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    LOW-COST, HIGH-PERFORMANCE ULTRASOUND IMAGING PROBE
    3.
    发明公开
    LOW-COST, HIGH-PERFORMANCE ULTRASOUND IMAGING PROBE 审中-公开

    公开(公告)号：US20230204742A1

    公开(公告)日：2023-06-29

    申请号：US18091288

    申请日：2022-12-29

    申请人： Exo Imaging, Inc.

    发明人： Yusuf HAQUE ,  Janusz BRYZEK

    IPC分类号： G01S7/52 ,  A61B8/00 ,  A61B8/08 ,  H04N19/10

    CPC分类号： G01S7/52034 ,  G01S7/52085 ,  A61B8/56 ,  A61B8/4488 ,  A61B8/5207 ,  A61B8/483 ,  H04N19/10

    摘要： An ultrasonic imaging system can include an ultrasound imaging probe, a computing device, and a link for communicatively coupling the computing device and the ultrasound imaging probe. The probe can include an ultrasonic transducer and preprocessing circuitry. The ultrasonic transducer can produce an electrical signal from an ultrasonic pressure wave and have a transducer element. The preprocessing circuitry can be electrically coupled to the ultrasonic transducer and have a signal converter and a signal integrator. The signal converter can condition a signal from the transducer element and convert the signal to a digital signal. The signal integrator can combine the digital signal into a transmission signal with at least a 10 Gigabit per second data rate. The signal can then be transmitted for processing by the computing device.

    MULTI-TRANSDUCER CHIP ULTRASOUND DEVICE
    7.
    发明申请
    MULTI-TRANSDUCER CHIP ULTRASOUND DEVICE 有权

    公开(公告)号：US20230125688A1

    公开(公告)日：2023-04-27

    申请号：US17511245

    申请日：2021-10-26

    申请人： Exo Imaging, Inc.

    发明人： Liang WANG ,  Yusuf HAQUE ,  Janusz BRYZEK

    IPC分类号： G01S7/52 ,  G01S15/89 ,  B81B7/00

    摘要： An ultrasound device for use with various types of imaging. In some embodiments, the ultrasound device may comprise a circuitry substrate and a plurality of transducer chips coupled to the circuitry substrate. In some embodiments, each transducer chip may comprise a microelectromechanical systems (MEMS) component that may include a plurality of ultrasound elements closely packed with one another, an Application-Specific Integrated Circuit (ASIC) that may be operatively coupled to the plurality of ultrasound elements of said MEMS component, and a control unit that may be electrically coupled to each ASIC of the plurality of transducer chips for control thereof. In some embodiments, at least two transducer chips of the plurality of transducer chips may be placed on the circuitry substrate with a separation distance that may be less than an operational wavelength of the ultrasound elements of the MEMS components of said at least two transducer chips.