公开(公告)号：US09505951B2

公开(公告)日：2016-11-29

申请号：US14440216

申请日：2013-09-30

Applicant: FUJIMI INCORPORATED

Inventor： Takahiro Umeda ,  Shogo Onishi ,  Takeshi Yoshikawa ,  Yoshihiro Kachi

IPC: C09K13/00 ,  C09G1/02 ,  H01L21/321 ,  C09K3/14 ,  H01L21/3105

CPC classification number: C09G1/02 ,  C09K3/1436 ,  C09K3/1463 ,  H01L21/31053 ,  H01L21/3212

Abstract: [Problem] Provided is a polishing composition that can sufficiently maintain a high polishing rate for a barrier layer and an insulating film and suppress the occurrence of a surface defect such as erosion or fang.[Solution] Provided is a polishing composition which is used in the application to polish a polishing object having a barrier layer, a metal wiring layer and an insulating film, the polishing composition including abrasive grains, an oxidant, a metal corrosion inhibitor, a pH adjusting agent and water, in which an aspect ratio of abrasive grains is 1.22 or less and a ratio D90/D10 of a diameter D90 of particles when a cumulative particle weight from the fine particle side reaches 90% of the total particle weight to a diameter D10 of particles when the cumulative particle weight from the fine particle side reaches 10% of the total particle weight of the entire particles is 1.5 or more in a particle size distribution of the abrasive grains determined by a laser diffraction scattering method.

Abstract translation: [解决方案]提供一种抛光组合物，其用于抛光具有阻挡层，金属布线层和绝缘膜的抛光对象的抛光组合物，所述抛光组合物包括磨粒，氧化剂，金属腐蚀抑制剂，pH 调整剂和水，其中当颗粒的一个颗粒的累积粒子数达到总颗粒重量的90％至直径的90％时，其中磨粒的纵横比为1.22或更小，颗粒直径D90的比D90 / D10 当通过激光衍射散射法确定的磨粒的粒度分布中，当微细颗粒侧的累积粒子重量达到整个颗粒的总颗粒重量的10％时颗粒的D10为1.5以上。