公开(公告)号：US20190085207A1

公开(公告)日：2019-03-21

申请号：US16085312

申请日：2017-03-10

Applicant: FUJIMI INCORPORATED

Inventor： Shogo ONISHI ,  Takeki SATO

IPC: C09G1/02 ,  H01L21/321 ,  H01L21/768

Abstract: The present invention provides a polishing composition for an object to be polished having a metal-containing layer, by which sufficient flattening can be achieved. The present invention is a polishing composition used for polishing an object to be polished having a metal-containing layer, the polishing composition including: abrasive grains; an acid; an oxidizer; and a dispersing medium, wherein an acid dissociation constant (pKa) of the acid is higher than a pH of the composition.

公开(公告)号：US20180057711A1

公开(公告)日：2018-03-01

申请号：US15562692

申请日：2016-03-11

Applicant: FUJIMI INCORPORATED

Inventor： Shogo ONISHI ,  Takeki SATO ,  Yukinobu YOSHIZAKI ,  Koichi SAKABE

IPC: C09G1/02 ,  B24B37/04 ,  H01L21/3105

CPC classification number: C09G1/02 ,  B24B37/044 ,  C09K3/1463 ,  H01L21/31053

Abstract: An object of the present invention is to provide a polishing composition which can sufficiently improve a polishing speed of an object to be polished having a silicon-oxygen bond such as a silicon oxide film or a polishing speed of an object to be polished having a silicon-nitrogen bond such as a silicon nitride film.Providing a polishing composition including: (1) an organic compound which has an action site interacting with an object to be polished having a silicon-oxygen bond or a silicon-nitrogen bond and an acceleration site accelerating an access of a component polishing an object to be polished to the object to be polished; (2) abrasive grains; and (3) a dispersing medium.

公开(公告)号：US20170292039A1

公开(公告)日：2017-10-12

申请号：US15514172

申请日：2015-07-27

Applicant: FUJIMI INCORPORATED

Inventor： Takeki SATO ,  Koichi SAKABE

IPC: C09G1/02 ,  B24B37/04 ,  H01L21/321

CPC classification number: C09G1/02 ,  B24B37/044 ,  C09K3/1436 ,  H01L21/31053 ,  H01L21/3212

Abstract: There is provided a polishing composition capable of polishing a polishing object including elemental silicon, a silicon compound, metals and the like, especially including tungsten, at a high polishing rate. The polishing composition includes: colloidal silica with organic acid immobilized to a surface thereof; hydrogen peroxide; and salt, the salt being at least one of ammonium nitrate and ammonium sulfate.