公开(公告)号：US20240188216A1

公开(公告)日：2024-06-06

申请号：US18285910

申请日：2022-02-14

申请人： FICT LIMITED

发明人： Kenji Iida ,  Norikazu Ozaki ,  Taiji Sakai ,  Takashi Nakagawa ,  Kenji Takano

IPC分类号： H05K1/11 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K1/116 ,  H05K3/382 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/09509 ,  H05K2201/096

摘要： The present invention addresses the problem of providing a circuit board for which the manufacturing process is short and which has a laminate surface having uniform flatness. As a solution to the problem, this method for manufacturing a circuit board includes: manufacturing a three-layer metal (58) having, on one surface thereof, a first metal layer (26) formed in a pattern shape; manufacturing unit structures (60) each having the first metal layer (26), a cured first insulating base material (22) filled with a cured first conductive paste (32), a second metal layer (28), and a semi-cured second insulating base material (24) filled with a semi-cured second conductive paste (36); joining together the first insulating base material (22) in one unit structure (60) among a plurality of the unit structures with the second insulating base material (24) in another unit structure (60); and layering the plurality of unit structures (60).

公开(公告)号：US20240147613A1

公开(公告)日：2024-05-02

申请号：US18288418

申请日：2022-04-14

申请人： FICT LIMITED

发明人： Takashi Nakagawa ,  Norikazu Ozaki ,  Taiji Sakai ,  Kenji Takano ,  Kenji Iida

IPC分类号： H05K1/02 ,  H05K3/46

CPC分类号： H05K1/0298 ,  H05K3/4617 ,  H05K2201/2036

摘要： The present invention addresses the problem that, when applying pressure and heat to laminate substrates, to maintain the flatness of the substrates so as not to have the load concentrated in one part, and to prevent the occurrence of resistance value abnormalities by making the electrically conductive layers between terminal parts uniform over the entire substrate. As a solution, the present invention comprises: a first substrate (A); a first terminal part (28) formed on a first surface (1A) of the first substrate (A); a second substrate (B) positioned facing the first surface (1A) of the first substrate (A); a second terminal part (38) formed on a first surface (1B) that faces the first terminal part (28) in the second substrate (B); a restricting member (50) interposed between the first substrate (A) and the second substrate (B), the restricting member (50) restricting the gap between the first substrate (A) and the second substrate (B) and having formed therein a through hole (51) that communicates between the first terminal part (28) and the second terminal part (38); and an electrically conductive paste (46) that is positioned inside the through hole (51), and that electrically connects the first terminal part (28) and the second terminal part (38).

公开(公告)号：US20240064907A1

公开(公告)日：2024-02-22

申请号：US18271754

申请日：2022-02-22

申请人： FICT LIMITED

发明人： Taiji Sakai ,  Kenji Iida ,  Norikazu Ozaki ,  Kenji Takano ,  Takashi Nakagawa ,  Takayuki Inaba ,  Tetsuro Miyagawa ,  Akira Yajima ,  Shin Hirano ,  Kota Aoi ,  Yoichi Abe ,  Mio Emura

IPC分类号： H05K1/18 ,  H05K1/02 ,  H05K3/46

CPC分类号： H05K1/185 ,  H05K1/0201 ,  H05K1/0274 ,  H05K3/4644 ,  H05K2201/10121 ,  H05K2201/0175 ,  H05K2201/062 ,  H05K2201/10984 ,  H05K2201/0129 ,  H05K2201/09545 ,  H05K2201/096

摘要： An object is to provide a circuit board that includes a built-in semiconductor device and has a configuration that prevents cracking and has excellent reliability in operation over a wide temperature range. As a solution, a circuit board (10A) has a configuration in which a first insulating substrate (1) is laminated on a second insulating substrate (2) while interposing a first adhesive layer (7a), and a semiconductor device (9) is embedded in an embedment portion (1c) formed in the first insulating substrate (1).

公开(公告)号：US20230180398A1

公开(公告)日：2023-06-08

申请号：US17924273

申请日：2021-03-01

申请人： FICT LIMITED

发明人： Kenji Iida ,  Norikazu Ozaki ,  Taiji Sakai ,  Takashi Nakagawa ,  Kenji Takano ,  Takayuki Inaba ,  Akira Yajima ,  Shin Hirano ,  Kota Aoi ,  Tetsuro Miyagawa

IPC分类号： H05K3/46

CPC分类号： H05K3/4614 ,  H05K3/4635

摘要： A circuit board includes a plurality of first insulating base materials and a plurality of second insulating base materials that are alternately laminated, a first metal layer being formed into a pattern shape on a first surface of the first insulating base material, and a second metal layer being formed into a pattern shape on a second surface of the first insulating base material. The first metal layer is formed into a trapezoidal shape that is large in diameter on a first surface side of the first insulating base material. The second metal layer is formed into a trapezoidal shape that is large in diameter on a second surface side of the first insulating base material. The first metal layers and the second metal layers are laminated in such a manner that the trapezoidal shapes are alternately oriented.