公开(公告)号：US06238747B1

公开(公告)日：2001-05-29

申请号：US09390934

申请日：1999-09-07

申请人： Vincent L. Marinaro ,  Eric R. Kent

发明人： Vincent L. Marinaro ,  Eric R. Kent

IPC分类号： B05D312

CPC分类号： H01L21/6708 ,  B05C11/08 ,  G03F7/3021 ,  H01L21/67051

摘要： A mechanism for effectively dispensing liquid onto a surface of an IC (Integrated Circuit) wafer with minimized back-splash. A nozzle includes a liquid chamber that fills up with the liquid to be dispensed onto the surface of the IC wafer, and the nozzle includes a plurality of nozzle passages. A nozzle passage carries and directs the liquid from the liquid chamber toward the surface of the IC wafer to provide a respective liquid stream from a respective location on the nozzle to a respective spot on the surface of the IC wafer as the IC wafer is spinning. A nozzle passage is disposed within the nozzle at a respective angle with respect to the surface of the IC wafer such that the respective liquid stream from the nozzle passage is directed toward a velocity vector at the respective spot on the surface of the IC wafer where the respective liquid stream hits the surface of the IC wafer. For example, the respective angle of the nozzle passage with respect to the surface of the IC wafer may be 45°. The angling of the liquid stream toward the velocity vector on the IC wafer as the IC wafer spins reduces back-splash when the liquid stream hits the IC wafer. In addition, the liquid stream may be applied onto the surface of the IC wafer with relatively low pressure. Thus, the nozzle of the present invention dispenses liquid onto the surface of the IC wafer with minimized back-splash to reduce bubble defects within the integrated circuit fabricated on the surface of the IC wafer.

摘要翻译： 用于将液体有效地分配到IC（集成电路）晶片的表面上并具有最小化的反溅射的机构。 喷嘴包括填充有待分配的液体到IC晶片的表面上的液体室，并且喷嘴包括多个喷嘴通道。 喷嘴通道将液体从液体室朝向IC晶片的表面引导并引导，以便当IC晶片旋转时，从喷嘴上的相应位置向IC晶片表面上的相应点提供相应的液体流。 喷嘴通道相对于IC晶片的表面以相应的角度设置在喷嘴内，使得来自喷嘴通道的相应液体流指向IC晶片表面上的各个点处的速度矢量，其中 相应的液体流撞击IC晶片的表面。 例如，喷嘴通道相对于IC晶片的表面的相应角度可以是45°。 当IC晶片旋转时液体流向IC晶片上的速度矢量的倾斜在液体流撞击IC晶片时减少了反溅射。 此外，液体流可以以相对低的压力施加到IC晶片的表面上。 因此，本发明的喷嘴将液体分配到IC晶片的表面上，具有最小化的反溅射，以减少制造在IC晶片表面上的集成电路内的气泡缺陷。

公开(公告)号：US06299688B1

公开(公告)日：2001-10-09

申请号：US09389577

申请日：1999-09-03

申请人： Vincent L. Marinaro ,  Eric R. Kent

发明人： Vincent L. Marinaro ,  Eric R. Kent

IPC分类号： B05C500

CPC分类号： B05B15/52 ,  B05B15/50

摘要： A developer nozzle used to apply developer and other chemicals to a wafer in the processing of semiconductors is kept free of hardened developer or other chemicals by placing a comb-like device in a position that will let the comb be inserted into the spray holes of the nozzle when the nozzle is not in use. The teeth of the comb are tapered for easy insertion by the robot or other programmed device that controls motion of the nozzle. Although hardened developer is the principal concern in such processing, an appropriate comb can be used to maintain the cleanliness of other nozzles used in semiconductor processing.

摘要翻译： 用于在半导体加工中将显影剂和其他化学品施加到晶片上的显影剂喷嘴通过将梳状装置放置在将梳子插入到喷射孔的位置的位置而不含硬化的显影剂或其它化学品 喷嘴不使用喷嘴时。 梳子的齿是锥形的，以便于机器人或其他编程装置的插入，这些装置控制喷嘴的运动。 虽然硬化显影剂是这种加工中的主要关注点，但是可以使用适当的梳子来保持半导体加工中使用的其它喷嘴的清洁度。

公开(公告)号：US6082379A

公开(公告)日：2000-07-04

申请号：US390933

申请日：1999-09-07

申请人： Eric R. Kent ,  Vincent L. Marinaro

发明人： Eric R. Kent ,  Vincent L. Marinaro

IPC分类号： B08B1/00 ,  B08B5/04 ,  H01L21/00 ,  A47L5/24

CPC分类号： H01L21/67028 ,  B08B1/00 ,  B08B5/04

摘要： A mechanism for effectively removing unwanted material stuck on a hot plate for holding an IC (Integrated Circuit) wafer at an operating temperature during fabrication of the IC wafer. A cleaning head includes a rough surface, facing a bottom of the cleaning head, for scraping against the unwanted material on the hot plate to remove the unwanted material from the hot plate. Additionally, the cleaning head includes a vacuum port, disposed near the rough surface and facing the bottom of the cleaning head, for sucking away the loose unwanted material scraped from the hot plate by the rough surface. Furthermore, a handle is coupled to the cleaning head, and an operator manipulates the handle to cause movement of the cleaning head with respect to the hot plate. In a general aspect of the present invention, the cleaning head is made of material having a melting temperature higher than the operating temperature of the hot plate such that the cleaning head is used to remove the unwanted material from the hot plate while the hot plate is at the operating temperature. Thus, because the hot plate is cleaned without first cooling down the hot plate, down time for cleaning the hot plate is minimized during fabrication of integrated circuits on the IC wafers.

摘要翻译： 一种用于在IC晶片的制造期间有效地去除粘附在热板上用于保持IC（集成电路）晶片在工作温度下的不需要的材料的机构。 清洁头包括面向清洁头的底部的粗糙表面，用于刮擦热板上的不需要的材料以从热板上去除不需要的材料。 此外，清洁头包括设置在粗糙表面附近并面向清洁头的底部的真空端口，用于从粗糙表面吸出从热板刮掉的松散的不需要的材料。 此外，手柄连接到清洁头，并且操作者操纵手柄以引起清洁头相对于热板的移动。 在本发明的一般方面，清洁头由熔化温度高于加热板的操作温度的材料制成，使得清洁头用于从热板中除去不需要的材料，而热板是 在工作温度。 因此，由于热板在没有首先冷却热板的情况下被清洁，因此在IC晶片的集成电路制造期间，用于清洁热板的停机时间被最小化。

公开(公告)号：US06361599B1

公开(公告)日：2002-03-26

申请号：US09781821

申请日：2001-02-12

申请人： Vincent L. Marinaro ,  Eric R. Kent

发明人： Vincent L. Marinaro ,  Eric R. Kent

IPC分类号： B05C502

CPC分类号： H01L21/6708 ,  B05C11/08 ,  G03F7/3021 ,  H01L21/67051

摘要： A mechanism for effectively dispensing liquid onto a surface of an IC (Integrated Circuit) wafer with minimized back-splash. A nozzle includes a liquid chamber that fills up with the liquid to be dispensed onto the surface of the IC wafer, and the nozzle includes a plurality of nozzle passages. A nozzle passage carries and directs the liquid from the liquid chamber toward the surface of the IC wafer to provide a respective liquid stream from a respective location on the nozzle to a respective spot on the surface of the IC wafer as the IC wafer is spinning. A nozzle passage is disposed within the nozzle at a respective angle with respect to the surface of the IC wafer such that the respective liquid stream from the nozzle passage is directed toward a velocity vector at the respective spot on the surface of the IC wafer where the respective liquid stream hits the surface of the IC wafer. For example, the respective angle of the nozzle passage with respect to the surface of the IC wafer may be 45°. The angling of the liquid stream toward the velocity vector on the IC wafer as the IC wafer spins reduces back-splash when the liquid stream hits the IC wafer. In addition, the liquid stream may be applied onto the surface of the IC wafer with relatively low pressure. Thus, the nozzle of the present invention dispenses liquid onto the surface of the IC wafer with minimized back-splash to reduce bubble defects within the integrated circuit fabricated on the surface of the IC wafer.

摘要翻译： 用于将液体有效地分配到IC（集成电路）晶片的表面上并具有最小化的反溅射的机构。 喷嘴包括填充有待分配的液体到IC晶片的表面上的液体室，并且喷嘴包括多个喷嘴通道。 喷嘴通道将液体从液体室朝向IC晶片的表面引导并引导，以便当IC晶片旋转时，从喷嘴上的相应位置向IC晶片表面上的相应点提供相应的液体流。 喷嘴通道相对于IC晶片的表面以相应的角度设置在喷嘴内，使得来自喷嘴通道的相应液体流指向IC晶片表面上的各个点处的速度矢量，其中 相应的液体流撞击IC晶片的表面。 例如，喷嘴通道相对于IC晶片的表面的相应角度可以是45°。 当IC晶片旋转时液体流向IC晶片上的速度矢量的倾斜在液体流撞击IC晶片时减少了反溅射。 此外，液体流可以以相对低的压力施加到IC晶片的表面上。 因此，本发明的喷嘴将液体分配到IC晶片的表面上，具有最小化的反溅射，以减少制造在IC晶片表面上的集成电路内的气泡缺陷。

公开(公告)号：US06418946B1

公开(公告)日：2002-07-16

申请号：US09756615

申请日：2001-01-05

申请人： Vincent L. Marinaro ,  Eric Kent ,  Ted Wakamiya

发明人： Vincent L. Marinaro ,  Eric Kent ,  Ted Wakamiya

IPC分类号： B08B302

CPC分类号： B05B15/55 ,  B05B14/00 ,  B05B15/555 ,  G03F7/162

摘要： An apparatus for cleaning dried photoresist from a photoresist dispensing nozzle. The tip of the photoresist dispensing nozzle is inserted through an opening in a nozzle base. A catch pan is positioned beneath the nozzle base. A solvent dispensing needle is inserted through an opening in the catch pan to face the photoresist dispensing nozzle tip and sprays solvent onto the photoresist dispensing nozzle tip. The catch pan collects the solvent and dissolved photoresist particles. The catch pan includes a drain for draining the solvent and the dissolved photoresist particles.

摘要翻译： 一种用于从光刻胶分配喷嘴清洁干燥的光致抗蚀剂的设备。 光刻胶分配喷嘴的尖端通过喷嘴基座中的开口插入。 捕集盘位于喷嘴底部下方。 溶剂分配针通过捕获盘中的开口插入以面对光刻胶分配喷嘴尖端并将溶剂喷射到光致抗蚀剂分配喷嘴尖端上。 捕集阱收集溶剂和溶解的光致抗蚀剂颗粒。 捕集盘包括用于排出溶剂和溶解的光致抗蚀剂颗粒的排水口。

公开(公告)号：US06170494B2

公开(公告)日：2001-01-09

申请号：US09510411

申请日：2000-02-22

申请人： Vincent L. Marinaro ,  Eric Kent ,  Ted Wakamiya

发明人： Vincent L. Marinaro ,  Eric Kent ,  Ted Wakamiya

IPC分类号： B08B302

CPC分类号： B05B15/55 ,  B05B14/00 ,  B05B15/555 ,  G03F7/162

摘要： A storage apparatus for photoresist dispensing nozzles has solvent inlets positioned directly opposite the nozzles when the nozzles are in their home positions. Photoresist cleaning solvent is introduced through these inlets at periodic intervals and directly applied on the nozzles to keep them clean.

摘要翻译： 用于光刻胶分配喷嘴的存储装置在喷嘴处于其原始位置时具有与喷嘴直接相对的溶剂入口。 光刻胶清洗溶剂通过这些入口以周期性间隔引入，并直接施加在喷嘴上以保持清洁。

公开(公告)号：US06318913B2

公开(公告)日：2001-11-20

申请号：US09829912

申请日：2001-04-11

申请人： Ted Wakamiya ,  Eric Kent ,  Vincent L. Marinaro

发明人： Ted Wakamiya ,  Eric Kent ,  Vincent L. Marinaro

IPC分类号： G03D500

CPC分类号： H01L21/67109 ,  B05C5/001 ,  B05C11/08 ,  G03F7/3021

摘要： Embodiments of the invention comprise a new device and technique to realize an improved temperature control for a chemical photoresist developer utilizing a preexisting integrated single reservoir. This improvement is achieved by providing for a modified temperature control unit and procedure. The temperature control unit preferably comprises a plurality of heat exchanger conduits that are each supplied by an inlet manifold, and then exhausted via an outlet manifold. The temperature control unit preferably extends fully within the modified nozzle unit. By utilizing the improved temperature control unit, a first and second volumetric allocation of developer may be issued so that both may be dispensed within a relatively short period of time upon a photoresist layer surface in a temperature controlled state.

摘要翻译： 本发明的实施例包括一种新的装置和技术，以实现利用预先存在的集成单个储存器的化学光刻胶显影剂的改进的温度控制。 通过提供改进的温度控制单元和程序来实现这一改进。 温度控制单元优选地包括多个热交换器管道，每个热交换器管道由进口歧管提供，然后经由出口歧管排出。 温度控制单元优选在改进的喷嘴单元内完全延伸。 通过利用改进的温度控制单元，可以发出显影剂的第一和第二体积分配，使得两者可以在相对较短的时间内被分配在温度受控状态的光致抗蚀剂层表面上。

公开(公告)号：US06481277B1

公开(公告)日：2002-11-19

申请号：US09767619

申请日：2001-01-23

申请人： Ted Wakamiya ,  Gerry Peffer ,  Vincent L. Marinaro

发明人： Ted Wakamiya ,  Gerry Peffer ,  Vincent L. Marinaro

IPC分类号： G01F2330

CPC分类号： G01F23/02 ,  G01F23/64 ,  G01F23/76

摘要： An apparatus for indicating a fluid level in a reservoir includes a conduit for communication with a reservoir and including a sight glass. A buoyant primary float is provided within the conduit, and a stop is provided within the conduit for engaging the primary float to prevent travel of the primary float beyond an upper portion of the conduit. A buoyant secondary float in the conduit is moveable together with the primary float when the primary float is not engaged by the stop, and is moveable separately from the primary float when the primary float is engaged by the stop and a fluid level in the conduit exceeds the level of the stop such that a portion of the secondary float may travel separately within the upper portion of the conduit. The secondary float preferable includes an elongate portion that passes through an aperture in the primary float, and a buoyant upper portion that is located above the primary float and is larger than the aperture in the primary float. The secondary float also preferably includes a lower portion that is located below the primary float and is larger than the aperture in the primary float. The length of the elongate member between the upper and lower portions may be provided to correspond to a distance between a lower surface of the primary float when engaged by the stop, and a predetermined fluid level in the conduit such as the maximum fill level of the reservoir. The elongate member may also include markings calibrated to indicated a remaining fluid capacity of the reservoir relative to a predetermined capacity. A temperature control unit that includes a sight glass with the aforementioned primary and secondary floats is also disclosed.

摘要翻译： 用于指示储存器中的液位的装置包括用于与储存器连通并包括观察窗的导管。 在导管内提供浮力的主浮子，并且在导管内提供止动件用于接合主浮子，以防止主浮子超过导管的上部。 当主浮子不被止动件接合时，导管中的浮力二次浮子与主浮子一起可移动，并且当主浮子与止动件接合并且导管中的液位超过时可与主浮子分开运动 停止水平使得二次浮子的一部分可以在导管的上部分开地行进。 次级浮子优选包括穿过主浮子中的孔的细长部分和位于主浮子上方并且大于主浮子中的孔的浮力上部。 次级浮子还优选地包括位于主浮子下方并且大于主浮子中的孔的下部。 上部和下部之间的细长构件的长度可以设置成对应于主浮子的下表面与止动件接合时的距离以及导管中的预定液位，例如最大填充量 水库 细长构件还可以包括经校准以标示储存器相对于预定容量的剩余流体容量的标记。 还公开了一种温度控制单元，其包括具有上述一次和二次浮子的观察镜。

公开(公告)号：US06250822B1

公开(公告)日：2001-06-26

申请号：US09498196

申请日：2000-02-04

申请人： Ted Wakamiya ,  Eric Kent ,  Vincent L. Marinaro

发明人： Ted Wakamiya ,  Eric Kent ,  Vincent L. Marinaro

IPC分类号： G03D500

CPC分类号： H01L21/67109 ,  B05C5/001 ,  B05C11/08 ,  G03F7/3021

摘要： Embodiments of the invention comprise a new device and technique to realize an improved temperature control for a chemical photoresist developer utilizing a preexisting integrated single reservoir. This improvement is achieved by providing for a modified temperature control unit and procedure. The temperature control unit preferably comprises a plurality of heat exchanger conduits that are each supplied by an inlet manifold, and then exhausted via an outlet manifold. The temperature control unit preferably extends fully within the modified nozzle unit. By utilizing the improved temperature control unit, a first and second volumetric allocation of developer may be issued so that both may be dispensed within a relatively short period of time upon a photoresist layer surface in a temperature controlled state.