摘要:
An optical assembly for a system for inspecting or measuring of an object is provided that is configured to move as a unit with a system, as the system is pointed at a target, and eliminates the need for a large scanning (pointing) mirror that is moveable relative to other parts of the system. The optical assembly comprises catadioptric optics configured to fold the optical path of the pointing beam and measurement beam that are being directed through the outlet of the system, to compress the size of the optical assembly.
摘要:
A compact optical assembly for a laser radar system is provided, that is configured to move as a unit with a laser radar system as the laser radar system is pointed at a target and eliminates the need for a large scanning (pointing) mirror that is moveable relative to other parts of the laser radar. The optical assembly comprises a light source, a lens, a scanning reflector and a fixed reflector that are oriented relative to each other such that: (i) a beam from the light source is reflected by the scanning reflector to the fixed reflector; (ii) reflected light from the fixed reflector is reflected again by the scanning reflector and directed along a line of sight through the lens; and (iii) the scanning reflector is moveable relative to the source, the lens and the fixed reflector, to adjust the focus of the beam along the line of sight.
摘要:
A compact optical assembly for a laser radar system is provided, that is configured to move as a unit with a laser radar system as the laser radar system is pointed at a target and eliminates the need for a large scanning (pointing) mirror that is moveable relative to other parts of the laser radar. The optical assembly comprises a light source, a lens, a scanning reflector and a fixed reflector that are oriented relative to each other such that: (i) a beam from the light source is reflected by the scanning reflector to the fixed reflector; (ii) reflected light from the fixed reflector is reflected again by the scanning reflector and directed along a line of sight through the lens; and (iii) the scanning reflector is moveable relative to the source, the lens and the fixed reflector, to adjust the focus of the beam along the line of sight.
摘要:
In one embodiment, a stage apparatus includes a wafer stage, at least one conduit, and a measurement stage. The at least one conduit is coupled between the wafer stage and a ground. The measurement stage is configured to approximately follow the wafer stage during at least a portion of a motion of the wafer stage, and is configured to carry the at least one conduit to reduce disturbances on the wafer stage caused by the at least one conduit.
摘要:
The invention utilizes green support structures during sintering to maintain the shape, reduce sagging and prevent separate part sections from coming into contact and fusing together during the sintering process. In the most preferred embodiment, monolithic green structures are form with integrated support green structures that are released from the parts after sintering. Preferably monolithic green structures are formed by the Mold Shape Deposition Manufacturing (Mold SDM) process. By the method described, complex sintered structures can be made having interlocking and independently movable interlocking parts.
摘要:
Micro-Mold Shape Deposition Manufacturing (&mgr;-Mold SDM) is a method for fabricating complex, three-dimensional microstructures from layered silicon molds. Silicon wafers are etched using conventional silicon-processing techniques to produce wafers with surface patterns, some of which contain through-etched regions. The wafers are then stacked and bonded together to form a mold, which is filled with part material. In one embodiment, the part material is a ceramic or metallic gelcasting slurry that is poured into the mold and solidified to form a part precursor. The mold is removed, and the precursor is sintered to form the final part. The gelcasting material may also be a polymer or magnetic slurry, in which case sintering is not needed. The mold can also be filled by electroplating a metal into it; if necessary, each layer is filled with metal after being bonded to a previously filled layer. Patterned silicon wafer layers may also be combined with macroscopic wax layers formed by Mold SDM to create macroscopic parts with some microscopic parts or features.
摘要:
Embodiments of the invention provide improved thermal conductivity within, among other things, electromagnetic coils, coil assemblies, electric motors, and lithography devices. In one embodiment, a thermally conductive coil includes at least two adjacent coil layers. The coil layers include windings of wires formed from a conductor and an insulator that electrically insulates the windings within each coil layer. In some cases the insulator of the wires is at least partially absent along an outer surface of one or both coil layers to increase the thermal conductivity between the coil layers. In some embodiments, an insulation layer is provided between the coil layers to electrically insulate the coil layers. In some cases the insulation layer has a thermal conductivity greater than the thermal conductivity of the wire insulator.
摘要:
According to one aspect of the present invention, a motor arrangement includes at least one coil, a cover plate, and a shield layer. The at least one coil has a first side and a second side. The cover plate is positioned substantially over the first side of the at least one coil at a distance from the at least one coil. The shield layer is positioned between the first side of the at least one coil and the cover plate, and has a top surface. The top surface contacts the cover plate, and includes a liquid and a gas that form a mixture and cause the top surface to have a substantially constant temperature.