公开(公告)号：US11972923B2

公开(公告)日：2024-04-30

申请号：US17566904

申请日：2021-12-31

Applicant: FEI Company

Inventor： Christopher Thompson ,  Dustin Ellis ,  Adam Stokes ,  Ronald Kelley ,  Cedric Bouchet-Marquis

IPC: H01J37/305 ,  H01J37/20 ,  H01J37/244 ,  H01J37/28

CPC classification number: H01J37/3056 ,  H01J37/20 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/2007 ,  H01J2237/208 ,  H01J2237/31745 ,  H01J2237/31749

Abstract: Methods and systems for creating attachments between a sample manipulator and a sample within a charged particle systems are disclosed herein. Methods include translating a sample manipulator so that it is proximate to a sample, and milling portions of the sample manipulator such that portions are removed. The portion of the sample manipulator proximate to the sample is composed of a high sputter yield material, and the high sputter yield material may be the material milled with the charged particle beam such that it is removed from the sample manipulator. According to the present disclosure, the portions of the sample manipulator are milled such that at least some of the removed high sputter yield material redeposits to form an attachment between the sample manipulator and the sample.

公开(公告)号：US12165832B2

公开(公告)日：2024-12-10

申请号：US17566894

申请日：2021-12-31

Applicant: FEI Company

Inventor： Adam Stokes ,  Cliff Bugge ,  Brandon Van Leer ,  Valerie Brogden ,  Chengge Jiao ,  Letian Li ,  David Donnet

IPC: H01J37/20 ,  H01J37/244 ,  H01J37/28

Abstract: Methods and systems for performing sample lift-out and protective cap placement for highly reactive materials within charged particle microscopy systems are disclosed herein. Methods include preparing a nesting void in a support structure, translating at least a portion of a sample into the nesting void, and milling material from a region of the support structure that defines the nesting void. The material from the region of the support structure is milled such that at least some of the removed material redeposits to form an attachment bond between the sample and a remaining portion of the support structure. In various embodiments, the sample can then be investigated using one or more of serial sectioning tomography on the sample, enhanced insertable backscatter detector (CBS) analysis on the sample, and electron backscatter diffraction (EBSD) analysis on the sample.