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公开(公告)号：US20170175053A1
公开(公告)日：2017-06-22
申请号：US15129326
申请日：2015-01-30
Applicant: FUJIMI INCORPORATED
Inventor： SHUUGO YOKOTA , Shota SUZUKI , Tomohiko AKATSUKA , Yasuyuki YAMATO , Koichi SAKABE , Yoshihiro IZAWA , Yukinobu YOSHIZAKI , Chiaki SAITO
CPC classification number: C11D7/22 , C09K3/1409 , C11D7/26 , C11D7/28 , C11D7/3209 , C23G5/028 , H01L21/02024 , H01L21/02041 , H01L21/31053 , H01L21/3212
Abstract: The purpose of the present invention is to provide a means to sufficiently remove impurities remaining on the surface of a polishing object after CMP.The polishing composition of the present invention is a polishing composition which is used after polishing has been performed by using a polishing composition (A) including abrasive grains or an organic compound (A), and is characterized by including an organic compound (B) which includes at least one atom selected from the group consisting of a fluorine atom, an oxygen atom, a nitrogen atom, and a chlorine atom and has a molecular weight of 100 or more, a pH adjusting agent, and 0 to 1% by mass of abrasive grains.
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公开(公告)号：US20190112505A1
公开(公告)日：2019-04-18
申请号：US16089935
申请日：2017-03-15
Applicant: FUJIMI INCORPORATED
Inventor： Yukinobu YOSHIZAKI , Koichi SAKABE , Yusuke KADOHASHI
IPC: C09G1/02 , B24B37/04 , H01L21/3105
Abstract: To provide a technology by which, on the occasion of polishing an object to be polished including: (a) material having silicon-nitrogen bonds; and (b) other material, the ratio of the polishing speed for the material (a) with respect to the polishing speed for the material (b) can be increased.The polishing composition of the present invention is a polishing composition used for polishing an object to be polished including: (a) material having silicon-nitrogen bonds; and (b) other material, the polishing composition including: an organic acid-immobilized silica; and a particular selection ratio improver for increasing the ratio of the polishing speed for the material (a) with respect to the polishing speed for the material (b).
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公开(公告)号：US20160293436A1
公开(公告)日：2016-10-06
申请号：US14442525
申请日：2013-10-25
Applicant: FUJIMI INCORPORATED
Inventor： Shuugo YOKOTA , Koichi SAKABE
IPC: H01L21/3105 , C09G1/02
CPC classification number: H01L21/31053 , C09G1/02 , C09K3/1436 , C09K3/1463
Abstract: Provided is a polishing composition which exhibits favorable storage stability and polishes a polishing object poor in chemical reactivity at a high speed.The invention is a polishing composition which contains silica having an organic acid immobilized on a surface thereof, a dihydric alcohol having a molecular weight of less than 20,000 and a pH adjusting agent, the polishing composition having a pH of 6 or less.
Abstract translation: 本发明是一种抛光组合物，其含有固定在其表面上的有机酸的二氧化硅，分子量小于20,000的二元醇和pH调节剂，该抛光组合物的pH为6以下。
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公开(公告)号：US20210130751A1
公开(公告)日：2021-05-06
申请号：US16492338
申请日：2018-01-23
Applicant: FUJIMI INCORPORATED
Inventor： Yukinobu YOSHIZAKI , Koichi SAKABE , Satoru YARITA , Kenichi KOMOTO
Abstract: The present invention provides a means by which it is possible to sufficiently suppress an organic residue while favorably decreasing a ceria residue on a polished object to be polished obtained after being polished using a polishing composition containing ceria.
The present invention relates to a composition for surface treatment, which is for a surface treatment of a polished object to be polished obtained after being polished using a polishing composition containing ceria, contains a carboxy group-containing (co)polymer having a structural unit derived from a monomer having a carboxy group or a salt group of the carboxy group, a SOx or NOy partial structure-containing compound having a partial structure represented by SOx or NOy (where x and y each independently denote a real number 1 to 5), and a dispersing medium, and has a pH of 1 or more and 8 or less.-
Patent Agency Ranking
公开(公告)号：US20190300821A1
公开(公告)日：2019-10-03
申请号：US16337241
申请日：2017-06-29
Applicant: FUJIMI INCORPORATED
Inventor： Yukinobu YOSHIZAKI , Koichi SAKABE , Satoru YARITA , Kenichi KOMOTO
Abstract: The present invention relates to a surface treatment composition including: at least one water-soluble polymer selected from the following Group A; at least one anionic surfactant selected from the following Group B; and water. Group A: water-soluble polysaccharides, polyvinyl alcohols and derivatives thereof, and polyvinylpyrrolidones and derivatives thereof (with the proviso that compounds included in the following Group B are excluded)Group B: compounds having a sulfonic acid (salt) group, compounds having a sulfuric acid ester (salt) group, compounds having a phosphonic acid (salt) group, compounds having a phosphoric acid (salt) group, and compounds having a phosphinic acid (salt) group. According to the present invention, a surface treatment composition capable of efficiently removing foreign bodies, such as particles and organic residues, remaining on the surface of an object to be polished after polishing is provided.
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公开(公告)号：US20210139739A1
公开(公告)日：2021-05-13
申请号：US16492835
申请日：2018-01-23
Applicant: FUJIMI INCORPORATED
Inventor： Yukinobu YOSHIZAKI , Koichi SAKABE , Satoru YARITA , Kenichi KOMOTO
IPC: C09G1/02
Abstract: The present invention provides a polishing composition with which it is possible to decrease a level difference to be unintentionally generated between dissimilar materials and a level difference to be unintentionally generated between coarse and dense portions of a pattern. The present invention relates to a polishing composition which contains abrasive grains having an average primary particle size of 5 to 50 nm, a level difference modifier containing a compound with a specific structure, having an aromatic ring and a sulfo group or a salt group thereof which is directly bonded to this aromatic ring, and a dispersing medium and of which the pH is less than 7.
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7.发明申请公开(公告)号：US20190093051A1
公开(公告)日：2019-03-28
申请号：US16132863
申请日：2018-09-17
Applicant: FUJIMI INCORPORATED
Inventor： Yukinobu YOSHIZAKI , Koichi SAKABE , Satoru YARITA , Kenichi KOMOTO
Abstract: A surface treatment composition according to the present invention is used for treating a surface of a polished object to be polished which is obtained after polishing with a polishing composition including ceria, using the surface treatment composition including a (co)polymer having a monomer-derived structural unit having a carboxyl group or a salt group thereof, a residue removing accelerator composed of a specific compound having a hydroxyl group, and a dispersing medium, wherein pH is less than 7.
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公开(公告)号：US20180057711A1
公开(公告)日：2018-03-01
申请号：US15562692
申请日：2016-03-11
Applicant: FUJIMI INCORPORATED
Inventor： Shogo ONISHI , Takeki SATO , Yukinobu YOSHIZAKI , Koichi SAKABE
IPC: C09G1/02 , B24B37/04 , H01L21/3105
CPC classification number: C09G1/02 , B24B37/044 , C09K3/1463 , H01L21/31053
Abstract: An object of the present invention is to provide a polishing composition which can sufficiently improve a polishing speed of an object to be polished having a silicon-oxygen bond such as a silicon oxide film or a polishing speed of an object to be polished having a silicon-nitrogen bond such as a silicon nitride film.Providing a polishing composition including: (1) an organic compound which has an action site interacting with an object to be polished having a silicon-oxygen bond or a silicon-nitrogen bond and an acceleration site accelerating an access of a component polishing an object to be polished to the object to be polished; (2) abrasive grains; and (3) a dispersing medium.
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公开(公告)号：US20170292039A1
公开(公告)日：2017-10-12
申请号：US15514172
申请日：2015-07-27
Applicant: FUJIMI INCORPORATED
Inventor： Takeki SATO , Koichi SAKABE
IPC: C09G1/02 , B24B37/04 , H01L21/321
CPC classification number: C09G1/02 , B24B37/044 , C09K3/1436 , H01L21/31053 , H01L21/3212
Abstract: There is provided a polishing composition capable of polishing a polishing object including elemental silicon, a silicon compound, metals and the like, especially including tungsten, at a high polishing rate. The polishing composition includes: colloidal silica with organic acid immobilized to a surface thereof; hydrogen peroxide; and salt, the salt being at least one of ammonium nitrate and ammonium sulfate.
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