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    Electrical connecting apparatus
    1.
    发明授权
    Electrical connecting apparatus 有权
    电气连接装置

    公开(公告)号：US07771220B2

    公开(公告)日：2010-08-10

    申请号：US12580938

    申请日：2009-10-16

    申请人： Eichi Osato ,  Yoshihito Goto ,  Mitsuhiro Abe

    发明人： Eichi Osato ,  Yoshihito Goto ,  Mitsuhiro Abe

    IPC分类号： H01R12/00

    CPC分类号： G01R1/0483

    摘要： An embodiment of an electrical connecting apparatus comprises an electrical insulating plate, an elastic plate made of an electrical insulating material arranged on the electrical insulating plate, a sheet-like conductive plate arranged on the elastic plate, and first and second contacts. The conductive plate comprises a hole area having at least one first hole portion allowing the probe tip portion of the first contact to abut to the conductive plate and a plurality of second hole portions not allowing the probe tip portions of the second contacts to abut thereon regardless of whether or not overdriving acts on the contacts.

    摘要翻译： 电连接装置的实施例包括电绝缘板，由电绝缘板上布置的电绝缘材料制成的弹性板，布置在弹性板上的片状导电板以及第一和第二触点。 所述导电板包括具有至少一个第一孔部分的孔区域，所述第一孔部分允许所述第一接触件的探针末端部分邻接所述导电板;以及多个第二孔部分，其不允许所述第二接触件的探针末端部分抵靠在其上， 是否过度驱动对联系人的行为。

    ELECTRICAL CONNECTING APPARATUS
    2.
    发明申请
    ELECTRICAL CONNECTING APPARATUS 有权
    电气连接装置

    公开(公告)号：US20100099277A1

    公开(公告)日：2010-04-22

    申请号：US12580938

    申请日：2009-10-16

    申请人： Eichi OSATO ,  Yoshihito Goto ,  Mitsuhiro Abe

    发明人： Eichi OSATO ,  Yoshihito Goto ,  Mitsuhiro Abe

    IPC分类号： H01R12/00

    CPC分类号： G01R1/0483

    摘要： An embodiment of an electrical connecting apparatus comprises an electrical insulating plate, an elastic plate made of an electrical insulating material arranged on the electrical insulating plate, a sheet-like conductive plate arranged on the elastic plate, and first and second contacts. The conductive plate comprises a hole area having at least one first hole portion allowing the probe tip portion of the first contact to abut to the conductive plate and a plurality of second hole portions not allowing the probe tip portions of the second contacts to abut thereon regardless of whether or not overdriving acts on the contacts.

    摘要翻译： 电连接装置的实施例包括电绝缘板，由电绝缘板上布置的电绝缘材料制成的弹性板，布置在弹性板上的片状导电板以及第一和第二触点。 所述导电板包括具有至少一个第一孔部分的孔区域，所述第一孔部分允许所述第一接触件的探针末端部分邻接所述导电板;以及多个第二孔部分，其不允许所述第二接触件的探针末端部分抵靠在其上， 是否过度驱动对联系人的行为。

    SEMICONDUCTOR MEMORY DEVICE
    3.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE 审中-公开
    半导体存储器件

    公开(公告)号：US20120155178A1

    公开(公告)日：2012-06-21

    申请号：US13235435

    申请日：2011-09-18

    申请人： Hitoshi OHTA ,  Mitsuhiro Abe ,  Eiji Kozuka ,  Takatomi Izumi

    发明人： Hitoshi OHTA ,  Mitsuhiro Abe ,  Eiji Kozuka ,  Takatomi Izumi

    IPC分类号： G11C16/26 ,  G11C16/04 ,  G11C7/10

    CPC分类号： G11C11/005 ,  G11C7/10 ,  G11C7/22 ,  G11C16/06 ,  G11C2207/2245

    摘要： According to one embodiment, a semiconductor memory device includes a memory, and a data transfer section configured to perform data transfer from and to the memory, and having a first mode to transfer data with a first bit width and a second mode to transfer data with a second bit width. The data transfer section includes a first latch circuit configured to hold first data read from the memory, a second latch circuit configured to hold second data having the first bit width of the first data in the first mode, and to hold third data having the second bit width of the first data in the second mode, and data bus connecting the first latch circuit to the second latch circuit and shared by the first and second modes.

    摘要翻译： 根据一个实施例，半导体存储器件包括存储器和数据传送部件，被配置为执行从存储器传送数据到存储器，并且具有第一模式，以第一位宽度和第二模式传输数据， 第二位宽。 数据传送部分包括：第一锁存电路，被配置为保存从存储器读取的第一数据;第二锁存电路，被配置为保持具有第一模式的第一数据的第一位宽度的第二数据，并且保持第二数据具有第二数据 在第二模式中的第一数据的位宽度，以及将第一锁存电路连接到第二锁存电路并由第一和第二模式共享的数据总线。

    Method of controlling roll eccentricity of rolling mill and apparatus for performing the same method
    4.
    发明授权
    Method of controlling roll eccentricity of rolling mill and apparatus for performing the same method 失效
    控制轧机的轧辊偏心率的方法及执行相同方法的装置

    公开(公告)号：US4299104A

    公开(公告)日：1981-11-10

    申请号：US123415

    申请日：1980-02-21

    申请人： Yasunobu Hayama ,  Kuniaki Tanouchi ,  Mitsuhiro Abe ,  Katsuhiro Ohkura

    发明人： Yasunobu Hayama ,  Kuniaki Tanouchi ,  Mitsuhiro Abe ,  Katsuhiro Ohkura

    IPC分类号： B21B37/18 ,  B21B37/66 ,  B21B37/08

    CPC分类号： B21B37/66

    摘要： A method of controlling roll eccentricity of a rolling mill is disclosed, in which a component of a rolling load variation which is due to eccentricities of an upper and a lower backup rolls of the rolling mill is obtained as a first eccentricity compensation signal by removing a rolling load variation component due to a variation of thickness of a material to be rolled from a rolling load variation occurred during the rolling operation, a rolling load variation value due to the roll eccentricity of the backup rolls is obtained from a rolling load variation occurred during rotations of work rolls which are in contact with each other under a load and is memorized as a second roll eccentricity compensation signal, a first signal is obtained by multiplying the first roll eccentricity compensation signal with a coefficient which is larger than 0 and smaller than 1, a second signal is obtained by multiplying the second roll eccentricity compensation signal with another coefficient which is larger than 0 and smaller than 1, and the first and second signals are added to obtain a roll eccentricity compensation signal for the rolling mill. An apparatus for performing the same method is also disclosed.

    摘要翻译： 公开了一种控制轧制机的轧辊偏心度的方法，其中通过将轧制机的上部和下部支承辊的偏心量作为第一偏心补偿信号获得的轧制负荷变化的分量被获得作为第一偏心补偿信号， 由于轧制过程中发生的轧制负荷变动导致的轧制材料的厚度变化导致的轧制负荷变化成分，由于支承辊的辊偏心导致的轧制负荷变动值， 在负载下彼此接触并被记忆为第二辊偏心补偿信号的工作辊的转动，通过将第一辊偏心补偿信号与大于0并小于1的系数相乘来获得第一信号 通过将第二辊偏心补偿信号与另一个系数相乘来获得第二信号 大于0且小于1，并且添加第一和第二信号以获得用于轧机的辊偏心补偿信号。 还公开了一种用于执行相同方法的装置。

    Mold tool assembly
    6.
    发明授权
    Mold tool assembly 失效
    模具组装

    公开(公告)号：US5349136A

    公开(公告)日：1994-09-20

    申请号：US17418

    申请日：1993-02-10

    申请人： Mitsuhiro Abe ,  Nakanishi Itsuto ,  Ariyoshi Hideho ,  Asao Iguchi

    发明人： Mitsuhiro Abe ,  Nakanishi Itsuto ,  Ariyoshi Hideho ,  Asao Iguchi

    IPC分类号： B29C45/14 ,  H01L21/56 ,  H01L23/28 ,  B22D41/08

    CPC分类号： B29C45/14655 ,  B29C45/2708 ,  H01L21/565 ,  H01L2924/0002

    摘要： A mold tool for forming an electronic component having a semiconductor chip sealed on a supporting member by a resin-molded package, includes an upper mold having an upper cavity and a lower mold having a lower cavity, the package being molded in the cavities. Upper and lower gates are arranged at opposing surfaces of the molds and symmetrically formed with respect to a parting face of the mold tool to connect with the cavities. A method for forming the component includes the steps of inserting the supporting member with the chip in the cavities of the molds of the mold tool, clamping the molds, injecting molten resin into the cavities of the clamped molds through the upper and lower gates, cooling the molten resin in the cavities, and separating the molds from each other and removing the component from the cavities. The supporting member has a recess where the chip is located, and the recess has such a depth that a distance between an upper surface of the chip located in the recess and an upper surface of the package is substantially equal to a distance between a lower surface of a portion where the recess is formed and a lower surface of the package. A lead frame is one of the supporting member and includes a cutout formed at a portion corresponding to the gates, which are connected to each other through the cutout.

    摘要翻译： 一种用于形成具有通过树脂封装的密封在支撑构件上的半导体芯片的电子部件的模具，包括具有上空腔的上模和具有下腔的下模，所述封装被模制在所述空腔中。 上下门被布置在模具的相对表面处，并且相对于模具的分型面对称地形成以与空腔连接。 用于形成部件的方法包括以下步骤：将具有芯片的支撑构件插入模具的模具的空腔中，夹紧模具，通过上下门将熔融树脂注入夹紧的模具的空腔中，冷却 空腔中的熔融树脂，并且将模具彼此分离并从空腔中移除部件。 支撑构件具有芯片所在的凹部，并且凹部具有使位于凹部中的芯片的上表面与封装的上表面之间的距离基本等于下表面之间的距离的深度 形成凹部的部分和封装的下表面。 引线框架是支撑构件之一，并且包括形成在与门相对应的部分处的切口，所述切口通过切口彼此连接。

    FORMABLE ALUMINUM ALLOY SHEET
    7.
    发明申请
    FORMABLE ALUMINUM ALLOY SHEET 审中-公开
    正式铝合金板

    公开(公告)号：US20130112323A1

    公开(公告)日：2013-05-09

    申请号：US13810765

    申请日：2011-08-23

    申请人： Mitsuhiro Abe ,  Makoto Morishita

    发明人： Mitsuhiro Abe ,  Makoto Morishita

    IPC分类号： C22F1/047 ,  C22C21/08 ,  C22C21/06

    CPC分类号： C22F1/047 ,  B21B2003/001 ,  B22D11/003 ,  B22D11/055 ,  B22D11/059 ,  B22D11/0622 ,  C22C21/06 ,  C22C21/08

    摘要： The present invention provides an aluminum alloy sheet for forming which is a high-Mg-content Al—Mg alloy sheet reduced in β-phase precipitation and improved in press formability. This aluminum alloy sheet for forming comprises an Al—Mg alloy containing 6.0-15.0 mass % Mg. In each of square regions, each side of which has the dimension of the whole sheet width (W), that are set in a surface of the alloy sheet, the concentration of Mg is measured at width-direction measurement points, Px, set at given intervals a and b respectively in the sheet-width direction and the sheet-length direction, and the average of the values of Mg concentration measured at the plurality of width-direction measurement points (Px) is taken as a width-direction average Mg concentration (Co). The concentration of Mg is measured at a plurality of thickness-direction measurement points (Py) set at a given interval in the sheet-thickness direction throughout the whole sheet thickness with respect to the plurality of width-direction measurement points (Px), and the average of the values of Mg concentration measured at the plurality of thickness-direction measurement points (Py) is taken as a thickness-direction average Mg concentration (Ci). The absolute value of the degree of regional Mg segregation (X) defined by the difference (Ci−Co) between the thickness-direction average Mg concentration (Ci) and the width-direction average Mg concentration (Co) is 0.5 mass % or less at most and is 0.1 mass % or less on average.

    摘要翻译： 本发明提供一种成形为低Mg含量的Al-Mg合金薄板的铝合金板，其还原成β相析出，冲压成形性提高。 该用于成型的铝合金板包括含有6.0-15.0质量％Mg的Al-Mg合金。 在每个正方形区域中，每个侧面的整个片材宽度（W）的尺寸设置在合金薄片的表面中，Mg的浓度在宽度方向测量点Px上测量，设置在 分别在片材宽度方向和片材长度方向上分别设定间隔a和b，将在多个宽度方向测定点（Px）测定的Mg浓度的平均值作为宽度方向平均Mg 浓度（Co）。 在相对于多个宽度方向测定点（Px）的整个纸张厚度的厚度方向上，以厚度方向设定的多个厚度方向测定点（Py）测定Mg的浓度， 将在多个厚度方向测定点（Py）测定的Mg浓度的平均值作为厚度方向平均Mg浓度（Ci）。 由厚度方向平均Mg浓度（Ci）与宽度方向平均Mg浓度（Co）之间的差（Ci-Co）定义的区域Mg偏析度（X）的绝对值为0.5质量％以下 平均为0.1质量％以下。

    Semiconductor memory and method of testing semiconductor memory
    10.
    发明授权
    Semiconductor memory and method of testing semiconductor memory 有权
    半导体存储器和半导体存储器的测试方法

    公开(公告)号：US06731561B2

    公开(公告)日：2004-05-04

    申请号：US10100269

    申请日：2002-03-15

    申请人： Mitsuhiro Abe ,  Kenta Kaneeda ,  Hiroo Ota ,  Hideo Niki

    发明人： Mitsuhiro Abe ,  Kenta Kaneeda ,  Hiroo Ota ,  Hideo Niki

    IPC分类号： G11C700

    CPC分类号： G11C29/50 ,  G11C29/46 ,  G11C2029/5006

    摘要： A semiconductor memory includes a group of memory cells arrayed in a matrix, memory cell electric power source lines configured to connect the respective memory cells arrayed in a direction of rows of the group of memory cells of each of the rows, two electric power source terminals configured to be mutually independent, and switches configured to be connected between the memory cell electric power source lines and the two electric power source terminals respectively, to be controlled to turn ON/OFF by a inversion logic operation based on a test mode switching signal for switching to and from a test mode and a normal operation mode, and to connect the memory cell power source line to either of the two electric power source terminals according to the ON/OFF control.

    摘要翻译： 半导体存储器包括以矩阵形式排列的一组存储单元，存储单元电源线，被配置为将排列在每行的存储单元组的行方向排列的各个存储单元连接，两个电源端子 被配置为相互独立，并且分别被配置为连接在存储单元电源线和两个电源端子之间的开关，以通过基于测试模式切换信号的反转逻辑运算来控制为接通/断开 切换到测试模式和正常操作模式，并且根据ON / OFF控制将存储单元电源线连接到两个电源端子中的任一个。