公开(公告)号：US20190301025A1

公开(公告)日：2019-10-03

申请号：US15943350

申请日：2018-04-02

申请人： Elwha LLC

发明人： Gleb M. Akselrod ,  Erik Edward Josberger ,  Mark C. Weidman

IPC分类号： C23C28/00 ,  G03H1/02 ,  C25D5/02 ,  C25D3/38 ,  C25D5/48 ,  C25D5/34 ,  C23C14/34 ,  C23C14/18 ,  C23C14/02

摘要： The disclosure provides a method for fabricating a metallic optical metasurface having an array of hologram elements. The method includes forming a first copper layer protected with a conducting or dielectric barrier layer over a backplane structure by a damascene process. The first copper layer comprises a plurality of nano-gaps vertically extending from the backplane structure. The plurality of nano-gaps is filled with a dielectric material. The method also includes removing the dielectric material and a portion of the conducting or dielectric barrier layer to expose the portions in the nano-gaps of the first copper layer. The method may further include depositing a dielectric coating layer over the top portion and exposed side portions of the first copper layer to form a protected first copper layer, and filling the gaps with an electrically-tunable dielectric material that has an electrically-tunable refractive index.

公开(公告)号：US11851582B2

公开(公告)日：2023-12-26

申请号：US17561847

申请日：2021-12-24

申请人： Elwha LLC

发明人： Gleb M. Akselrod ,  Erik Edward Josberger ,  Mark C. Weidman

IPC分类号： G02B1/116 ,  C09D5/00 ,  C09D5/32 ,  F41H3/00 ,  G02B1/00 ,  G02B1/118 ,  G02B5/20

CPC分类号： C09D5/32 ,  C09D5/006 ,  F41H3/00 ,  G02B1/002 ,  G02B1/116 ,  G02B1/118 ,  G02B5/204

摘要： Subwavelength conducting particles can be arranged on conducting surfaces to provide arbitrary thermal emissivity spectra. For example, a thermal emissivity spectrum can be tailored to suppress a thermal signature of an object without sacrificing radiative cooling efficiency.

公开(公告)号：US11208568B2

公开(公告)日：2021-12-28

申请号：US15981354

申请日：2018-05-16

申请人： Elwha LLC

发明人： Gleb M. Akselrod ,  Erik Edward Josberger ,  Mark C. Weidman

IPC分类号： G02B1/116 ,  G02B1/00 ,  C09D5/32 ,  C09D5/00 ,  F41H3/00 ,  G02B1/118 ,  G02B5/20

摘要： Subwavelength conducting particles can be arranged on conducting surfaces to provide arbitrary thermal emissivity spectra. For example, a thermal emissivity spectrum can be tailored to suppress a thermal signature of an object without sacrificing radiative cooling efficiency.

公开(公告)号：US10790324B2

公开(公告)日：2020-09-29

申请号：US16675030

申请日：2019-11-05

申请人： Elwha LLC

发明人： Gleb M. Akselrod ,  Erik E. Josberger ,  Mark C. Weidman

IPC分类号： H01L21/00 ,  H01L27/146 ,  H01J37/32 ,  H01J37/317 ,  G02F1/1341 ,  G02F1/1339 ,  G02F1/01 ,  G01S17/89 ,  G01S17/42 ,  G01S17/10 ,  G01S7/481 ,  H01Q15/14 ,  H01Q15/02 ,  H01Q15/00 ,  H01Q3/44 ,  H01Q1/38 ,  G03H1/02 ,  B82Y20/00 ,  B29D11/00 ,  H04N5/374 ,  H04N5/225 ,  G03H1/04 ,  G02B5/18 ,  G02F1/29 ,  G03H1/00 ,  G02F1/1334 ,  G03F7/20

摘要： A 2D hologram system with a matrix addressing scheme is provided. The system may include a 2D array of sub-wavelength hologram elements integrated with a refractive index tunable core material on a wafer substrate. The system may also include a matrix addressing scheme coupled to the 2D array of sub-wavelength hologram elements and configured to independently control each of the sub-wavelength hologram elements by applying a voltage.

公开(公告)号：US20190252441A1

公开(公告)日：2019-08-15

申请号：US16267053

申请日：2019-02-04

申请人： Elwha LLC

发明人： Gleb M. Akselrod ,  Erik E. Josberger ,  Mark C. Weidman

IPC分类号： H01L27/146 ,  H04N5/374 ,  H01J37/32 ,  H01Q1/38 ,  H01Q3/44 ,  H01Q15/02 ,  G01S7/481 ,  G01S17/10 ,  G01S17/89 ,  G02F1/01 ,  G02F1/1339 ,  H01J37/317 ,  H04N5/225 ,  G03H1/04 ,  G02B5/18 ,  G01S17/42 ,  H01Q15/14 ,  H01Q15/00 ,  G03H1/02 ,  B29D11/00 ,  G02F1/1341

CPC分类号： H01L27/14625 ,  B29D11/00326 ,  B82Y20/00 ,  G01S7/4813 ,  G01S7/4817 ,  G01S17/10 ,  G01S17/42 ,  G01S17/89 ,  G02B5/1809 ,  G02F1/0107 ,  G02F1/13342 ,  G02F1/1339 ,  G02F1/1341 ,  G02F1/292 ,  G02F2202/103 ,  G02F2202/30 ,  G02F2202/36 ,  G03F7/2041 ,  G03F7/2059 ,  G03H1/00 ,  G03H1/0244 ,  G03H1/0443 ,  G03H2240/13 ,  H01J37/3174 ,  H01J37/32816 ,  H01J2237/334 ,  H01L27/14643 ,  H01Q1/38 ,  H01Q3/44 ,  H01Q15/002 ,  H01Q15/0066 ,  H01Q15/02 ,  H01Q15/148 ,  H04N5/2253 ,  H04N5/374

摘要： The method is provided for fabricating an optical metasurface. The method may include depositing a conductive layer over a holographic region of a wafer and depositing a dielectric layer over the conducting layer. The method may also include patterning a hard mask on the dielectric layer. The method may further include etching the dielectric layer to form a plurality of dielectric pillars with a plurality of nano-scale gaps between the pillars.

公开(公告)号：US10332923B2

公开(公告)日：2019-06-25

申请号：US15824189

申请日：2017-11-28

申请人： Elwha LLC

发明人： Erik E. Josberger ,  Gleb M. Akselrod ,  Mark C. Weidman

IPC分类号： H01L21/00 ,  H01L27/146 ,  G02F1/29 ,  G02B5/18 ,  G03H1/04 ,  H04N5/225 ,  H04N5/374 ,  G01S7/481 ,  H01Q1/38 ,  H01Q3/44 ,  H01Q15/02 ,  G01S17/10 ,  G01S17/42 ,  G01S17/89 ,  G02F1/01 ,  G02F1/1339 ,  G02F1/1341 ,  H01J37/317 ,  H01J37/32 ,  B29D11/00 ,  B82Y20/00 ,  G03H1/00 ,  H01Q15/00 ,  H01Q15/14 ,  G02F1/1334

摘要： A hologram system may include a hologram chip comprising a wafer substrate having a first plurality of conductive pads on a hologram surface region connected to a second plurality of conductive pads on an interconnect surface region. The hologram chip may also include an array of sub-wavelength hologram elements integrated with a refractive index tunable core material on the hologram region of the wafer substrate. The hologram system may also include a control circuit chip having a third plurality of conductive pads connected to the second plurality of conductive pads on the interconnect region of the wafer substrate. The interconnect region is on the same side of the wafer substrate as the hologram region. The first plurality of conductive pads is directly connected to the array of sub-wavelength hologram elements.

公开(公告)号：US10886317B2

公开(公告)日：2021-01-05

申请号：US16841413

申请日：2020-04-06

申请人： Elwha LLC

发明人： Gleb M. Akselrod ,  Erik E. Josberger ,  Mark C. Weidman

IPC分类号： H01L27/146 ,  G02B5/18 ,  G03H1/04 ,  H04N5/225 ,  H04N5/374 ,  B29D11/00 ,  B82Y20/00 ,  G03H1/02 ,  H01Q1/38 ,  H01Q3/44 ,  H01Q15/00 ,  H01Q15/02 ,  H01Q15/14 ,  G01S7/481 ,  G01S17/10 ,  G01S17/42 ,  G01S17/89 ,  G02F1/01 ,  G02F1/1339 ,  G02F1/1341 ,  H01J37/317 ,  H01J37/32 ,  G03H1/00 ,  G02F1/29 ,  G02F1/1334 ,  G03F7/20

摘要： The method is provided for fabricating an optical metasurface. The method may include depositing a conductive layer over a holographic region of a wafer and depositing a dielectric layer over the conducting layer. The method may also include patterning a hard mask on the dielectric layer. The method may further include etching the dielectric layer to form a plurality of dielectric pillars with a plurality of nano-scale gaps between the pillars.

公开(公告)号：US20200303443A1

公开(公告)日：2020-09-24

申请号：US16841413

申请日：2020-04-06

申请人： Elwha LLC

发明人： Gleb M. Akselrod ,  Erik E. Josberger ,  Mark C. Weidman

IPC分类号： H01L27/146 ,  G02F1/29 ,  G02B5/18 ,  G03H1/04 ,  H04N5/225 ,  H04N5/374 ,  B29D11/00 ,  B82Y20/00 ,  G03H1/02 ,  H01Q1/38 ,  H01Q3/44 ,  H01Q15/00 ,  H01Q15/02 ,  H01Q15/14 ,  G01S7/481 ,  G01S17/10 ,  G01S17/42 ,  G01S17/89 ,  G02F1/01 ,  G02F1/1339 ,  G02F1/1341 ,  H01J37/317 ,  H01J37/32 ,  G03H1/00

摘要： The method is provided for fabricating an optical metasurface. The method may include depositing a conductive layer over a holographic region of a wafer and depositing a dielectric layer over the conducting layer. The method may also include patterning a hard mask on the dielectric layer. The method may further include etching the dielectric layer to form a plurality of dielectric pillars with a plurality of nano-scale gaps between the pillars.

公开(公告)号：US10468447B2

公开(公告)日：2019-11-05

申请号：US15824893

申请日：2017-11-28

申请人： Elwha LLC

发明人： Gleb M. Akselrod ,  Erik E. Josberger ,  Mark C. Weidman

IPC分类号： H01L21/00 ,  H01L27/146 ,  G02B5/18 ,  G03H1/04 ,  H04N5/225 ,  H04N5/374 ,  G01S7/481 ,  H01Q1/38 ,  H01Q3/44 ,  H01Q15/00 ,  H01Q15/02 ,  H01Q15/14 ,  G01S17/10 ,  G01S17/42 ,  G01S17/89 ,  G02F1/01 ,  G02F1/1339 ,  G02F1/1341 ,  H01J37/317 ,  H01J37/32 ,  B29D11/00 ,  G03H1/02 ,  G02F1/29 ,  B82Y20/00 ,  G02F1/1334 ,  G03F7/20

摘要： A 2D hologram system with a matrix addressing scheme is provided. The system may include a 2D array of sub-wavelength hologram elements integrated with a refractive index tunable core material on a wafer substrate. The system may also include a matrix addressing scheme coupled to the 2D array of sub-wavelength hologram elements and configured to independently control each of the sub-wavelength hologram elements by applying a voltage.

公开(公告)号：US10199415B2

公开(公告)日：2019-02-05

申请号：US15799654

申请日：2017-10-31

申请人： Elwha LLC

发明人： Gleb M. Akselrod ,  Erik E. Josberger ,  Mark C. Weidman

IPC分类号： H01L27/14 ,  H01L27/146 ,  G02F1/29 ,  G02B5/18 ,  G03H1/04 ,  H04N5/225 ,  H04N5/374 ,  G01S7/481 ,  H01Q1/38 ,  H01Q3/44 ,  H01Q15/00 ,  H01Q15/02 ,  H01Q15/14 ,  G01S17/10 ,  G01S17/42 ,  G01S17/89 ,  G02F1/01 ,  G02F1/1339 ,  G02F1/1341 ,  H01J37/317 ,  H01J37/32

摘要： The method is provided for fabricating an optical metasurface. The method may include depositing a conductive layer over a holographic region of a wafer and depositing a dielectric layer over the conducting layer. The method may also include patterning a hard mask on the dielectric layer. The method may further include etching the dielectric layer to form a plurality of dielectric pillars with a plurality of nano-scale gaps between the pillars.