中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

8 records (took 0.017 seconds)

    Motion sensing
    1.
    发明授权
    Motion sensing 有权
    运动感应

    公开(公告)号：US09164121B2

    公开(公告)日：2015-10-20

    申请号：US13980577

    申请日：2012-11-07

    Applicant: EMPIRE TECHNOLOGY DEVELOPMENT LLC

    Inventor： Hiroshi Goto

    IPC: G01P15/00 ,  G01P15/12 ,  G01P15/03

    CPC classification number: G01P15/038

    Abstract: Technologies are generally described for detecting acceleration by sensing a movement of a liquid contained in at least one liquid flow path arranged in a film-type material. An example device may be configured to detect acceleration based at least in part on an output signal from at least one strain sensor formed on at least one surface of a film layer. The film layer may include at least one liquid flow path containing a liquid and arranged in the film layer. The strain sensor may be formed on the at least one surface of the film layer in the vicinity of the least one liquid flow path, and may be configured to detect deformation on the at least one surface of the film layer.

    Abstract translation: 通常描述技术来通过感测包含在布置在膜型材料中的至少一个液体流路中的液体的运动来检测加速度。 至少部分地基于来自形成在膜层的至少一个表面上的至少一个应变传感器的输出信号来检测加速度的示例性装置。 薄膜层可以包括至少一个液体流路，其中含有液体并设置在薄膜层中。 应变传感器可以形成在膜层的至少一个液体流路附近的至少一个表面上，并且可以被配置为检测膜层的至少一个表面上的变形。

    WAFER LEVEL OPTICAL DEVICE
    3.
    发明申请
    WAFER LEVEL OPTICAL DEVICE 有权
    水平光学设备

    公开(公告)号：US20140169730A1

    公开(公告)日：2014-06-19

    申请号：US14009098

    申请日：2012-10-25

    Applicant: Empire Technology Development LLC

    Inventor： Hiroshi Goto

    IPC: G02B6/12 ,  G02B6/13

    CPC classification number: G02B6/12 ,  G02B6/13 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/02325 ,  H01L2924/0002 ,  H04N5/2254 ,  H01L2924/00

    Abstract: Technologies are generally described for fabricating a wafer level optical device using a plurality of substrates made of materials with a substantially compatible (e.g., same or similar) thermal expansion coefficient. An example device may include a first substrate including light-receiving or light-emitting elements, and a second substrate including optical elements located within through-holes of the second substrate. The through-holes can be configured to substantially align each of the light-receiving or light-emitting elements with a corresponding one of the optical elements. A thermal expansion coefficient of the second substrate can be configured to be substantially the same to a thermal expansion coefficient of the first substrate.

    Abstract translation: 通常描述技术来制造使用由具有基本相容（例如相同或相似）的热膨胀系数的材料制成的多个基板的晶片级光学器件。 示例性装置可以包括包括光接收或发光元件的第一基板，以及包括位于第二基板的通孔内的光学元件的第二基板。 通孔可以被配置为基本对准每个光接收或发光元件与相应的一个光学元件。 第二基板的热膨胀系数可以被构造成与第一基板的热膨胀系数基本相同。

    OPTO-MECHANICAL ALIGNMENT
    4.
    发明申请
    OPTO-MECHANICAL ALIGNMENT 有权
    光机械对准

    公开(公告)号：US20150087092A1

    公开(公告)日：2015-03-26

    申请号：US14349656

    申请日：2013-04-22

    Applicant: Empire Technology Development LLC

    Inventor： Hiroshi Goto

    IPC: H01L33/00 ,  H01S5/00 ,  H01L31/18 ,  H01L33/58 ,  H01L31/0232

    CPC classification number: H01L33/005 ,  G02B6/32 ,  G02B6/4204 ,  G02B6/4212 ,  G02B6/4214 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02325 ,  H01L31/18 ,  H01L33/58 ,  H01L2224/83143 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01S5/005

    Abstract: Technologies are generally described for manufacturing an optical device by attaching a light-emitting element to an optical element through a resin. In various examples, a method is described, where a substrate is provided to have a through-hole at a position in the substrate where an optical element is to be mounted. A resin in liquid state may be injected into the through-hole in the substrate. Further, an optical element having a light-emitting portion may be mounted on the substrate such that a center of the tight-emitting portion is self-aligned with a center of the through-hole due to a surface tension of the resin in liquid state. The resin may be cured such that the optical element is fixed to the substrate.

    Abstract translation: 通常通过将发光元件通过树脂附着到光学元件来描述用于制造光学器件的技术。 在各种示例中，描述了一种方法，其中提供基板以在要安装光学元件的基板中的位置处具有通孔。 液态的树脂可以注入到基底中的通孔中。 此外，具有发光部分的光学元件可以安装在基板上，使得紧密发射部分的中心由于处于液态的树脂的表面张力而与通孔的中心自对准 。 树脂可以被固化，使得光学元件固定到基底上。

    Opto-mechanical alignment
    6.
    发明授权
    Opto-mechanical alignment 有权
    光机械对准

    公开(公告)号：US09252321B2

    公开(公告)日：2016-02-02

    申请号：US14349656

    申请日：2013-04-22

    Applicant: Empire Technology Development LLC

    Inventor： Hiroshi Goto

    IPC: H01L21/68 ,  H01L21/02 ,  H01L31/0232 ,  H01L31/0203 ,  H01L33/00 ,  H01L31/18 ,  H01L33/58 ,  H01S5/00 ,  G02B6/42 ,  G02B6/32

    CPC classification number: H01L33/005 ,  G02B6/32 ,  G02B6/4204 ,  G02B6/4212 ,  G02B6/4214 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02325 ,  H01L31/18 ,  H01L33/58 ,  H01L2224/83143 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01S5/005

    Abstract: Technologies are generally described for manufacturing an optical device by attaching a light-emitting element to an optical element through a resin. In various examples, a method is described, where a substrate is provided to have a through-hole at a position in the substrate where an optical element is to be mounted. A resin in liquid state may be injected into the through-hole in the substrate. Further, an optical element having a light-emitting portion may be mounted on the substrate such that a center of the tight-emitting portion is self-aligned with a center of the through-hole due to a surface tension of the resin in liquid state. The resin may be cured such that the optical element is fixed to the substrate.

    Abstract translation: 通常通过将发光元件通过树脂附着到光学元件来描述用于制造光学器件的技术。 在各种示例中，描述了一种方法，其中提供基板以在要安装光学元件的基板中的位置处具有通孔。 液态的树脂可以注入到基底中的通孔中。 此外，具有发光部分的光学元件可以安装在基板上，使得紧密发射部分的中心由于处于液态的树脂的表面张力而与通孔的中心自对准 。 树脂可以被固化，使得光学元件固定到基底上。

    Wafer level optical device
    7.
    发明授权
    Wafer level optical device 有权
    晶圆级光学器件

    公开(公告)号：US09182545B2

    公开(公告)日：2015-11-10

    申请号：US14009098

    申请日：2012-10-25

    Applicant: Empire Technology Development LLC

    Inventor： Hiroshi Goto

    IPC: G02B6/12 ,  G02B6/13 ,  H01L31/0232 ,  H01L27/146 ,  H04N5/225

    CPC classification number: G02B6/12 ,  G02B6/13 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/02325 ,  H01L2924/0002 ,  H04N5/2254 ,  H01L2924/00

    Abstract: Technologies are generally described for fabricating a wafer level optical device using a plurality of substrates made of materials with a substantially compatible (e.g., same or similar) thermal expansion coefficient. An example device may include a first substrate including light-receiving or light-emitting elements, and a second substrate including optical elements located within through-holes of the second substrate. The through-holes can be configured to substantially align each of the light-receiving or light-emitting elements with a corresponding one of the optical elements. A thermal expansion coefficient of the second substrate can be configured to be substantially the same to a thermal expansion coefficient of the first substrate.

    Abstract translation: 通常描述技术来制造使用由具有基本相容（例如相同或相似）热膨胀系数的材料制成的多个基板的晶片级光学器件。 示例性装置可以包括包括光接收或发光元件的第一基板，以及包括位于第二基板的通孔内的光学元件的第二基板。 通孔可以被配置为基本对准每个光接收或发光元件与相应的一个光学元件。 第二基板的热膨胀系数可以被构造成与第一基板的热膨胀系数基本相同。

    MOTION SENSING
    8.
    发明申请
    MOTION SENSING 有权
    运动感觉

    公开(公告)号：US20140123755A1

    公开(公告)日：2014-05-08

    申请号：US13980577

    申请日：2012-11-07

    Applicant: EMPIRE TECHNOLOGY DEVELOPMENT LLC

    Inventor： Hiroshi Goto

    IPC: G01P15/03

    CPC classification number: G01P15/038

    Abstract: Technologies are generally described for detecting acceleration by sensing a movement of a liquid contained in at least one liquid flow path arranged in a film-type material. An example device may be configured to detect acceleration based at least in part on an output signal from at least one strain sensor formed on at least one surface of a film layer. The film layer may include at least one liquid flow path containing a liquid and arranged in the film layer. The strain sensor may be formed on the at least one surface of the film layer in the vicinity of the least one liquid flow path, and may be configured to detect deformation on the at least one surface of the film layer.

    Abstract translation: 通常描述技术来通过感测包含在布置在膜型材料中的至少一个液体流路中的液体的运动来检测加速度。 至少部分地基于来自形成在膜层的至少一个表面上的至少一个应变传感器的输出信号来检测加速度的示例性装置。 薄膜层可以包括至少一个液体流路，其中含有液体并设置在薄膜层中。 应变传感器可以形成在膜层的至少一个液体流路附近的至少一个表面上，并且可以被配置为检测膜层的至少一个表面上的变形。

Patent Agency Ranking