Substrate position correcting method and apparatus using either substrate radius or center of rotation correction adjustment sum
    1.
    发明授权
    Substrate position correcting method and apparatus using either substrate radius or center of rotation correction adjustment sum 失效
    基板位置校正方法和使用基板半径或旋转中心校正调整和的装置

    公开(公告)号:US07547181B2

    公开(公告)日:2009-06-16

    申请号:US11270338

    申请日:2005-10-28

    摘要: A substrate W rotates about the center of rotations A0 of a spin base 3, while supported by plural support pins 5 in such a manner that the substrate W can freely slide and while held owing to the force of friction which develops between the bottom surface of the substrate W and the support pins 5. After a detection sensor 74 detects, while the substrate W rotates, an edge surface position (eccentric position) of the edge surface of the substrate which is the farthest from the center of rotations A0, a press block 71 pushes this edge surface position to a preset position P1 which is away along the horizontal direction from the center of rotations A0 by a distance which is determined in accordance with the radius of the substrate W. This aligns the eccentric position to the preset position P1 and positions the center W0 of the substrate within a predetermined range from the center of rotations A0.

    摘要翻译: 衬底W围绕旋转基座3的旋转中心A0旋转,同时由多个支撑销5支撑,使得衬底W可以自由地滑动并且由于摩擦力而保持,该摩擦力在 基板W和支撑销5.检测传感器74检测到基板W旋转时,离开旋转中心A0的基板的边缘表面的边缘表面位置(偏心位置),压力 块71将该边缘表面位置推压到从旋转中心A0沿着水平方向离开根据基板W的半径确定的距离的预设位置P1。将偏心位置对准预设位置 P1,并将基板的中心W0定位在从旋转中心A0的预定范围内。

    Substrate processing apparatus, substrate processing method, substrate position correcting apparatus, and substrate position correcting method
    2.
    发明申请
    Substrate processing apparatus, substrate processing method, substrate position correcting apparatus, and substrate position correcting method 失效
    基板处理装置,基板处理方法,基板位置校正装置和基板位置校正方法

    公开(公告)号:US20060102289A1

    公开(公告)日:2006-05-18

    申请号:US11270338

    申请日:2005-10-28

    IPC分类号: C23F1/00 H01L21/306

    摘要: A substrate W rotates about the center of rotations A0 of a spin base 3, while supported by plural support pins 5 in such a manner that the substrate W can freely slide and while held owing to the force of friction which develops between the bottom surface of the substrate W and the support pins 5. After a detection sensor 74 detects, while the substrate W rotates, an edge surface position (eccentric position) of the edge surface of the substrate which is the farthest from the center of rotations A0, a press block 71 pushes this edge surface position to a preset position P1 which is away along the horizontal direction from the center of rotations A0 by a distance which is determined in accordance with the radius of the substrate W. This aligns the eccentric position to the preset position P1 and positions the center W0 of the substrate within a predetermined range from the center of rotations A0.

    摘要翻译: 基板W围绕旋转基座3的旋转中心A 0旋转,同时由多个支撑销5支撑,使得基板W能够自由滑动并且由于摩擦力在底面 的基板W和支撑销5。 在检测传感器74检测到基板W旋转之后,离开旋转中心A 0的基板的边缘表面的边缘表面位置(偏心位置)时,压块71将该边缘表面位置推到 预设位置P 1,其从旋转中心A 0沿水平方向离开根据基板W的半径确定的距离。将偏心位置对准预设位置P 1并将中心位置 W 0从旋转中心A 0的预定范围内。

    Substrate processing apparatus and substrate processing method which performs predetermined processing on a substrate which is positioned approximately horizontally at a substrate processing position
    3.
    发明授权
    Substrate processing apparatus and substrate processing method which performs predetermined processing on a substrate which is positioned approximately horizontally at a substrate processing position 有权
    基板处理装置和基板处理方法,其对大致水平放置在基板处理位置的基板进行规定的处理

    公开(公告)号:US07503978B2

    公开(公告)日:2009-03-17

    申请号:US11132565

    申请日:2005-05-19

    IPC分类号: B05C13/02

    摘要: As a substrate transportation robot transports an unprocessed substrate W to a substrate transfer position P1, inert gas ejected from a substrate floating head 71 toward the bottom surface of the substrate W floats up the unprocessed substrate W. Driven by an actuator 74, the substrate floating head 71 floating up the unprocessed substrate W then moves down. Upon arrival of the unprocessed substrate W at a substrate processing position P3, a bottom rim portion of the substrate W engages with support pins 3, and as the substrate floating head 71 further moves down, the unprocessed substrate W is transferred to and mounted on the support pins 3. The substrate W is thus positioned at the substrate processing position P3, whereby the bottom rim portion of the substrate W and an opposing surface 5b of a spin base 5 are positioned close to each other and opposed against each other.

    摘要翻译: 作为基板输送机械手将未处理的基板W输送到基板转印位置P1,从基板浮动头71朝向基板W的底面喷出的惰性气体浮起未经处理的基板W.由致动器74驱动,基板浮动 头部71浮起未处理的基底W然后向下移动。 在未处理的基板W到达基板处理位置P3时,基板W的底部边缘部分与支撑销3接合,并且当基板浮动头71进一步向下移动时,未处理的基板W被转移并安装在 支撑销3.因此,基板W位于基板处理位置P3,由此基板W的底边缘部分和旋转基座5的相对表面5b彼此靠近并且彼此相对。

    Substrate processing apparatus and substrate processing method which performs predetermined processing on a substrate which is positioned approximately horizontally at a substrate processing position
    4.
    发明申请
    Substrate processing apparatus and substrate processing method which performs predetermined processing on a substrate which is positioned approximately horizontally at a substrate processing position 有权
    基板处理装置和基板处理方法,其对大致水平放置在基板处理位置的基板进行规定的处理

    公开(公告)号:US20050284369A1

    公开(公告)日:2005-12-29

    申请号:US11132565

    申请日:2005-05-19

    摘要: As a substrate transportation robot transports an unprocessed substrate W to a substrate transfer position P1, inert gas ejected from a substrate floating head 71 toward the bottom surface of the substrate W floats up the unprocessed substrate W. Driven by an actuator 74, the substrate floating head 71 floating up the unprocessed substrate W then moves down. Upon arrival of the unprocessed substrate W at a substrate processing position P3, a bottom rim portion of the substrate W engages with support pins 3, and as the substrate floating head 71 further moves down, the unprocessed substrate W is transferred to and mounted on the support pins 3. The substrate W is thus positioned at the substrate processing position P3, whereby the bottom rim portion of the substrate W and an opposing surface 5b of a spin base 5 are positioned close to each other and opposed against each other.

    摘要翻译: 作为基板搬运机器人,将未处理的基板W搬送到基板搬送位置P1,从基板浮动头71朝向基板W的底面喷出的惰性气体浮起未经处理的基板W.由致动器74驱动基板 漂浮在未处理衬底W上的浮动头71向下移动。 在未处理的基板W到达基板处理位置P 3时,基板W的底部边缘部分与支撑销3接合,并且当基板浮动头71进一步向下移动时,未处理的基板W被转移并安装在 支撑销3.因此基板W位于基板处理位置P 3处,由此基板W的底边缘部分和旋转基座5的相对表面5b彼此靠近并相互对置 。

    Substrate processing apparatus of and substrate processing method for treating substrate with predetermined processing by supplying processing liquid to rim portion of rotating substrate
    5.
    发明申请
    Substrate processing apparatus of and substrate processing method for treating substrate with predetermined processing by supplying processing liquid to rim portion of rotating substrate 有权
    基板处理装置和基板处理方法,用于通过向旋转基板的边缘部分供应处理液体而用预定处理来处理基板

    公开(公告)号:US20060185792A1

    公开(公告)日:2006-08-24

    申请号:US11355334

    申请日:2006-02-16

    IPC分类号: C23F1/00 C03C15/00

    摘要: A bevel unit comprises CCDs and processing liquid nozzles, and the CCDs take an image of a circumferential edge surface of a substrate. An image processing part detects the distances between the circumferential edge surface of the substrate and the processing liquid nozzles by image processing the signals from the CCDs. A control unit compares thus detected distances between the circumferential edge surface of the substrate and the processing liquid nozzles with set distances from the circumferential edge surface of the substrate to the processing liquid nozzles which are set in a recipe so as to be a desired rim etching width, and calculates an amount of displacement between the detected distances and the set distances. In accordance with the amount of displacement, the control unit activates motors and accordingly positions the bevel unit.

    摘要翻译: 斜角单元包括CCD和处理液体喷嘴,并且CCD拍摄基板的周向边缘表面的图像。 图像处理部通过对来自CCD的信号进行图像处理来检测基板的周缘面与处理液喷嘴之间的距离。 控制单元将由此检测出的基板的圆周边缘表面与处理液喷嘴之间的距离与从基板的周缘表面到处理液喷嘴的设定距离进行比较,这些距离设定在配方中,以便成为所需的边缘蚀刻 宽度,并计算检测距离和设定距离之间的位移量。 根据位移量,控制单元启动电动机并相应地定位斜面单元。

    Substrate processing apparatus for treating substrate with predetermined processing by supplying processing liquid to rim portion of rotating substrate
    6.
    发明授权
    Substrate processing apparatus for treating substrate with predetermined processing by supplying processing liquid to rim portion of rotating substrate 有权
    基板处理装置,用于通过向旋转基板的边缘部分供应处理液体而用预定的处理来处理基板

    公开(公告)号:US07935217B2

    公开(公告)日:2011-05-03

    申请号:US11355334

    申请日:2006-02-16

    摘要: A bevel unit comprises CCDs and processing liquid nozzles, and the CCDs take an image of a circumferential edge surface of a substrate. An image processing part detects the distances between the circumferential edge surface of the substrate and the processing liquid nozzles by image processing the signals from the CCDs. A control unit compares thus detected distances between the circumferential edge surface of the substrate and the processing liquid nozzles with set distances from the circumferential edge surface of the substrate to the processing liquid nozzles which are set in a recipe so as to be a desired rim etching width, and calculates an amount of displacement between the detected distances and the set distances. In accordance with the amount of displacement, the control unit activates motors and accordingly positions the bevel unit.

    摘要翻译: 斜角单元包括CCD和处理液体喷嘴,并且CCD拍摄基板的周向边缘表面的图像。 图像处理部通过对来自CCD的信号进行图像处理来检测基板的周缘面与处理液喷嘴之间的距离。 控制单元将由此检测出的基板的圆周边缘表面与处理液喷嘴之间的距离与从基板的周缘表面到处理液喷嘴的设定距离进行比较,这些距离设定在配方中,以便成为所需的边缘蚀刻 宽度,并计算检测距离和设定距离之间的位移量。 根据位移量,控制单元启动电动机并相应地定位斜面单元。

    Method and apparatus for transferring an article to be processed and processing apparatus
    7.
    发明授权
    Method and apparatus for transferring an article to be processed and processing apparatus 有权
    用于转移待处理物品的处理装置和方法

    公开(公告)号:US07246984B2

    公开(公告)日:2007-07-24

    申请号:US10801007

    申请日:2004-03-16

    IPC分类号: H01L21/677

    摘要: A transferring apparatus transfers an article to be processed, which is carried by a carrier device, to a holder provided in a processing chamber defined by a processing vessel and adapted to hold the article at a specified processing position. The transferring apparatus includes a temporarily holding member, and transfers the article from the intermediate position to the processing position after receiving the article carried by the carrier device at an intermediate position distanced from the holder and temporarily holding it. The temporarily holding member is retracted to a position in the outside of the processing vessel after the article is transferred.

    摘要翻译: 传送装置将由承载装置携带的待处理物品传送到设置在由处理容器限定的处理室中的保持器,并适于将物品保持在指定的处理位置。 传送装置包括临时保持构件,并且在远离保持器的中间位置接收由托架装置承载的物品并暂时保持物品后,将物品从中间位置传送到处理位置。 在传送物品之后,临时保持构件缩回到处理容器的外部的位置。