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公开(公告)号：US10797402B2
公开(公告)日：2020-10-06
申请号：US16176263
申请日：2018-10-31
Applicant: Elta Systems Ltd.
Inventor： Amir Shmuel , Michael Kedem
Abstract: A reflective antenna comprising a flexible reflective sheet extending between a central hub and a perimeter edge, and a reflective sheet support mechanism comprising one or more spiral ribs articulated to the reflector sheet at least at several locations along the perimeter edge of the reflective sheet; wherein at a collapsed, stowed position of the reflective antenna the one or more spiral ribs are coiled about a common center and the reflective sheet is folded at a compact configuration, and at an expanded, deployed position the one or more spiral ribs are radially expanded and the reflective sheet is stretched over the expanded one or more spiral ribs, imparting the reflective sheet a parabolic shape.
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公开(公告)号：US10748837B2
公开(公告)日：2020-08-18
申请号：US16299401
申请日：2019-03-12
Applicant: Elta Systems Ltd.
Inventor： Michael Kedem
IPC: H01L23/427 , H05K1/02 , H05K7/20
Abstract: A heatsink assembly including a substrate having an active circuitry, at least one cavity located adjacent to at least one heat producing element of the active circuitry, at least one vessel sealably coupled to said substrate in fluid communication with the at least one cavity, and a phase change material (PCM) contained inside the vessel. The vessel and at least one cavity are configured to facilitate migration of the PCM from the vessel into the at least one cavity for absorbing heat produced by the at least one heat producing element of the active circuitry.
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Patent Agency Ranking
3.发明授权公开(公告)号：US12068223B2
公开(公告)日：2024-08-20
申请号：US17360049
申请日：2021-06-28
Applicant: Elta Systems Ltd.
Inventor： Michael Kedem
CPC classification number: H01L23/427 , H05K1/0203 , H05K1/0272 , H05K3/0061 , H05K3/12 , H05K3/301 , H05K7/20327 , H05K2201/09036 , Y10T29/4913
Abstract: A heatsink assembly comprising a substrate having an active circuitry, at least one cavity located adjacent to at least one heat producing element of the active circuitry, at least one vessel sealably coupled to said substrate in fluid communication with the at least one cavity, and a phase change material (PCM) contained inside the vessel. The vessel and at least one cavity configured to facilitate migration of the PCM from the vessel into the at least one cavity for absorbing heat produced by the at least one heat producing element of the active circuitry.
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公开(公告)号：US20230317679A1
公开(公告)日：2023-10-05
申请号：US18003364
申请日：2021-06-29
Applicant: ELTA SYSTEMS LTD.
Inventor： Yaniv Maydar , Gil Peshes , Michael Kedem
IPC: H01L25/065 , H01L23/538 , H01L23/31 , H01L25/00 , H01L23/00
CPC classification number: H01L25/0655 , H01L23/5385 , H01L23/3128 , H01L23/5384 , H01L25/50 , H01L24/96 , H01L2224/96
Abstract: An integrated circuit assembly and a method for fabricating the same are disclosed. The integrated circuit assembly includes: a base structure including an interposer board and a plurality of interfacing dies electrically coupled to said interposer board; a cap structure including an intermediating board and a panel of active elements having a plurality of active elements electrically coupled to the intermediating board. The cap structure is attached to the base structure such that the active elements are electrically coupled to the interfacing dies. Also disclosed are a tile including a backend circuit board configured to attach to the plurality of integrated circuits and provide electrical connectivity thereto the plurality of integrated circuits, and a method of fabricating the same, as well as an array of the plurality of such tile in cascade connection.
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公开(公告)号：US20230215773A1
公开(公告)日：2023-07-06
申请号：US17927601
申请日：2021-05-11
Applicant: ELTA SYSTEMS LTD.
Inventor： Itzhak Shapir , Michael Kedem
CPC classification number: H01L23/24 , H01L23/66 , H01L23/3121 , H01L21/565 , H01L25/0655 , H01L23/293 , H01L2223/6672
Abstract: An integrated circuit (IC) assembly and a method for encapsulating of IC are presented. The IC assembly comprises an IC substrate having one or more micro-devices, at least one dielectric matrix element placed on said IC substrate over at least one of its one or more micro-devices; and an encapsulation element applied over said IC substrate and said at least one dielectric matrix element placed thereon to enclose and seal said IC substrate.
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公开(公告)号：US20210327786A1
公开(公告)日：2021-10-21
申请号：US17360049
申请日：2021-06-28
Applicant: Elta Systems Ltd.
Inventor： Michael Kedem
IPC: H01L23/427 , H05K1/02 , H05K7/20
Abstract: A heatsink assembly comprising a substrate having an active circuitry, at least one cavity located adjacent to at least one heat producing element of the active circuitry, at least one vessel sealably coupled to said substrate in fluid communication with the at least one cavity, and a phase change material (PCM) contained inside the vessel. The vessel and at least one cavity configured to facilitate migration of the PCM from the vessel into the at least one cavity for absorbing heat produced by the at least one heat producing element of the active circuitry
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公开(公告)号：US20200335421A1
公开(公告)日：2020-10-22
申请号：US16922268
申请日：2020-07-07
Applicant: Elta Systems Ltd.
Inventor： Michael Kedem
IPC: H01L23/427 , H05K1/02 , H05K7/20
Abstract: A heatsink assembly comprising a substrate having an active circuitry, at least one cavity located adjacent to at least one heat producing element of the active circuitry, at least one vessel sealably coupled to said substrate in fluid communication with the at least one cavity, and a phase change material (PCM) contained inside the vessel. The vessel and at least one cavity configured to facilitate migration of the PCM from the vessel into the at least one cavity for absorbing heat produced by the at least one heat producing element of the active circuitry
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