公开(公告)号：US20160334896A1

公开(公告)日：2016-11-17

申请号：US15218518

申请日：2016-07-25

Applicant: FUJIFILM Corporation

Inventor： Takashi KOIKE ,  Hiroyuki KOBAYASHI ,  Tetsuji NISHIDA ,  Hisashi TSUBATA

IPC: G06F3/041 ,  B32B27/36 ,  B32B7/02 ,  B32B7/12 ,  B32B27/08

CPC classification number: G06F3/041 ,  B32B7/02 ,  B32B7/12 ,  B32B15/02 ,  B32B15/082 ,  B32B15/085 ,  B32B15/088 ,  B32B15/09 ,  B32B21/00 ,  B32B27/08 ,  B32B27/306 ,  B32B27/325 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/202 ,  B32B2307/30 ,  B32B2307/412 ,  B32B2457/208 ,  B32B2571/00 ,  B32B2603/00 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04112

Abstract: A multilayer structure has a laminate including a transparent conductive member having a conductive pattern having a mesh structure composed of thin metal wires on a transparent substrate having flexibility, a protective member for protecting the transparent conductive member, and an optically transparent adhesive layer disposed between the transparent conductive member and the protective member. The thickness of the laminate is 100 μm or more and 600 μm or less. The thickness of the adhesive layer is 20% or more of the thickness of the laminate. The thermal shrinkage of the transparent conductive member at 150° C. is 0.5% or less, and a difference between the thermal shrinkage of the transparent conductive member and the thermal shrinkage of the protective member at 150° C. is within 60% of the thermal shrinkage of the transparent conductive member at 150° C. The multilayer structure is used for a touch panel module having a three-dimensional shape.

Abstract translation: 多层结构具有层压体，其具有透明导电部件，该透明导电部件具有导电图案，该导电图案具有由具有挠性的透明基板上的细金属线构成的网状结构，保护透明导电部件的保护部件， 透明导电部件和保护部件。 层压体的厚度为100μm以上且600μm以下。 粘合剂层的厚度为层压体厚度的20％以上。 透明导电部件在150℃下的热收缩率为0.5％以下，透明导电部件的热收缩率与保护部件在150℃下的热收缩率之差在60℃以下 透明导电部件在150℃下的热收缩率。多层结构用于具有三维形状的触摸面板模块。

公开(公告)号：US20170139516A1

公开(公告)日：2017-05-18

申请号：US15417394

申请日：2017-01-27

Applicant: FUJIFILM Corporation

Inventor： Takashi KOIKE ,  Hisashi TSUBATA ,  Takayoshi KUWABARA ,  Minoru ARAKI

IPC: G06F3/041 ,  B32B7/12 ,  B32B5/02 ,  G06F3/044

CPC classification number: G06F3/0412 ,  B32B1/00 ,  B32B5/028 ,  B32B7/12 ,  B32B23/08 ,  B32B23/20 ,  B32B27/08 ,  B32B27/281 ,  B32B27/30 ,  B32B27/302 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/325 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2250/03 ,  B32B2250/24 ,  B32B2250/244 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2255/205 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2457/208 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04112

Abstract: A laminate structure includes a laminate which has a three-dimensional shape and is provided with a transparent conductive member having a plurality of conductive layers constituted of fine metal wires on a flexible transparent substrate, a wiring formed on the transparent substrate and electrically connected to each conductive layer, a protective member having an optically transparent region and protecting the transparent conductive member, and an optically transparent adhesive layer positioned between the transparent conductive member and the protective member. The laminate has at least a planar portion and a bent portion formed continuously to the planar portion. The wiring is routed to the bent portion and is connected to a flexible wiring member at the tip of the bent portion.