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    Photosensitive polyimide precursor
    5.
    发明授权
    Photosensitive polyimide precursor 失效
    感光聚酰亚胺前体

    公开(公告)号：US4861854A

    公开(公告)日：1989-08-29

    申请号：US200864

    申请日：1988-06-01

    申请人： Akitoshi Sugio ,  Takao Kawaki ,  Makoto Kobayashi ,  Katsushige Hayashi ,  Masahito Watanabe

    发明人： Akitoshi Sugio ,  Takao Kawaki ,  Makoto Kobayashi ,  Katsushige Hayashi ,  Masahito Watanabe

    IPC分类号： C08G73/10 ,  G03F7/037 ,  G03F7/038

    CPC分类号： G03F7/0387 ,  C08G73/10 ,  C08G73/1053 ,  C08G73/1064 ,  C08G73/1067 ,  C08G73/1071

    摘要： A photosensitive polyimide precursor composed of the structural units (A) represented by the following general formula (I) and the structural units (B) represented by the following general formula (II), in which the ratio of the molar quantity of the structural units (A) to the sum of the molar quantity of the structural units (A) and that of the structural units (B) is 0.01 or greater, and having a viscosity of 100 cP or above as measured at 25.degree. C. in the state of a 10% by weight solution in N-methylpyrrolidone: ##STR1## wherein R.sub.1 represents a tetravalent aromatic hydrocarbon residue; R.sub.2 represents a divalent aromatic hydrocarbon residue; X, identical or different represents a halogen or an alkyl group; and m represents 0 or an integer from 1 to 4. The photosensitivity of the present photosensitive polyimide precursor is about 20 to 100 times that of conventional products. After heat dehydration cyclization, it shows a heat resistance of 400.degree. C. or above.

    摘要翻译： 由以下通式（I）表示的结构单元（A）和由以下通式（II）表示的结构单元（B））组成的光敏聚酰亚胺前体，其中结构单元 （A）和结构单元（B）的摩尔量的总和为0.01以上，粘度为100cP以上，在该状态下在25℃下测定 的10重量％的N-甲基吡咯烷酮溶液：其中R1表示四价芳烃残基;（I）其中R 1表示四价芳烃残基; R2表示二价芳烃残基; X相同或不同，表示卤素或烷基; m表示0或1〜4的整数。本发明的感光性聚酰亚胺前体的光敏度为常规产品的约20〜100倍。 热脱水环化后，其耐热性为400℃以上。

    Photosensitive polyimide precursor and process for producing the same
    6.
    发明授权
    Photosensitive polyimide precursor and process for producing the same 失效
    感光聚酰亚胺前体及其制备方法

    公开(公告)号：US4670535A

    公开(公告)日：1987-06-02

    申请号：US875044

    申请日：1986-06-17

    申请人： Akitoshi Sugio ,  Takao Kawaki ,  Katsushige Hayashi

    发明人： Akitoshi Sugio ,  Takao Kawaki ,  Katsushige Hayashi

    IPC分类号： C08G73/00 ,  C08F290/00 ,  C08F299/02 ,  C08G73/10 ,  C08G73/12 ,  G03F7/038 ,  C08G16/00

    CPC分类号： C08G73/1082 ,  G03F7/0387

    摘要： The photosensitive polyimide precursor of the invention has a recurring unit represented by the following general formula [I]: ##STR1## (R.sub.1 represents a tetravalent aromatic hydrocarbon residue; R.sub.2 and R.sub.3 each represent a divalent aromatic or aliphatic hydrocarbon residue; and R.sub.4 represents a divalent aromatic hydrocarbon residue represented by ##STR2## wherein R.sub.5, R.sub.6, R.sub.7, R.sub.8, R.sub.9, R.sub.10, R.sub.11 and R.sub.12, identical or different, each represent hydrogen atom, a halogen group or an alkyl group). The photosensitive polyimide precursor of the invention has a viscosity of 50 centipoises or above as measured at 23.degree. C. in the state of a 10% (by weight) solution in N,N-dimethylacetamide. Its photosensitivity is as high as about 20-100 times that of prior products. After heat cyclization, it exhibits a heat resistance of 400.degree. C. or above.The photosensitive polyimide precursor of the invention can be produced by subjecting a tetracarboxylic acid dianhydride and a diamino compound to a polycondensation reaction in an organic polar solvent.

    摘要翻译： 本发明的光敏聚酰亚胺前体具有由以下通式[I]表示的重复单元：（R 1表示四价芳烃残基; R 2和R 3各自表示二价芳族或脂族烃 R4代表由下式表示的二价芳烃残基：其中R5，R6，R7，R8，R9，R10，R11和R12相同或不同，分别代表氢原子，卤素基团或烷基）。 本发明的光敏聚酰亚胺前体在23℃下的粘度为10厘泊（N，N-二甲基乙酰胺）溶液的状态下的粘度为50厘泊或更高。 其光敏度高达现有产品的约20-100倍。 热环化后，其耐热性为400℃以上。 本发明的感光性聚酰亚胺前体可以通过在有机极性溶剂中使四羧酸二酐和二氨基化合物进行缩聚反应来制造。

    Process for producing polyphenylene oxides
    7.
    发明授权
    Process for producing polyphenylene oxides 失效
    生产聚苯醚的方法

    公开(公告)号：US3989671A

    公开(公告)日：1976-11-02

    申请号：US445042

    申请日：1974-02-22

    申请人： Eiichi Yonemitsu ,  Akitoshi Sugio ,  Tetsuo Tomita ,  Tadashi Yoshii ,  Akira Ito

    发明人： Eiichi Yonemitsu ,  Akitoshi Sugio ,  Tetsuo Tomita ,  Tadashi Yoshii ,  Akira Ito

    IPC分类号： C08G65/44

    CPC分类号： C08G65/44

    摘要： Polyphenylene oxides, self-condensation products of phenols, are produced through oxidative coupling by employing a novel catalyst system which comprises a copper compound, an iodine compound and tertiary diamine which is capable of forming a stable chelate ring with the copper compound.According to this invention, copper compounds, which hitherto have been considered to be unsuitable for using with tertiary amines, act with excellent performance as a component of the catalyst.

    摘要翻译： 聚苯醚，酚类的自缩合产物是通过使用能够与铜化合物形成稳定的螯合环的铜化合物，碘化合物和叔二胺的新型催化剂体系，通过氧化偶联制得的。

    Resin composition containing polyphenylene oxide
    9.
    发明授权
    Resin composition containing polyphenylene oxide 失效
    含有聚苯醚的树脂组合物

    公开(公告)号：US4153644A

    公开(公告)日：1979-05-08

    申请号：US640776

    申请日：1975-12-15

    申请人： Akitoshi Sugio ,  Masanobu Masu ,  Masaharu Kimura ,  Norio Sayama ,  Keiun Ko ,  Eiichi Yonemitsu

    发明人： Akitoshi Sugio ,  Masanobu Masu ,  Masaharu Kimura ,  Norio Sayama ,  Keiun Ko ,  Eiichi Yonemitsu

    IPC分类号： C08G65/44 ,  C08L61/00 ,  C08L61/18 ,  C08L71/12 ,  C08L53/02

    CPC分类号： C08L61/18 ,  C08G65/44 ,  C08L71/123 ,  C08L61/00

    摘要： A novel resin composition improved in moldability and impact resistance, comprising (A) a polyphenylene oxide having a molecular weight of 5,000 or higher, (B) an aromatic hydrocarbon-formaldehyde resin or a modified aromatic hydrocarbon-formaldehyde resin, and, if necessary, (C) a rubbery polymer, the weight ratio of the resin (A) to the resin (B) being from 10:90 to 99:1 and the amount of the rubbery polymer (C) being 3 to 40 parts by weight per 100 parts by weight of the sum of the resins (A) and (B). This resin composition has excellent mechanical and electrical properties of the polyphenylene oxide together with an improved moldability, impact resistance, and adhesiveness.

    摘要翻译： 一种提高成型性和耐冲击性的新型树脂组合物，其包含（A）分子量为5,000以上的聚苯醚，（B）芳香族烃 - 甲醛树脂或改性芳香族 - 甲醛树脂，如果需要， （C）橡胶状聚合物，树脂（A）与树脂（B）的重量比为10:90〜99:1，橡胶状聚合物（C）的量为3〜40重量份/ 100 （A）和（B）之和的重量份。 该树脂组合物具有优异的聚苯醚的机械和电学性能以及改进的成型性，耐冲击性和粘合性。

    Method for recovering polyphenylene oxides
    10.
    发明授权
    Method for recovering polyphenylene oxides 失效
    聚苯醚回收方法

    公开(公告)号：US4246398A

    公开(公告)日：1981-01-20

    申请号：US35503

    申请日：1979-05-02

    申请人： Akitoshi Sugio ,  Atsuo Kuramoto ,  Takao Kawaki ,  Hiroyuki Urabe ,  Tatsuhiko Kurihara ,  Isamu Masumoto ,  Akio Hasebe

    发明人： Akitoshi Sugio ,  Atsuo Kuramoto ,  Takao Kawaki ,  Hiroyuki Urabe ,  Tatsuhiko Kurihara ,  Isamu Masumoto ,  Akio Hasebe

    IPC分类号： C08G65/00 ,  C08G65/46 ,  C08G65/44

    CPC分类号： C08G65/46

    摘要： A method for recovering polyphenylene oxide having a high bulk density and a reduced content of fine particles from a solution of a polyphenylene oxide, which comprises adding a non-solvent composed of a lower alkyl alcohol and water to an aromatic solvent solution of a polyphenylene oxide substantially free from impurities to precipitate the polyphenylene oxide, the weight ratio of the aromatic solvent to the lower alkyl alcohol being from 1:1 to 1:2 and the weight ratio of the lower alkyl alcohol to water being from 1:0.005 to 1:0.1 in the precipitation system, and the addition of the non-solvent being controlled such that a liquid composition of the aromatic solvent, the lower alkyl alcohol and water forms a single phase; and recovering the precipitated polyphenylene oxide.

    摘要翻译： 从聚苯醚溶液中回收具有高堆积密度和微粒含量降低的聚苯醚的方法，其包括将由低级烷基醇和水组成的非溶剂加入到聚苯醚的芳族溶剂溶液中 基本上不含杂质以沉淀聚苯醚，芳族溶剂与低级烷基醇的重量比为1:1至1:2，低级烷基醇与水的重量比为1:0.005至1:1。 0.1，并且将非溶剂的添加控制为使得芳族溶剂，低级烷基醇和水的液体组合物形成单相; 并回收沉淀的聚苯醚。