

CPC分类号： B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

公开(公告)号：US20060141680A1

公开(公告)日：2006-06-29

申请号：US11359216

申请日：2006-02-21

申请人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

发明人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC分类号： H01L21/82

CPC分类号： B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

摘要翻译： 使用一组（50）激光脉冲（52）来切断存储器或其它IC芯片中的导电链路（22）。 组（50）的持续时间优选短于1,000ns; 并且组（50）内的每个激光脉冲（52）的脉冲宽度优选在约0.1ps至30ns的范围内。 传统的激光定位系统（62）可将组（50）视为单个“脉冲”，以便在激光系统（60）激发一组（50）激光脉冲（50） 52）。 可以使用传统的IR波长或它们的谐波。

公开(公告)号：US20060138107A1

公开(公告)日：2006-06-29

申请号：US11360094

申请日：2006-02-22

申请人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

发明人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC分类号： B23K26/16

CPC分类号： B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

公开(公告)号：US20060131284A1

公开(公告)日：2006-06-22

申请号：US11286131

申请日：2005-11-23

申请人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

发明人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC分类号： B23K26/16

CPC分类号： B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

公开(公告)号：US20050009235A1

公开(公告)日：2005-01-13

申请号：US10618377

申请日：2003-07-11

申请人： Edward Swenson ,  Yunlong Sun ,  Manoj Sammi ,  Jay Johnson

发明人： Edward Swenson ,  Yunlong Sun ,  Manoj Sammi ,  Jay Johnson

IPC分类号： B23K26/04 ,  B23K26/06 ,  B23K26/08 ,  B23K26/40 ,  B28D5/00 ,  H01L21/301 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01S20060101

CPC分类号： B23K26/0622 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/52 ,  B28D5/0011 ,  H01L2224/16 ,  H01L2924/0102 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/09701 ,  Y10S438/94

摘要： A method of forming a scribe line having a sharp snap line entails directing a UV laser beam along a ceramic substrate such that a portion of the thickness of the ceramic substrate is removed. The UV laser beam forms a scribe line in the ceramic substrate in the absence of appreciable ceramic substrate melting so that a clearly defined snap line forms a region of high stress concentration extending into the thickness of the ceramic substrate. Consequently, multiple depthwise fractures propagate into the thickness of the ceramic substrate in the region of high stress concentration in response to a breakage force applied to either side of the scribe line to effect clean breakage of the ceramic substrate into separate circuit components. The formation of this region facilitates higher precision breakage of the ceramic substrate while maintaining the integrity of the interior structure of each component during and after application of the breakage force.

公开(公告)号：US20060138106A1

公开(公告)日：2006-06-29

申请号：US11359642

申请日：2006-02-21

申请人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

发明人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC分类号： B23K26/16

CPC分类号： B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

公开(公告)号：US20060138096A1

公开(公告)日：2006-06-29

申请号：US11291523

申请日：2005-11-30

申请人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

发明人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC分类号： B23K26/00

CPC分类号： B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

公开(公告)号：US20060131287A1

公开(公告)日：2006-06-22

申请号：US11292297

申请日：2005-11-30

申请人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

发明人： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC分类号： B23K26/16

CPC分类号： B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.