摘要:
An electrical connector is provided for surface mounting on a printed circuit board and includes a dielectric housing having a mating face and a surface mounting face. The mating face includes a mating cavity. The surface mounting face includes a terminal-receiving passageway communicating with the cavity. A terminal is mounted on the housing, the terminal being stamped and formed of sheet metal material in a T-shaped configuration defining a trunk portion and a cross portion. The trunk portion extends through the passageway and projects into the mating cavity of the housing to provide a male terminal pin therein. The cross portion is exposed at the surface mounting face of the housing for contacting a circuit trace on the printed circuit board.
摘要:
An improved ejector mechanism is disclosed in conjunction with a header connector into which an IC pack is loaded and from which it is ejected. The IC pack includes a shell having a vertically extending leading face and at least one row of contacts extending a horizontal distance defining a contact array. A unitary ejecting lever is pivotally mounted to the header connector, with one end of the lever being effective to engage and eject the IC pack from the header connector. A unitary push-rod is reciprocally axially movably mounted on an appropriate support at one side of the header connector. One end of the push rod is engageable with the opposite end of the ejecting lever for pivoting the lever in response to movement of the push-rod. The one end of the ejecting lever engages and ejects the IC pack along a leading face thereof in an area defined horizontally by the distance the row of contacts extends and vertically by the height of the leading face of the memory card.
摘要:
A board-mountable connector is provided. The connector includes a shield and an insulative housing with a tongue. Terminals are supported by the housing in two rows and the rows extend from a mating interface to a board mounting interface. The terminals may be mounted to the board via surface mount technology in two rows that are at about 0.4 mm pitch. The two rows of terminals are configured in a signal, signal, ground triangular configuration so as to provide a triangular terminal arrangement that extends from the mating interface to the mounting interface.
摘要:
A connector assembly is provided with opposing and interengageable first and second connector components. Each of the two components preferably includes upper and lower housing formed from an insulative material coated with electrically-conductive material, with cavities formed therein that receive terminal assemblies. The upper and lower housings are formed with internal cavities that extend in orthogonal directions. Each cavity contains a terminal assembly of either plug or receptacle structure and may further include either a plurality of power terminals or differential signal terminals. The terminals have contact portions, tail portions and interconnecting portions that are partially encapsulated by an insulative outer shell. In assembling the first and second components, multiple ground connections are made in sequence before any signal or power supply connections are made. In disassembling the components, signals and power supply connections are broken first, then the ground connections are broken in a sequence that is the reverse of what was made during assembly.
摘要:
A connector assembly for connecting to differential signal circuits on at least one circuit board may be of the docking type or the interposer type. A housing of the connector has transversely and longitudinally extending walls that define a plurality of cavities that extend completely through the housing. Terminal assemblies with at least one differential signal pair are received in the cavities with tail portions on at least one end of the differential pairs to connect to a circuit board. The connector housing has conductive surfaces and a plurality of ground terminal members are disposed along the transverse walls or the longitudinal walls, or both, for connecting to ground circuits in the circuit board. The ground terminal members each have a plurality of ground terminals, which are disposed along the walls at intermediate or diagonal positions relative to the differential signal pairs, such as adjacent to four differential signal pairs. Such placement of the ground terminal members also subdivides the differential signal pairs into groups or sets. This interstitial ground terminal arrangement also serves to keep the impedance at the connector-circuit board interface relatively uniform for high speed signals in the differential pairs.
摘要:
A grounding system is provided for a card-receiving header connector assembly. The header connector assembly includes a header connector mounted on a printed circuit board for receiving an IC card. The IC card includes a receptacle connector and a receptacle shield. A plurality of terminals are mounted within the header connector and are adapted for mating to terminals of the receptacle connector of the IC card. A grounding shroud is mounted on the header connector and includes a main body plate and a plurality of ground contact portions formed therein for engaging corresponding contacts on the receptacle shield of the IC card. The ground contact portions each are formed by a generally C-shaped spring arm having opposite ends joined to the main body plate of the shroud, with a portion of the spring arm between the ends being formed downwardly for asymmetrically engaging the contacts on the receptacle shield of the IC card.
摘要:
A connector includes a housing positioned in a cage. A vertical wall is positioned around the housing and is soldered to a printed circuit board that is supporting the connector. The vertical wall includes a plurality of fingers that are configured to engage the cage. The fingers are positioned at intervals such that the distance between the fingers acts to control the frequencies of EMI that emit from the connector.
摘要:
An adapter frame assembly is provided for receiving at least a pair of connectors in a stacked array with one connector above another connector at different spacings therebetween. The assembly includes at least a pair of frame structures including at least a top frame structure and a bottom frame structure each including a receptacle for receiving a respective one of the stacked connectors. The top frame structure may be mounted directly on top of the bottom frame structure and, thereby, space the receptacles and the respective connectors at a first spacing therebetween. A spacer is selectively mountable between the frame structures to thereby space the receptacles and the respective connectors at a second, increased spacing therebetween.
摘要:
A grounding system is provided for an electrical connector assembly which provides an interconnection between a PC card and a main printed circuit board. A header connector is mounted on the main printed circuit board and receives the PC card. Mating terminals are provided on the header connector and a receptacle connector on the PC card for interconnection of the PC card to electrical circuit traces on the main printed circuit board. At least one header grounding contact is mounted on the header connector adjacent to but spaced from the terminals and coupled to a logic ground circuit on the main printed circuit board. A card grounding contact is mounted on the PC card near the front insertion end thereof for engaging the header grounding contact and commoning the logic ground circuit of the main printed circuit board to a logic ground circuit on the PC card to provide a low impedance ground return.
摘要:
A method is provided for fabricating a receptacle connector for use in an IC card assembly wherein the receptacle connector is adapted for mounting generally at an edge of a circuit substrate. A housing is provided with an upper surface and a plurality of terminal-receiving passages in a dual row configuration extend parallel to the upper surface. The circuit substrate is adapted to be located a given vertical distance from the upper surface of the housing. A plurality of receptacle terminals are inserted into the passages with surface mount tail portions of the terminals projecting outside the passages. The vertical distance between the circuit substrate and the top of the housing is determined. The tail portions of the two rows of terminals initially project in a generally straight planar array from a rear face of the housing. In a single final forming step, the surface mount tail portions are formed into coplanar curved contact portions such that the contact portions of the surface mount tail portions will engage a corresponding single row contact pad array on the edge of the circuit substrate when the receptacle connector is mounted generally thereon.