公开(公告)号：US20150197663A1

公开(公告)日：2015-07-16

申请号：US14669327

申请日：2015-03-26

Applicant: FUJIFILM Corporation

Inventor： Kazuyoshi MIZUTANI ,  Tsukasa YAMANAKA

IPC: C09D153/00 ,  B05D3/02 ,  B05D3/10 ,  B05D1/00

CPC classification number: C09D153/00 ,  B05D1/005 ,  B05D3/0254 ,  B05D3/107 ,  B82Y40/00 ,  C08F293/00 ,  C08L53/00 ,  G03F7/0002 ,  Y10T428/24479

Abstract: There is provided a pattern forming method through self-organization of a block copolymer, containing an annealing step after application of a self-organizing composition for forming pattern that contains a block copolymer containing a block having a repeating unit represented by the specific general formula, and contains an organic solvent, to a substrate, and wherein after a microphase-separated structure is formed in the annealing step, one domain thereof is selectively removed to form a pattern.

Abstract translation: 通过嵌段共聚物的自组织提供图形形成方法，该嵌段共聚物在施加含有含有具有由具体通式表示的重复单元的嵌段的嵌段共聚物的形成图案的自组织组合物之后的退火步骤， 并含有有机溶剂，并且其中在退火步骤中形成微相分离结构之后，选择性地除去其一个区域以形成图案。

公开(公告)号：US20220283499A1

公开(公告)日：2022-09-08

申请号：US17748500

申请日：2022-05-19

Applicant: FUJIFILM Corporation

Inventor： Takeshi KAWABATA ,  Kei YAMAMOTO ,  Kazuyoshi MIZUTANI

IPC: G03F7/038 ,  G03F7/004 ,  G03F7/32 ,  G03F7/20

Abstract: The present invention provides a composition for forming an underlayer film, with which an underlayer film having excellent surface flatness and solvent resistance can be formed. In addition, the present invention provides a resist pattern forming method and a manufacturing method of an electronic device, which are related to the composition for forming an underlayer film. The composition for forming an underlayer film according to the present invention is a composition for forming an underlayer film, which is used for forming an underlayer film under a resist film, including a monomer or a polymer containing an aromatic ring and a halogen-based organic solvent, in which a content of the halogen-based organic solvent is 0.001 to 50 ppm by mass with respect to a total mass of the composition for forming an underlayer film.

公开(公告)号：US20160240816A1

公开(公告)日：2016-08-18

申请号：US15139989

申请日：2016-04-27

Applicant: FUJIFILM Corporation

Inventor： Kazuyoshi MIZUTANI ,  Yu IWAI ,  Ichiro KOYAMA ,  Yoshitaka KAMOCHI

IPC: H01L51/52 ,  G03F7/11 ,  G03F7/004 ,  G03F7/039 ,  H01L51/42 ,  B32B27/08

CPC classification number: H01L51/5253 ,  B32B27/08 ,  B32B2307/4026 ,  B32B2307/54 ,  B32B2457/00 ,  B32B2457/14 ,  G03F7/0045 ,  G03F7/038 ,  G03F7/0382 ,  G03F7/039 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/11 ,  G03F7/325 ,  H01L51/4253 ,  H01L51/448 ,  Y02E10/549 ,  Y02P70/521

Abstract: Provided are a laminate which is capable of forming an excellent organic semiconductor pattern, a kit for manufacturing an organic semiconductor, which is used to manufacture such a laminate, and a resist composition for manufacturing an organic semiconductor, which is used for the kit for manufacturing an organic semiconductor.The laminate includes an organic semiconductor film, a protective film on the organic semiconductor film, and a resist film on the protective film, in which the resist film is formed of a photosensitive resin composition that contains a photoacid generator (A) which generates an organic acid of which a pKa of the generated acid is −1 or less and a resin (B) which reacts with an acid generated by the photoacid generator so that the rate of dissolution in a developer containing an organic solvent is decreased.

Abstract translation: 提供能够形成优异的有机半导体图案的层压体，用于制造这种层压体的用于制造有机半导体的套件以及用于制造用于制造的套件的有机半导体用抗蚀剂组合物 有机半导体。 层压体包括有机半导体膜，有机半导体膜上的保护膜和保护膜上的抗蚀剂膜，其中抗蚀剂膜由包含产生有机物的光致酸产生剂（A）的光敏树脂组合物形成， 产生酸的pKa为-1以下的酸和与光产酸剂生成的酸反应的树脂（B），使得含有有机溶剂的显影剂的溶解率降低。