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1.发明申请公开(公告)号：US20050042805A1
公开(公告)日：2005-02-24
申请号：US10887662
申请日：2004-07-09
申请人： Edward Swenson , Yunlong Sun , Manoj Sammi , Jay Johnson , Doug Garcia , Rupendra Anklekar
发明人： Edward Swenson , Yunlong Sun , Manoj Sammi , Jay Johnson , Doug Garcia , Rupendra Anklekar
IPC分类号： B23K26/04 , B23K26/06 , B23K26/08 , B23K26/40 , B28D5/00 , H01L21/301 , H01L21/44 , H01L21/48 , H01L21/50 , H01S20060101
CPC分类号： B23K26/0622 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/52 , B28D5/0011 , H01L2224/16 , H01L2924/0102 , H01L2924/01067 , H01L2924/01068 , H01L2924/01077 , H01L2924/09701 , Y10S438/94
摘要： A method of forming a scribe line having a sharp snap line entails directing a UV laser beam along a ceramic or ceramic-like substrate such that a portion of the thickness of the substrate is removed. The UV laser beam forms a scribe line in the substrate without appreciable substrate melting so that a clearly defined snap line forms a region of high stress concentration extending into the thickness of the substrate. Consequently, multiple depthwise cracks propagate into the thickness of the substrate in the region of high stress concentration in response to a breakage force applied to either side of the scribe line to effect clean fracture of the substrate into separate circuit components. The formation of this region facilitates higher precision fracture of the substrate while maintaining the integrity of the interior structure of each component during and after application of the breakage force.
摘要翻译： 形成具有尖锐捕捉线的划线的方法需要沿着陶瓷或陶瓷状衬底引导UV激光束，使得去除衬底厚度的一部分。 UV激光束在衬底中形成划线，而没有明显的衬底熔化，使得明确限定的捕捉线形成延伸到衬底厚度的高应力集中区域。 因此，响应于施加到划线的任一侧的断裂力，多个深度裂纹在高应力集中区域中传播到基板的厚度中，以使基板清洁断裂成单独的电路部件。 该区域的形成促进了基板的高精度断裂，同时在施加破损力的同时保持了每个部件的内部结构的完整性。
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公开(公告)号：US20050009235A1
公开(公告)日：2005-01-13
申请号：US10618377
申请日：2003-07-11
申请人： Edward Swenson , Yunlong Sun , Manoj Sammi , Jay Johnson
发明人： Edward Swenson , Yunlong Sun , Manoj Sammi , Jay Johnson
IPC分类号： B23K26/04 , B23K26/06 , B23K26/08 , B23K26/40 , B28D5/00 , H01L21/301 , H01L21/44 , H01L21/48 , H01L21/50 , H01S20060101
CPC分类号： B23K26/0622 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/52 , B28D5/0011 , H01L2224/16 , H01L2924/0102 , H01L2924/01067 , H01L2924/01068 , H01L2924/01077 , H01L2924/09701 , Y10S438/94
摘要： A method of forming a scribe line having a sharp snap line entails directing a UV laser beam along a ceramic substrate such that a portion of the thickness of the ceramic substrate is removed. The UV laser beam forms a scribe line in the ceramic substrate in the absence of appreciable ceramic substrate melting so that a clearly defined snap line forms a region of high stress concentration extending into the thickness of the ceramic substrate. Consequently, multiple depthwise fractures propagate into the thickness of the ceramic substrate in the region of high stress concentration in response to a breakage force applied to either side of the scribe line to effect clean breakage of the ceramic substrate into separate circuit components. The formation of this region facilitates higher precision breakage of the ceramic substrate while maintaining the integrity of the interior structure of each component during and after application of the breakage force.
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公开(公告)号：US20060131286A1
公开(公告)日：2006-06-22
申请号：US11291529
申请日：2005-11-30
申请人： Yunlong Sun , Edward Swenson , Richard Harris
发明人： Yunlong Sun , Edward Swenson , Richard Harris
CPC分类号： B23K26/04 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/067 , B23K26/361 , G03F7/70041 , G03F7/70725 , H01L21/76894 , H01L23/5258 , H01L2924/0002 , H01S3/005 , H01S3/0057 , H01S3/0085 , H01S3/0092 , H01S3/1118 , H01S3/2383 , H01S5/4012 , Y10S438/94 , H01L2924/00
摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.
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公开(公告)号：US20060138106A1
公开(公告)日：2006-06-29
申请号：US11359642
申请日：2006-02-21
申请人： Yunlong Sun , Edward Swenson , Richard Harris
发明人： Yunlong Sun , Edward Swenson , Richard Harris
IPC分类号： B23K26/16
CPC分类号： B23K26/04 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/067 , B23K26/361 , G03F7/70041 , G03F7/70725 , H01L21/76894 , H01L23/5258 , H01L2924/0002 , H01S3/005 , H01S3/0057 , H01S3/0085 , H01S3/0092 , H01S3/1118 , H01S3/2383 , H01S5/4012 , Y10S438/94 , H01L2924/00
摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.
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公开(公告)号：US20060138096A1
公开(公告)日：2006-06-29
申请号：US11291523
申请日：2005-11-30
申请人： Yunlong Sun , Edward Swenson , Richard Harris
发明人： Yunlong Sun , Edward Swenson , Richard Harris
IPC分类号： B23K26/00
CPC分类号： B23K26/04 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/067 , B23K26/361 , G03F7/70041 , G03F7/70725 , H01L21/76894 , H01L23/5258 , H01L2924/0002 , H01S3/005 , H01S3/0057 , H01S3/0085 , H01S3/0092 , H01S3/1118 , H01S3/2383 , H01S5/4012 , Y10S438/94 , H01L2924/00
摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.
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公开(公告)号：US20060131287A1
公开(公告)日：2006-06-22
申请号：US11292297
申请日：2005-11-30
申请人： Yunlong Sun , Edward Swenson , Richard Harris
发明人： Yunlong Sun , Edward Swenson , Richard Harris
IPC分类号： B23K26/16
CPC分类号： B23K26/04 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/067 , B23K26/361 , G03F7/70041 , G03F7/70725 , H01L21/76894 , H01L23/5258 , H01L2924/0002 , H01S3/005 , H01S3/0057 , H01S3/0085 , H01S3/0092 , H01S3/1118 , H01S3/2383 , H01S5/4012 , Y10S438/94 , H01L2924/00
摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.
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公开(公告)号：US20060131285A1
公开(公告)日：2006-06-22
申请号：US11286132
申请日：2005-11-23
申请人： Yunlong Sun , Edward Swenson , Richard Harris
发明人： Yunlong Sun , Edward Swenson , Richard Harris
CPC分类号： B23K26/04 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/067 , B23K26/361 , G03F7/70041 , G03F7/70725 , H01L21/76894 , H01L23/5258 , H01L2924/0002 , H01S3/005 , H01S3/0057 , H01S3/0085 , H01S3/0092 , H01S3/1118 , H01S3/2383 , H01S5/4012 , Y10S438/94 , H01L2924/00
摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.
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公开(公告)号：US20060141680A1
公开(公告)日：2006-06-29
申请号：US11359216
申请日：2006-02-21
申请人： Yunlong Sun , Edward Swenson , Richard Harris
发明人： Yunlong Sun , Edward Swenson , Richard Harris
IPC分类号： H01L21/82
CPC分类号： B23K26/04 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/067 , B23K26/361 , G03F7/70041 , G03F7/70725 , H01L21/76894 , H01L23/5258 , H01L2924/0002 , H01S3/005 , H01S3/0057 , H01S3/0085 , H01S3/0092 , H01S3/1118 , H01S3/2383 , H01S5/4012 , Y10S438/94 , H01L2924/00
摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.
摘要翻译： 使用一组（50）激光脉冲（52）来切断存储器或其它IC芯片中的导电链路（22）。 组（50）的持续时间优选短于1,000ns; 并且组（50）内的每个激光脉冲（52）的脉冲宽度优选在约0.1ps至30ns的范围内。 传统的激光定位系统（62）可将组（50）视为单个“脉冲”，以便在激光系统（60）激发一组（50）激光脉冲（50） 52）。 可以使用传统的IR波长或它们的谐波。
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公开(公告)号：US20060138107A1
公开(公告)日：2006-06-29
申请号：US11360094
申请日：2006-02-22
申请人： Yunlong Sun , Edward Swenson , Richard Harris
发明人： Yunlong Sun , Edward Swenson , Richard Harris
IPC分类号： B23K26/16
CPC分类号： B23K26/04 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/067 , B23K26/361 , G03F7/70041 , G03F7/70725 , H01L21/76894 , H01L23/5258 , H01L2924/0002 , H01S3/005 , H01S3/0057 , H01S3/0085 , H01S3/0092 , H01S3/1118 , H01S3/2383 , H01S5/4012 , Y10S438/94 , H01L2924/00
摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.
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公开(公告)号：US20060131284A1
公开(公告)日：2006-06-22
申请号：US11286131
申请日：2005-11-23
申请人： Yunlong Sun , Edward Swenson , Richard Harris
发明人： Yunlong Sun , Edward Swenson , Richard Harris
IPC分类号： B23K26/16
CPC分类号： B23K26/04 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/067 , B23K26/361 , G03F7/70041 , G03F7/70725 , H01L21/76894 , H01L23/5258 , H01L2924/0002 , H01S3/005 , H01S3/0057 , H01S3/0085 , H01S3/0092 , H01S3/1118 , H01S3/2383 , H01S5/4012 , Y10S438/94 , H01L2924/00
摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.
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