Calibration standard for high resolution electron microscopy
    1.
    发明授权
    Calibration standard for high resolution electron microscopy 失效
    高分辨率电子显微镜的校准标准

    公开(公告)号:US06750447B2

    公开(公告)日:2004-06-15

    申请号:US10122645

    申请日:2002-04-12

    IPC分类号: G12B1300

    摘要: A method and apparatus used to calibrate high-resolution electron microscopes where a single standard provides multiple samples, each having a different atomic structure, permits rapid accurate calibration of the entire range of magnifications. The different atomic structure dimensions possess known reference measurement data. The S/TEM is adjusted to focus onto the crystal lattice structure of each sample in a selected sequence. Measurements of these lattice spacings are compared to known dimensions. If S/TEM measurements do not agree with the lattice spacing dimensions, the S/TEM magnification is adjusted to reflect known dimensions. Typical standard exchange and associated processing steps are eliminated by the use of the single standard comprising of a plurality of samples.

    摘要翻译: 用于校准高分辨率电子显微镜的方法和装置,其中单个标准提供多个样品,每个样品具有不同的原子结构,允许快速精确校准整个放大倍数。 不同的原子结构尺寸具有已知的参考测量数据。 调整S / TEM以选择的顺序聚焦到每个样品的晶格结构上。 将这些晶格间距的测量与已知尺寸进行比较。 如果S / TEM测量与晶格间距尺寸不一致,则调整S / TEM放大倍率以反映已知尺寸。 通过使用包含多个样品的单一标准来消除典型的标准交换和相关处理步骤。

    Monitoring system for determining progress in a fabrication activity
    2.
    发明授权
    Monitoring system for determining progress in a fabrication activity 有权
    用于确定制造活动进展的监测系统

    公开(公告)号:US06569690B1

    公开(公告)日:2003-05-27

    申请号:US09653364

    申请日:2000-08-31

    IPC分类号: H01L2100

    摘要: Method for fabricating a structure. According to an exemplary embodiment, a structure is made by forming a layer of removable material with a first surface spaced a part from a second surface. The first surface is formed along a first region from which the material is removable. The first surface is altered by removal of material from the layer. Removed material from the first surface is monitored to detect fluctuations in a variable of composition in the layer, and removal of material from the first surface is terminated when the composition of monitored material meets a predetermined criterion. In an alternate embodiment a variable characteristic is imparted to a layer of material as a function of layer thickness and an operation is performed on the layer resulting in removal of material. Samples of removed material are monitored for variation in the characteristic and the operation is modified when a variation conforms with a criterion.

    摘要翻译: 制造结构的方法。 根据示例性实施例,通过形成具有与第二表面间隔一部分的第一表面的可移除材料层来制造结构。 第一表面沿着第一区域形成,材料可从该第一区域移除。 通过从层中去除材料来改变第一表面。 监测来自第一表面的去除材料以检测该层中组成变量的波动,并且当所监测材料的组成符合预定标准时,从第一表面去除材料终止。 在替代实施例中,可变特性被赋予作为层厚度的函数的材料层,并且在层上进行操作,导致材料的去除。 监测去除材料的样品的特性变化,并且当变化符合标准时修改操作。

    Abnormal photoresist line/space profile detection through signal processing of metrology waveform
    4.
    发明授权
    Abnormal photoresist line/space profile detection through signal processing of metrology waveform 有权
    通过信号处理计量波形的异常光刻胶线/空间轮廓检测

    公开(公告)号:US06708574B2

    公开(公告)日:2004-03-23

    申请号:US10156242

    申请日:2002-05-24

    IPC分类号: G01M1900

    摘要: A semiconductor manufacturing automation method for analyzing a patterned feature formed on a semiconductor layer is disclosed. At least one patterned feature is scanned to generate an amplitude modulated waveform signal of the line and neighboring space characteristics. Signal processing is automatically performed on this waveform by an in-line computational source to extract known patterned features based on the profile of the amplitude modulated waveform signal. The extracted waveform segments are subjected to known geometric shapes to determine if the waveform indicates a normal or abnormal patterned feature on a semiconductor layer.

    摘要翻译: 公开了一种用于分析形成在半导体层上的图案特征的半导体制造自动化方法。 扫描至少一个图案化特征以产生线和相邻空间特征的幅度调制波形信号。 通过在线计算源自动对该波形执行信号处理,以基于幅度调制波形信号的轮廓来提取已知的图案特征。 提取的波形段经历已知的几何形状以确定波形是否指示半导体层上的正常或异常图案化特征。

    X-ray system
    5.
    发明授权
    X-ray system 有权
    X光系统

    公开(公告)号:US06606371B2

    公开(公告)日:2003-08-12

    申请号:US09745236

    申请日:2000-12-19

    IPC分类号: G21K106

    摘要: A reflective lens with at least one curved surface formed of polycrystalline material. In one embodiment, a lens structure includes a substrate having a surface of predetermined curvature and a film formed along a surface of the substrate with multiple individual members each having at least one similar orientation relative to the portion of the substrate surface adjacent the member such that collectively the members provide predictable angles for diffraction of x-rays generated from a common source. A system is also provided for performing an operation with x-rays. In one embodiment, a system includes a source for generating the x-rays, a polycrystalline surface region having crystal spacing suitable for reflecting a plurality of x-rays at the same Bragg angle along the region, and transmitting the reflected x-rays to a reference position. An associated method includes providing x-rays to polycrystalline surface region having crystal spacings suitable for reflecting a plurality of x-rays at the same Bragg angle along the region, transmitting the reflected x-rays to a reference position and positioning a sample between the surface region and the reference position so that the x-rays are transmitted through the sample.

    摘要翻译: 具有由多晶材料形成的至少一个曲面的反射透镜。 在一个实施例中,透镜结构包括具有预定曲率的表面的基底和沿着基底的表面形成的膜,多个单独的构件各自具有相对于邻近构件的基底表面的部分的至少一个相似的取向,使得 共同地,这些构件为从公共源产生的x射线的衍射提供可预测的角度。 还提供了一种用于使用X射线进行操作的系统。 在一个实施例中,系统包括用于产生x射线的源,具有适合于沿着该区域以相同的布拉格角反射多个x射线的晶体间距的多晶表面区域,以及将反射的x射线透射到 参考位置。 相关联的方法包括向具有晶体间距的多晶表面区域提供x射线,该晶体间距适于沿着该区域以相同的布拉格角反射多个x射线,将反射的x射线透射到参考位置,并将样品定位在表面 区域和参考位置,使得x射线透射通过样品。

    Probe for scanning probe microscopy and related methods
    6.
    发明授权
    Probe for scanning probe microscopy and related methods 有权
    扫描探针显微镜和相关方法的探针

    公开(公告)号:US06405584B1

    公开(公告)日:2002-06-18

    申请号:US09412130

    申请日:1999-10-05

    IPC分类号: G01B528

    摘要: A scanning probe microscope includes a sensor head adjacent a stage for holding a sample, a scanning actuator for positioning the sensor head relative to the sample, and a probe carried by the sensor head. The probe preferably includes a base connected to the sensor head, a shank extending from the base at an angle offset from perpendicular to the base, and a tip connected to a distal end of the shank for contacting the sample. The angle is preferably in a range of 5 to 20°. The tip is preferably laterally offset from the base to permit viewing of the tip without interference from the shank and the base. Thus, the location of the probe tip relative to the sample may be more easily determined.

    摘要翻译: 扫描探针显微镜包括与用于保持样品的台相邻的传感器头,用于相对于样品定位传感器头的扫描致动器和由传感器头承载的探针。 探针优选地包括连接到传感器头的基座,从基部延伸的角度与垂直于基部的角度偏离的杆,以及连接到柄的远端以用于接触样本的尖端。 该角度优选在5〜20°的范围内。 顶端优选地从基部侧向偏移以允许观察尖端而不受到柄和基部的干扰。 因此,可以更容易地确定探针尖端相对于样品的位置。

    Modular semiconductor substrates
    7.
    发明授权
    Modular semiconductor substrates 有权
    模块化半导体衬底

    公开(公告)号:US06534851B1

    公开(公告)日:2003-03-18

    申请号:US09642376

    申请日:2000-08-21

    IPC分类号: H01L2306

    摘要: A modular substrate-based processing scheme for producing semiconductor devices provides multiple modular processing units which may be arranged together to form any of various cohesive processing units or they may be individually or sequentially processed through standard semiconductor processing equipment. The cohesive processing units are processed unitarily providing for multiple modular processing units to be processed simultaneously. The modular processing units may be formed of a thick semiconductor substrate or a semiconductor substrate mounted on a further substrate such as a ceramic material. The modular processing units may each contain ribs, grooves, posts or other features to aid in handling and placement of the individual units.

    摘要翻译: 用于制造半导体器件的基于模块化基板的处理方案提供多个模块化处理单元,其可以被布置在一起以形成各种内聚处理单元中的任何一个,或者可以通过标准半导体处理设备单独或顺序地处理。 整体处理单元被一体处理,提供要同时处理的多个模块化处理单元。 模块化处理单元可以由安装在诸如陶瓷材料的另外的基板上的厚半导体衬底或半导体衬底形成。 模块化处理单元可以各自包含肋,槽,柱或其他特征以帮助处理和放置各个单元。

    Semiconductor manufacturing using modular substrates
    8.
    发明授权
    Semiconductor manufacturing using modular substrates 有权
    使用模块化基板的半导体制造

    公开(公告)号:US06713409B2

    公开(公告)日:2004-03-30

    申请号:US10303280

    申请日:2002-11-25

    IPC分类号: H01L2100

    摘要: A manufacturing method using a modular substrate-based processing scheme for producing semiconductor devices, provides multiple modular processing units which may be arranged together to form any of various cohesive processing units or individually or sequentially processed through standard semiconductor processing equipment. The cohesive processing units are processed unitarily providing for multiple modular processing units to be processed simultaneously. The modular processing units may be formed of a thick semiconductor substrate or a semiconductor substrate mounted on a further substrate such as a ceramic material. The modular processing units may each contain ribs, grooves, posts or other features to aid in handling and placement of the individual units.

    摘要翻译: 使用基于模块化的基于基板的处理方法来制造半导体器件的制造方法提供了多个模块化处理单元,其可以被布置在一起以形成任何各种内聚处理单元,或者通过标准半导体处理设备单独地或顺序地处理。 整体处理单元被一体处理,提供要同时处理的多个模块化处理单元。 模块化处理单元可以由安装在诸如陶瓷材料的另外的基板上的厚半导体衬底或半导体衬底形成。 模块化处理单元可以各自包含肋,槽,柱或其他特征以帮助处理和放置各个单元。

    Method and apparatus for minimizing semiconductor wafer contamination
    9.
    发明授权
    Method and apparatus for minimizing semiconductor wafer contamination 有权
    用于最小化半导体晶片污染的方法和设备

    公开(公告)号:US06695572B2

    公开(公告)日:2004-02-24

    申请号:US09966156

    申请日:2001-09-28

    IPC分类号: B65G4907

    CPC分类号: H01L21/6732

    摘要: A method and apparatus for minimizing the surface contamination of semiconductor wafers (11) during the semiconductor device manufacturing process. Semiconductor wafers (11) are stored in a storage cassette (12) with their face sides (17) facing downward and their back sides (16) facing upward. Particulate contamination present on the back sides of the wafers is thereby secured to the wafers by the force of gravity, and the faces of the wafers are shielded from falling debris. An automated wafer handling device (19) is provided with a rotary joint (22) to accomplish the wafer flipping motion before inserting a wafer into a cassette and after removing the wafer from the cassette.

    摘要翻译: 一种在半导体器件制造过程中最小化半导体晶片(11)的表面污染的方法和装置。 半导体晶片(11)被储存在存储盒(12)中,其表面(17)面向下并且它们的背面(16)面向上。 因此,通过重力将晶片的背面存在的颗粒污染物固定在晶片上,并且晶片的表面被遮蔽而不会掉落。 自动晶片处理装置(19)设置有旋转接头(22),以在将晶片插入盒内并在从盒中取出晶片之后实现晶片翻转运动。

    Three dimensional reconstruction metrology
    10.
    发明授权
    Three dimensional reconstruction metrology 有权
    三维重建计量学

    公开(公告)号:US06714892B2

    公开(公告)日:2004-03-30

    申请号:US09967119

    申请日:2001-09-28

    IPC分类号: G06F1500

    摘要: A system and method of metrology (10) whereby a three dimensional shape profile is defined (16) for a surface feature on a substrate by applying (38) a transform function F(x) to an image intensity map I(x,y) obtained (40) by inspecting the substrate with a scanning electron microscope (12). The transform function F(x) is developed (34) by correlating the image intensity map of a first wafer (18) to a height vector (32) obtained by inspecting the first wafer with a more accurate metrology tool, for example a stylus nanoprofilometer (14). A simple ratio-based transform may be used to develop F(x). An asymmetric multiple parameter characterization of the three dimensional shape profile may be developed (74) by plotting critical space and width dimensions (SL, SR, W1, WR) from a vertical axis (C—C) as a function of height of the feature.

    摘要翻译: 一种计量系统和方法(10),其中通过将变换函数F(x)应用于图像强度图I(x,y)(38)来定义(16)用于衬底上的表面特征的三维形状轮廓, 通过用扫描电子显微镜(12)检查基板得到(40)。 通过将第一晶片(18)的图像强度图与通过用更精确的计量工具检查第一晶片获得的高度矢量(32)相关联来开发变换函数F(x),例如,触笔纳米玻璃体计 (14)。 可以使用简单的基于比例的变换来开发F(x)。 可以通过从垂直轴(C-C)绘制关键空间和宽度尺寸(SL,SR,W1,WR)作为特征的高度的函数来开发三维形状轮廓的不对称多参数表征(74)。